Abstract: In one example, a semiconductor device comprises a substrate, an optical device on a top side of the substrate, a translucent cover over the optical device, wherein the translucent cover is a unitary monolithic piece comprising a cover base and a cover pipe. and a cover structure on the top side of the substrate to support the translucent cover over the optical device. Some examples and related methods are also disclosed herein.

Abstract: In one example, a semiconductor device comprises a substrate, an optical device on a top side of the substrate, a translucent cover over the optical device, wherein the translucent cover is a unitary monolithic piece comprising a cover base and a cover pipe. and a cover structure on the top side of the substrate to support the translucent cover over the optical device. Some examples and related methods are also disclosed herein.

Abstract: A method and apparatus for relocation of a mobile robot is provided. The relocation method includes the steps of generating a fingerprint based on a previously built magnetic field map, and if the mobile robot is determined as being failed in localization, relocating a location of the mobile robot based on the generated location fingerprint. The step of generating the location fingerprint includes the step of generating the location fingerprint based on the magnetic field map and location measurement values for the mobile robot that are previously measured by a radio source.

Abstract: A method of localization and mapping of a mobile robot may reduce position errors in localization and mapping using a plurality of vector field sensors. The method includes acquiring a relative coordinate in a movement space using an encoder, acquiring an absolute coordinate in the movement space by detecting intensity and direction of a signal using vector field sensors, defining a plurality of virtual cells on a surface of the movement space such that each of the cells has a plurality of nodes having predetermined positions, and updating position information about the nodes of the cells based on the relative coordinate acquired through the encoder and the absolute coordinate acquired through the vector field sensors and implementing localization and mapping in the movement space in a manner that position information of a new node is estimated while position information of a previous node is determined.

Abstract: Methods and systems for a semiconductor package may comprise a package device comprising at least one semiconductor chip and an active element attached to a substrate and a window with sidewalls forming cavity regions for the package device and coupled to the substrate with an adhesive. An outer edge of the substrate may be flush with an outer surface of the window sidewalls. The window may be plastic and may include an EMI shielding layer, which may be a copper/nickel plating layer. The semiconductor chip may be a MEMS microphone device. The sidewalls and a top plate of the window may be at a right angle to each other. The package may be formed by severing it from an N×M array of package structures resulting in the outer edges being flush.

Abstract: Various aspects of the present invention, for example and without limitation, comprise a semiconductor device package and/or method for manufacturing a semiconductor device package. Such a device package may, for example, comprise a MEMS device package.

Abstract: A method of localization and mapping of a mobile robot may reduce position errors in localization and mapping using a plurality of vector field sensors. The method includes acquiring a relative coordinate in a movement space using an encoder, acquiring an absolute coordinate in the movement space by detecting intensity and direction of a signal using vector field sensors, defining a plurality of virtual cells on a surface of the movement space such that each of the cells has a plurality of nodes having predetermined positions, and updating position information about the nodes of the cells based on the relative coordinate acquired through the encoder and the absolute coordinate acquired through the vector field sensors and implementing localization and mapping in the movement space in a manner that position information of a new node is estimated while position information of a previous node is determined.

Abstract: Various aspects of the present invention, for example and without limitation, comprise a semiconductor device package and/or method for manufacturing a semiconductor device package. Such a device package may, for example, comprise a MEMS device package.

Abstract: An apparatus and method relocating a robot. The apparatus may include a particle generating unit, a first distance obtaining unit, a second distance obtaining unit, and a position estimating unit. A plurality of particles may be generated on a map, a first distance may be obtained according to respective distances between each particle of the plurality of particles and a wireless communication apparatus, based on a position of the wireless communication apparatus and respective positions of each particle on the map, a second distance may be obtained according to respective determined distances between the wireless communication apparatus and the robot, based on a strength measure of the electromagnetic signal received by the robot from the wireless communication apparatus or based on an arrival time or time of flight of the electromagnetic signal, and a position of the robot may be estimated by comparing the first distance and the second distance.

Abstract: An apparatus and method relocating a robot. The apparatus may include a particle generating unit, a first distance obtaining unit, a second distance obtaining unit, and a position estimating unit. A plurality of particles may be generated on a map, a first distance may be obtained according to respective distances between each particle of the plurality of particles and a wireless communication apparatus, based on a position of the wireless communication apparatus and respective positions of each particle on the map, a second distance may be obtained according to respective determined distances between the wireless communication apparatus and the robot, based on a strength measure of the electromagnetic signal received by the robot from the wireless communication apparatus or based on an arrival time or time of flight of the electromagnetic signal, and a position of the robot may be estimated by comparing the first distance and the second distance.

Abstract: Disclosed is a head assembly of a heat exchanger for a vehicle including heads each consisting of a plurality of head pieces coupled together in a laminated fashion, thereby being capable of achieving an easy manufacture thereof and a reduction in manufacturing costs while easily coping with a changed specification. The head assembly includes at least two heads spaced apart from each other, a plurality of tubes coupled between the heads in a laminated state and defined with fluid passages, respectively, and a plurality of centers each interposed between adjacent ones of the tubes and adapted to provide an improved heat exchange efficiency. Each of the heads includes at least two head pieces assembled together in a laminated state. A separator is interposed between the head pieces. Caps are coupled to opposite ends of the head pieces, respectively.