Patents by Inventor Jong In Ryu
Jong In Ryu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20200098699Abstract: An electronic device module includes a substrate, at least one first component and at least one second component disposed on one surface of the substrate, a second sealing portion having the at least one second component embedded therein, and disposed on the substrate, and a first sealing portion disposed outside of the second sealing portion, at least a portion of the first sealing portion being disposed between the at least one first component and the substrate.Type: ApplicationFiled: November 26, 2019Publication date: March 26, 2020Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Jong In RYU, Suk Youn HONG, Gi Su CHI, Seung Hyun HONG, Ki Chan KIM
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Patent number: 10564679Abstract: An electronic device module includes a substrate, a first component disposed on a first surface of the substrate, a sealing portion disposed on the first surface of the substrate, a second component disposed on the first surface of the substrate and embedded in the sealing portion, and a shielding wall at least partially disposed between the first component and the second component and including a portion having a height, with respect to the first surface of the substrate, that is lower than a height of the sealing portion.Type: GrantFiled: November 6, 2018Date of Patent: February 18, 2020Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Suk Youn Hong, Jong In Ryu, Seung Hyun Hong, Jang Hyun Kim
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Patent number: 10448529Abstract: An electronic device on which an exterior surface mounting member is mounted is provided. The electronic device includes an external housing including a first plate and a second plate that is directed opposite to the first plate, and at least one electronic component that is included within the external housing. The first plate may include a transparent plate including a first surface that forms an outer surface of the first plate and a second surface that is directed opposite to the first surface, and a structure that is interposed between the transparent plate and the second plate, and includes a third surface that faces the first plate and a fourth surface that is formed opposite to the third surface, the structure containing a transparent or translucent material.Type: GrantFiled: February 16, 2016Date of Patent: October 15, 2019Assignee: Samsung Electronics Co., Ltd.Inventors: Soon-Ho Han, Jong-In Ryu, Byoung-Uk Yoon
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Publication number: 20190310687Abstract: An electronic device module includes a substrate, a first component disposed on a first surface of the substrate, a sealing portion disposed on the first surface of the substrate, a second component disposed on the first surface of the substrate and embedded in the sealing portion, and a shielding wall at least partially disposed between the first component and the second component and including a portion having a height, with respect to the first surface of the substrate, that is lower than a height of the sealing portion.Type: ApplicationFiled: November 6, 2018Publication date: October 10, 2019Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Suk Youn HONG, Jong In RYU, Seung Hyun HONG, Jang Hyun KIM
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Publication number: 20190311994Abstract: An electronic device module includes a substrate, at least one first component and at least one second component disposed on one surface of the substrate, a shielding wall disposed between the at least one first component and the at least one second component, and disposed on the substrate, and a sealing portion having the at least one first component, the at least one second component and the shielding wall embedded therein, and disposed on the substrate. The shielding wall includes at least one insulating layer and at least one conductive layer disposed on the insulating layer.Type: ApplicationFiled: November 6, 2018Publication date: October 10, 2019Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Suk Youn HONG, Jang Hyun KIM, Hye Kyung KIM, Seung Hyun HONG, Jong In RYU
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Publication number: 20190304926Abstract: An electronic device module includes a substrate, at least one first component and at least one second component disposed on one surface of the substrate, a second sealing portion having the at least one second component embedded therein, and disposed on the substrate, and a first sealing portion disposed outside of the second sealing portion, at least a portion of the first sealing portion being disposed between the at least one first component and the substrate.Type: ApplicationFiled: November 6, 2018Publication date: October 3, 2019Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Jong In RYU, Suk Youn HONG, Gi Su CHI, Seung Hyun HONG, Ki Chan KIM
