Abstract: In certain embodiments, a lead frame includes a paddle, a plurality of inner leads, first outer leads, and a second outer lead. The plurality of inner leads can be arranged at a side face of the paddle. The first outer leads can extend from the inner leads along a first direction and can be arranged at a substantially central portion of the side face of the paddle. Furthermore, each of the first outer leads can have a first area. The second outer lead can be arranged at an edge portion of the side face of the paddle and can be supported by the paddle. The second outer lead can have a second area that is larger than the first area.

Abstract: Provided is a semiconductor package and method of manufacturing the same. The semiconductor package may include a semiconductor chip, an encapsulant encapsulating the semiconductor chip, a lead unit, and a partially encapsulated by the encapsulating thermal stress buffer which absorbs thermal stress of the semiconductor chip or the encapsulant.

Abstract: A stacked semiconductor package includes a first semiconductor package, a second semiconductor package and a conductive connection member. The first semiconductor package includes a first semiconductor chip, a first lead frame having first outer leads that are electrically connected to the first semiconductor chip, and a first molding member formed on the first semiconductor chip and the first lead frame to expose the first outer leads. The second semiconductor package includes a second semiconductor chip, a second lead frame formed on the first molding member and having second outer leads that may be electrically connected to the second semiconductor chip, and a second molding member formed on the second semiconductor chip and the second lead frame to expose the second outer leads. The conductive connection member may electrically connect the first outer leads and the second outer leads to each other. Further, the conductive connection member may have a crack-blocking groove.

Abstract: Provided are a semiconductor package having molded balls on a bottom surface of a PCB and a method of manufacturing the semiconductor package. The semiconductor package includes: a semiconductor chip mounting member comprising circuit patterns on a first surface, an insulating layer defining openings exposing at least portions of the circuit patterns, and external contact terminals arranged on the portions of circuit patterns exposed by the openings; a semiconductor chip formed on a second surface of the semiconductor chip mounting member and electrically connected to the semiconductor chip mounting member; a first sealing portion coating the second surface of the semiconductor chip mounting member and the semiconductor chip; and a second sealing portion arranged on the insulating layer and the external contact terminals such that at least portions of the external contact terminals are exposed.

Abstract: According to an example embodiment, a method of fabricating an electronic device may include preparing a substrate with a first area and a second area. A metal interconnection may be formed on the substrate extending from the first area to the second area. An insulating layer may be formed on the substrate. A sacrificial pattern electrically connected to the metal interconnection and serving as a sacrificial anode for cathodic protection against corrosion of the metal interconnection may be formed on the second area. An opening to expose the metal interconnection on the first area may be formed by patterning the insulating layer. An electronic device fabricated by a method according to an example embodiment may include a substrate, a metal interconnection, an insulating layer, and/or a sacrificial pattern.

Abstract: Provided is a printed circuit board having a bump interconnection structure that improves reliability between interconnection layers. Also provided is a method of fabricating the printed circuit board and semiconductor package using the printed circuit board. According to one embodiment, the printed circuit board includes a plurality of bumps formed on a resin layer between a first interconnection layer and a second interconnection layer. The second interconnection layer includes insertion holes corresponding to upper portions of the bumps so that the upper portions of the bumps protrude from the second interconnection layer. The upper portion of at least one of the bumps includes a rivet portion having a diameter greater that the diameter of the corresponding insertion hole to reliably interconnect the first and second interconnection layers.

Abstract: Provided are a semiconductor package and a method of fabricating the same. The semiconductor package includes a semiconductor chip, and a plurality of conductive balls, e.g., solder balls formed on a joint surface of the semiconductor chip. A dummy board includes openings aligned with the solder balls and is bonded to the joint surface of the semiconductor chip. An adhesive material is interposed between the semiconductor chip and the dummy board to adhere the dummy board to the semiconductor chip. The adhesive material is applied on an adhesion surface of the dummy board adhered to a joint surface of the semiconductor chip. The dummy board is adhered to the joint surface of the semiconductor chip such that the solder balls are aligned with the openings. Cheap underfill materials can be selectively used, and a process time for reflow and curing of the adhesive material can be greatly reduced.

Abstract: The present invention relates to pseudoceramide derivatives represented by formula(I) or (II): R1—COCHR2CONR3R4  (I) R1—CH(OH)CHR2CONR3R4  (II) wherein, each of R1 and R2 represents linear or branched alkyl group or alkenyl group having 6˜22 carbon atoms; each of R3 and R4 represents hydrogen, methyl, ethyl, propyl, or linear or branched C2˜C6 alkyl group having one or more hydroxyl group(s), or monosaccharide, a process for preparing the same, and dermatologic external preparations containing the same. When the pseudoceramide derivatives according to the present invention are applied in an dermatologic external preparations the moisture-retaining property and resilience of skin and hair is enhanced such so that the derivatives are useful in protection of skin-aging. In addition, the derivatives are useful for inducing the formation of lipid layer on damaged skin and for preventing the inhibition of lipid synthesis.

Abstract: A herb medicine extract-containing non-bleeding striped dentifrice composition, consisting essentially of a striped dentifrice component and a base dentifrice component, each component comprising the following ingredients at the substantially same amount: a. an abrasive that has a BET surface area of 10 m.sup.2 /g or less and an average particle diameter of 1 to 30 .mu.m upon measurement by Coulter Counter method, and shows oil absorption (linseed oil, ml/100 g) of 50 or less; b. a binder selected from the group consisting of xanthan gum, carrageenan, sodium carboxymethylcellulose, and the mixtures thereof; c. an alkyl sulfonate of anionic surfactants; and d. a humectant, and said striped dentifrice component containing herb medicine extracts at an amount of 0.001 to 10% by weight, on the basis of dry solid substance. It is non-bleeding by virtue of the substantially same formulation in the two components and the herb medicine extracts allow the dentifrice composition to suppress the formation of plaque.