Abstract: A light emitting element may include a first semiconductor layer, an emission layer disposed on the first semiconductor layer, a second semiconductor layer disposed on the emission layer, an insulating film, and an electrode layer. The insulating film may enclose a side surface of the first semiconductor layer, a side surface of the emission layer, and a side surface of the second semiconductor layer. The electrode layer may be disposed on the second semiconductor layer and the insulating film. The insulating film may not enclose the electrode layer.

Abstract: A sense amplifier includes a pair of sense bit lines and first and second MOS sense amplifiers. The first MOS sense amplifier has a first pair of MOS transistors of first conductivity type therein, which are electrically coupled across the pair of sense bit lines. This electrically coupling is provided so that each of the first pair of MOS transistors has a first source/drain terminal electrically connected to a corresponding one of the pair of sense bit lines and the second source/drain terminals of the first pair of MOS transistors are electrically connected together. The first pair of MOS transistors of first conductivity type is configured to have different threshold voltages or support different threshold voltage biasing. The second MOS sense amplifier has a first pair of MOS transistors of second conductivity type therein, which are electrically coupled across the pair of sense bit lines.

Abstract: A semiconductor memory device includes a sub word line driver for selectively connecting one of sub word lines with a main word line and applying a boosted voltage having a level higher than a power source voltage to a selected sub word line. The device includes a sub word line driver control signal generator. The sub word line driver control signal generator receives an isolation signal applied to electrically insulate a sense amplifier from a bit line connected to memory cells constituting a memory cell array of the device, and generates a driver control signal for determining whether the sub word line driver operates or not. Thereby, a load of sub word line driver control signal generator can be reduced and so power consumption is reduced.

Abstract: A voltage converter and a method of converting a voltage which maintain a first driver of a driver pair in an active state, where current flows, for only a predetermined time period. The driver pair may include a pull-up driver and a pull-down driver. One driver may be active when an input signal has a first transition, but not a second transition. The other driver may be active when the input signal has the second transition, but not the first transition. Alternatively, one driver may be inactive when the input signal has the second transition and active for a first portion of the first transition and inactive for a second portion of the first transition. Alternatively, only one driver may be active at any given time.

Abstract: A sense amplifier includes a pair of sense bit lines and first and second MOS sense amplifiers. The first MOS sense amplifier has a first pair of MOS transistors of first conductivity type therein, which are electrically coupled across the pair of sense bit lines. This electrically coupling is provided so that each of the first pair of MOS transistors has a first source/drain terminal electrically connected to a corresponding one of the pair of sense bit lines and the second source/drain terminals of the first pair of MOS transistors are electrically connected together. The first pair of MOS transistors of first conductivity type is configured to have different threshold voltages or support different threshold voltage biasing. The second MOS sense amplifier has a first pair of MOS transistors of second conductivity type therein, which are electrically coupled across the pair of sense bit lines.

Abstract: An integrated circuit device disclosed herein includes a test device and a setup and hold measuring circuit. The setup and hold measuring circuit generates a reference signal and a data signal in response to an external clock signal in a test mode of operation. The test device receives the data signal in response to a reference signal, and outputs the inputted data signal as a setup and hold determining circuit. One of the reference signal and the data signal is a multiphase signal synchronized with the external clock signal. The setup and hold measuring circuit detects whether the output of the test device indicates a valid value of the data signal, and generates the detected result to the external as a setup/hold timing margin through at least one pad.

Abstract: A sense amplifier includes a pair of sense bit lines and first and second MOS sense amplifiers. The first MOS sense amplifier has a first pair of MOS transistors of first conductivity type therein, which are electrically coupled across the pair of sense bit lines. This electrically coupling is provided so that each of the first pair of MOS transistors has a first source/drain terminal electrically connected to a corresponding one of the pair of sense bit lines and the second source/drain terminals of the first pair of MOS transistors are electrically connected together. The first pair of MOS transistors of first conductivity type are configured to have different threshold voltages or support different threshold voltage biasing. The second MOS sense amplifier has a first pair of MOS transistors of second conductivity type therein, which are electrically coupled across the pair of sense bit lines.

Abstract: A semiconductor memory device may include a memory cell array, a bit line sense amplifier, a sub word line driver, and an electrode. The memory cell array may include a sub memory cell array connected between sub word lines and bit line pairs and having memory cells which are selected in response to a signal transmitted to the sub word lines and column selecting signal lines. The bit line sense amplifier may be configures to sense and amplify data of the bit line pairs. The sub word line driver may be configured to combine signals transmitted from word selecting signal lines and signals transmitted from main word lines to select the sub word lines. Moreover, the memory cell array may be configured to transmit data between the bit line pairs and local data line pairs and to transmit data between the local data line pairs and global data line pairs. The electrode may be configured to cover the whole memory cell array and to apply a voltage needed for the memory cells.

Abstract: A semiconductor memory device includes a sub word line driver for selectively connecting one of sub word lines with a main word line and applying a boosted voltage having a level higher than a power source voltage to a selected sub word line. The device includes a sub word line driver control signal generator. The sub word line driver control signal generator receives an isolation signal applied to electrically insulate a sense amplifier from a bit line connected to memory cells constituting a memory cell array of the device, and generates a driver control signal for determining whether the sub word line driver operates or not. Thereby, a load of sub word line driver control signal generator can be reduced and so power consumption is reduced.