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Patent number: 10380244Abstract: The present disclosure includes a memory in which a content providing program is stored, and a processor that executes the program stored in the memory. Herein, upon execution of the program, the processor extracts a subject and a verb property including multiple verbs corresponding to the subject from a target content, infers a verb-form subject of the target content on the basis of the subject and the verb property, and extracts one or more contents matched with the target content from among multiple candidate contents on the basis of the verb-form subject of the target content. Further, the multiple verbs corresponding to the subject are extracted from an associative verb group.Type: GrantFiled: January 9, 2018Date of Patent: August 13, 2019Assignee: Korea University Research and Business FoundationInventors: Sang Keun Lee, Woo Jong Ryu
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Patent number: 10356911Abstract: An electronic device module includes: a board including at least one mounting electrode and at least one external connection electrode and having a protective insulation layer which is provided on an outer surface thereof; at least one electronic device mounted on the mounting electrodes; a molded part sealing the electronic device; and at least one connective conductor of which one end is bonded to the external connection electrode of the board and which penetrates through the molded part to be disposed in the molded part, wherein the protective insulation layer is disposed to be spaced apart from the connective conductor.Type: GrantFiled: June 5, 2015Date of Patent: July 16, 2019Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Do Jae Yoo, Jae Hyun Lim, Jong In Ryu, Kyu Hwan Oh, Ki Ju Lee
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Patent number: 10219380Abstract: An electronic device module includes a board including external connecting electrodes and mounting electrodes; an electronic device mounted on the mounting electrodes; a molded portion sealing the electronic device; connection conductors having an end bonded to the external connecting electrodes and penetrating through the molded portion; and external terminals bonded to another end of the connection conductors.Type: GrantFiled: April 1, 2015Date of Patent: February 26, 2019Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Do Jae Yoo, Jae Hyun Lim, Kyu Hwan Oh, Jong In Ryu
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Patent number: 10163746Abstract: A semiconductor package and manufacturing method thereof includes a chip member installed on an upper surface, a lower surface, or both of a substrate. The semiconductor package and manufacturing method thereof also include a mold part stacked embedding the chip member, a connection member disposed at a center portion of the mold part, and a solder part formed on a portion of the connection member.Type: GrantFiled: January 21, 2016Date of Patent: December 25, 2018Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jong In Ryu, Ki Joo Sim, Do Jae Yoo, Ki Ju Lee, Jin Su Kim
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Patent number: 10109595Abstract: A double-sided package module includes a substrate, a first sealing member, a second sealing member, and an extension portion. The substrate includes electronic components positioned on a first surface and a second surface of the substrate. The first sealing member and the second sealing member are positioned on the first surface and the second surface, respectively. The extension portion protrudes from a lateral surface of the substrate into a space between the first sealing member and the second sealing member.Type: GrantFiled: September 16, 2016Date of Patent: October 23, 2018Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Do Jae Yoo, Hee Jung Jung, Jong In Ryu, Ki Joo Sim
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Publication number: 20180196794Abstract: The present disclosure includes a memory in which a content providing program is stored, and a processor that executes the program stored in the memory. Herein, upon execution of the program, the processor extracts a subject and a verb property including multiple verbs corresponding to the subject from a target content, infers a verb-form subject of the target content on the basis of the subject and the verb property, and extracts one or more contents matched with the target content from among multiple candidate contents on the basis of the verb-form subject of the target content. Further, the multiple verbs corresponding to the subject are extracted from an associative verb group.Type: ApplicationFiled: January 9, 2018Publication date: July 12, 2018Inventors: Sang Keun Lee, Woo Jong Ryu
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Patent number: 9997504Abstract: In one general aspect, an electronic device module includes a first board, a first device mounted on a first surface of the first board, a second board disposed below the first board, and a plurality of second devices disposed between the first board and the second board, wherein a surface of each second device the plurality of second devices is bonded to a second surface of the first board and another surface of each of the second devices is bonded to the second board.Type: GrantFiled: March 21, 2016Date of Patent: June 12, 2018Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jae Hyun Lim, Jong In Ryu, Sung Ho Kim, Jin Su Kim
