Abstract: In a photoresist dispensing apparatus for use in manufacturing a semiconductor device, to coercively emit photoresist from a bottle by using a dispensing pump and to pass it through a supply line and a filter to obtain a filtering operation, and to spray the filtered photoresist to a wafer through a spraying nozzle; a bubble removal unit is equipped with the supply line, before the dispensing pump. Large and micro bubbles generated in the midst of flow of photoresist, and foreign substances, are substantially filtered off so as to supply photoresist of a good quality. A floating load in a foreign substance removal filter is substantially removed, thus spraying photoresist under an always uniform and stabilized pressure by using a dispensing pump, to cover a wafer with photoresist in a uniform thickness and obtain a precise pattern formation.

Abstract: A cassette position control device controls the position of a cassette in which wafers are stored, when the wafer cassette is loaded on a cassette support. In addition to the cassette support, the device has a cassette moving section and a control section. The control section senses the state of the wafer cassette on the cassette support, and generates and outputs a motor drive signal to move the cassette to a designated relative position on the cassette support. The cassette moving section moves the wafer cassette to the designated position in response to the motor drive signal. Therefore, wafers can be loaded/unloaded to and from the same designated position after the wafer cassette has been placed on a cassette support.

Abstract: In a photoresist dispensing apparatus for use in manufacturing a semiconductor device, to coercively emit photoresist from a bottle by using a dispensing pump and to pass it through a supply line and a filter to obtain a filtering operation, and to spray the filtered photoresist to a wafer through a spraying nozzle; a bubble removal unit is equipped with the supply line, before the dispensing pump. Large and micro bubbles generated in the midst of flow of photoresist, and foreign substances, are substantially filtered off so as to supply photoresist of a good quality. A floating load in a foreign substance removal filter is substantially removed, thus spraying photoresist under an always uniform and stabilized pressure by using a dispensing pump, to cover a wafer with photoresist in a uniform thickness and obtain a precise pattern formation.

Abstract: A wafer edge exposure apparatus and method of operation are disclosed. The apparatus includes an edge exposing device exposing an edge portion of a wafer loaded onto a rotatable support chuck under a body tube and an interlock generator generating an interlock signal stopping operation of the wafer edge exposure apparatus upon acoustically or optically detecting an abnormal phenomenon in relation to a wafer being processed and body tube.

Abstract: A semiconductor manufacturing apparatus includes a wafer guide, and a wafer detecting system to determine whether a wafer is properly seated on a hot plate, by detecting temperature variations for the hot plate when the wafer is positioned onto the hot plate.

Abstract: A cassette position control device controls the position of a cassette in which wafers are stored, when the wafer cassette is loaded on a cassette support. In addition to the cassette support, the device has a cassette moving section and a control section. The control section senses the state of the wafer cassette on the cassette support, and generates and outputs a motor drive signal to move the cassette to a designated relative position on the cassette support. The cassette moving section moves the wafer cassette to the designated position in response to the motor drive signal. Therefore, wafers can be loaded/unloaded to and from the same designated position after the wafer cassette has been placed on a cassette support.