Patents by Inventor Jong-Heon Ha

Jong-Heon Ha has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210392432
    Abstract: Provided is a microspeaker module having a duct communicating with a back volume vent hole. The microspeaker module includes a case, a microspeaker, and a circuit part and is mounted in a multimedia device to generate sound. The microspeaker includes a back volume communicating with a rear of the microspeaker and defined by the case, a vent hole formed in the case and configured to allow air to flow into and out of the back volume, and a duct connected to the vent hole to increase a path of air flowing to the vent hole.
    Type: Application
    Filed: June 10, 2021
    Publication date: December 16, 2021
    Inventors: Ji Hoon Kim, In Ho Jeong, Jong Heon Ha, Min Chul Kang, Won Ki Lee, Chi Kyun Kim
  • Patent number: 10419847
    Abstract: The present invention discloses a microspeaker enclosure with porous materials, including a microspeaker, an enclosure with the microspeaker therein, the enclosure defining a resonance space and having an upper casing and a lower casing, porous materials filled in the resonance space of the enclosure, and an anti-noise structure which prevents at least one of a collision between the porous materials, a collision between the porous materials and the enclosure, a collision between the porous materials and the microspeaker, and introduction of the porous materials into the microspeaker.
    Type: Grant
    Filed: June 6, 2017
    Date of Patent: September 17, 2019
    Assignee: EM-TECH. Co., Ltd.
    Inventors: Kyu Dong Choi, Jong Heon Ha, Hyeon Taek Oh
  • Publication number: 20170353785
    Abstract: The present invention discloses a microspeaker enclosure with porous materials, including a microspeaker, an enclosure with the microspeaker therein, the enclosure defining a resonance space and having an upper casing and a lower casing, porous materials filled in the resonance space of the enclosure, and an anti-noise structure which prevents at least one of a collision between the porous materials, a collision between the porous materials and the enclosure, a collision between the porous materials and the microspeaker, and introduction of the porous materials into the microspeaker.
    Type: Application
    Filed: June 6, 2017
    Publication date: December 7, 2017
    Inventors: Kyu Dong Choi, Jong Heon Ha, Hyeon Taek Oh
  • Patent number: 9307314
    Abstract: Disclosed is an electronic device including: a housing having a sound emission hole formed in at least one side thereof; a speaker module which is at least partially accommodated in the housing; and a sound reflection surface formed inside the housing and obliquely facing the speaker module. A sound emitted from the speaker module can be reflected by the sound reflection surface to the sound emission hole. The side acoustic emission type speaker device and the electronic device including the same can be variously implemented.
    Type: Grant
    Filed: June 12, 2014
    Date of Patent: April 5, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ji-Hoon Kim, In-Ho Jeong, Jong-Heon Ha, Ho-Yun Lee, Bong-Hee Kang, Joong-Hak Kwon, Ki-Won Kim, Byoung-Hee Lee, Ho-Chul Hwang
  • Publication number: 20140369533
    Abstract: Disclosed is an electronic device including: a housing having a sound emission hole formed in at least one side thereof; a speaker module which is at least partially accommodated in the housing; and a sound reflection surface formed inside the housing and obliquely facing the speaker module. A sound emitted from the speaker module can be reflected by the sound reflection surface to the sound emission hole. The side acoustic emission type speaker device and the electronic device including the same can be variously implemented.
    Type: Application
    Filed: June 12, 2014
    Publication date: December 18, 2014
    Inventors: Ji-Hoon Kim, In-Ho Jeong, Jong-Heon Ha, Ho-Yun Lee, Bong-Hee Kang, Joong-Hak Kwon, Ki-Won Kim, Byoung-Hee Lee, Ho-Chul Hwang