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Patent number: 9868274Abstract: An electronic device and method of fabricating an exterior member thereof are provided. The electronic device includes a basic member disposed on an outside of the electronic device and having an outer surface that is at least partially curved, and a glass film at least partially laminated to the outer surface of the basic member.Type: GrantFiled: September 10, 2015Date of Patent: January 16, 2018Assignee: Samsung Electronics Co., Ltd.Inventors: Myung-Gon Kim, Jong-In Ryu, Min-Su Chang
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Publication number: 20170301632Abstract: The method of manufacturing a package comprising: preparing a strip substrate having a plurality of separate package regions which are partitioned by a dicing region and via pads which are connected to one ends of plated tails which are divided to be disconnected in the dicing region; mounting at least one electronic component on at least one surface of each package region of the substrate; forming a connection pattern having conductivity in disconnected portions of the plated tails to form electrical connections therebetween; forming a molded part on the surface of the substrate to enclose the electronic component; forming at least one via penetrating through the molded part by applying current through the plated tails; and dicing the substrate in the dicing region to divide the substrate into separate packages, each having the connection pattern exposed to the exterior of the substrate.Type: ApplicationFiled: June 29, 2017Publication date: October 19, 2017Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Do Jae YOO, Kyu Hwan OH, Jong In RYU, Jae Hyun LIM
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Patent number: 9748179Abstract: The package includes: a substrate having at least one circuit layer; at least one electronic component mounted on at least one surface of the substrate; a molded part formed on the surface of the substrate to enclose the electronic component; at least one via formed in the molded part to be electrically connected to the circuit layer of the substrate; and a pattern connected to one end of a plated tail connected to the circuit layer connected to the via and exposed to the exterior of the substrate.Type: GrantFiled: July 28, 2015Date of Patent: August 29, 2017Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Do Jae Yoo, Kyu Hwan Oh, Jong In Ryu, Jae Hyun Lim
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Publication number: 20170221835Abstract: A double-sided package module includes a substrate, a first sealing member, a second sealing member, and an extension portion. The substrate includes electronic components positioned on a first surface and a second surface of the substrate. The first sealing member and the second sealing member are positioned on the first surface and the second surface, respectively. The extension portion protrudes from a lateral surface of the substrate into a space between the first sealing member and the second sealing member.Type: ApplicationFiled: September 16, 2016Publication date: August 3, 2017Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Do Jae YOO, Hee Jung JUNG, Jong In RYU, Ki Joo SIM
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Patent number: 9585260Abstract: There are provided an electronic component module capable of increasing a degree of integration by mounting electronic components on both surfaces of a substrate, and a manufacturing method thereof. The electronic component module according to an exemplary embodiment of the present disclosure includes: a substrate; a plurality of electronic components mounted on both surfaces of the substrate; connection conductors each having one end bonded to one surface of the substrate using an conductive adhesive; and a molded portion having the connection conductor embedded therein and formed on one surface of the substrate, wherein the connection conductor may have at least one blocking member preventing a spread of the conductive adhesive.Type: GrantFiled: April 23, 2014Date of Patent: February 28, 2017Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jae Hyun Lim, Jong In Ryu, Sun Ho Kim, Eun Jung Jo, Kyu Hwan Oh, Do Jae Yoo
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Publication number: 20170018540Abstract: In one general aspect, an electronic device module includes a first board, a first device mounted on a first surface of the first board, a second board disposed below the first board, and a plurality of second devices disposed between the first board and the second board, wherein a surface of each second device the plurality of second devices is bonded to a second surface of the first board and another surface of each of the second devices is bonded to the second board.Type: ApplicationFiled: March 21, 2016Publication date: January 19, 2017Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Hyun LIM, Jong In RYU, Sung Ho KIM, Jin Su KIM
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Publication number: 20160315027Abstract: A semiconductor package and manufacturing method thereof includes a chip member installed on an upper surface, a lower surface, or both of a substrate. The semiconductor package and manufacturing method thereof also include a mold part stacked embedding the chip member, a connection member disposed at a center portion of the mold part, and a solder part formed on a portion of the connection member.Type: ApplicationFiled: January 21, 2016Publication date: October 27, 2016Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Jong In RYU, Ki Joo SIM, Do Jae YOO, Ki Ju LEE, Jin Su KIM