Abstract: A semiconductor memory device may include a memory cell array, a bit line sense amplifier, a sub word line driver, and an electrode. The memory cell array may include a sub memory cell array connected between sub word lines and bit line pairs and having memory cells which are selected in response to a signal transmitted to the sub word lines and column selecting signal lines. The bit line sense amplifier may be configures to sense and amplify data of the bit line pairs. The sub word line driver may be configured to combine signals transmitted from word selecting signal lines and signals transmitted from main word lines to select the sub word lines. Moreover, the memory cell array may be configured to transmit data between the bit line pairs and local data line pairs and to transmit data between the local data line pairs and global data line pairs. The electrode may be configured to cover the whole memory cell array and to apply a voltage needed for the memory cells.

Abstract: A semiconductor memory device and a bit line sensing method thereof are disclosed.

Abstract: A semiconductor memory device having a memory cell array includes a plurality of first signal lines arranged on the memory cell array in the same direction and a plurality of second signal lines arranged on the memory cell array in a perpendicular direction to the first signal lines. The first signal lines are alternately arranged on at least two layers, and the second signal lines are arranged on a layer where the first signal lines are not arranged.

Abstract: An integrated circuit device disclosed herein includes a test device and a setup and hold measuring circuit. The setup and hold measuring circuit generates a reference signal and a data signal in response to an external clock signal in a test mode of operation. The test device receives the data signal in response to a reference signal, and outputs the inputted data signal as a setup and hold determining circuit. One of the reference signal and the data signal is a multiphase signal synchronized with the external clock signal. The setup and hold measuring circuit detects whether the output of the test device indicates a valid value of the data signal, and generates the detected result to the external as a setup/hold timing margin through at least one pad.

Abstract: A semiconductor device is provided for controlling entry to and exit from a power down (DPD) mode of a semiconductor memory comprising; a plurality of voltage generators for providing operating voltages to the semiconductor memory; a DPD controller for detecting a DPD condition and generating a DPD signal to control the application of the operating voltages to the semiconductor memory; and biasing circuitry for biasing a plurality of nodes of at least one of the plurality of voltage generators to at least one predetermined voltage potential to prevent false triggering of circuits upon entry/exit of DPD mode.

Abstract: A semiconductor device for controlling entry to and exit from a power down mode (DPD) of a semiconductor memory, comprising a plurality of voltage generators for providing operating voltages to the semiconductor memory; a DPD controller for detecting a DPD condition and for generating a DPD signal to control the application of the operating voltages to the semiconductor memory; and circuitry for controlling the timing of turning on/off the plurality of voltage generators upon entry/exit of DPD mode to reduce surge current through the semiconductor memory to less than maximum current level.

Abstract: A semiconductor device for controlling entry to and exit from a power down mode (DPD) of a semiconductor memory, comprising a plurality of voltage generators for providing operating voltages to the semiconductor memory; a DPD controller for detecting a DPD condition and for generating a DPD signal to control the application of the operating voltages to the semiconductor memory; and circuitry for controlling the timing of turning on/off the plurality of voltage generators upon entry/exit of DPD mode to reduce surge current through the semiconductor memory to less than maximum current level.

Abstract: A semiconductor device is provided for controlling entry to and exit from a power down (DPD) mode of a semiconductor memory comprising; a plurality of voltage generators for providing operating voltages to the semiconductor memory; a DPD controller for detecting a DPD condition and generating a DPD signal to control the application of the operating voltages to the semiconductor memory; and biasing circuitry for biasing a plurality of nodes of at least one of the plurality of voltage generators to at least one predetermined voltage potential to prevent false triggering of circuits upon entry/exit of DPD mode.

Abstract: A layout of a bit line sensing control circuit for a semiconductor memory device includes two bit line pairs extending in a first direction. A power contact is arranged between the two bit line pairs. A power gate is arranged around the power contact. A plurality of sense transistors respectively have a plurality of sense transistor gates. The plurality of sense transistor gates are arranged around the power gate. A pair of control line contacts is arranged in a second direction at an adjacent location outside the two bit line pairs. A control line extends in the second direction and is connected to the power gate through the pair of control line contacts. A power line extends in the second direction adjacent to the control line and is connected to an active area surrounded by the power gate through the power contact.

Abstract: Disclosed is a dynamic random access memory (DRAM) device having word line low voltage supply lines for driving word lines in a mesh structure. The DRAM device includes a plurality of cell arrays each of which is formed of memory cells coupled to word lines and bit lines in a matrix. The memory device further includes regions of sense amplifiers disposed between the cell arrays arranged along the row direction, regions of word line drivers disposed between the cell arrays arranged along the column direction, conjunction regions disposed at positions adjacent to the regions of the sense amplifiers and word line drivers, and a plurality of word line low voltage supply lines disposed on the conjunction regions. The word line low voltage supply lines are electrically interconnected for each other at least on the conjunction regions. According to the layout arrangement, loadings of the word line low voltage supply lines are almost equally distributed, and thereby word line low noise are decreased.

Abstract: A layout of a bit line sensing control circuit for a semiconductor memory device includes two bit line pairs extending in a first direction. A power contact is arranged between the two bit line pairs. A power gate is arranged around the power contact. A plurality of sense transistors respectively have a plurality of sense transistor gates. The plurality of sense transistor gates are arranged around the power gate. A pair of control line contacts is arranged in a second direction at an adjacent location outside the two bit line pairs. A control line extends in the second direction and is connected to the power gate through the pair of control line contacts. A power line extends in the second direction adjacent to the control line and is connected to an active area surrounded by the power gate through the power contact.