Patents by Inventor Jong In Shin

Jong In Shin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240167196
    Abstract: Provided are an epitaxial growth apparatus and a gas supply control module used therefor, the epitaxial growth apparatus including: a reaction chamber; a susceptor positioned in the reaction chamber and configured to seat a wafer thereon; and a gas supply control module configured to control a flow of a gas flowing into the reaction chamber, wherein the gas supply control module includes an injector including a center port corresponding to a central region of the wafer, a pair of edge ports corresponding to both edge regions of the wafer, and a pair of middle ports respectively disposed between the center port and the pair of edge ports, and a flow distribution unit configured to independently distribute the gas flow input from a source module to the ports.
    Type: Application
    Filed: November 16, 2023
    Publication date: May 23, 2024
    Applicant: PJP TECH INC
    Inventors: Bum Ho CHOI, Kyung Shin Park, Hyun Ho Kwon, Dong Hyoun Kim, Suk Ho Lim, Jong Wook Jeong, Seung Soo Lee
  • Publication number: 20240165072
    Abstract: The present invention relates to a pharmaceutical composition for alleviating or treating hair loss through the inflammation amelioration of human dermal papilla cells and peripheral cells and the inhibition of 5?-reductase expression, the pharmaceutical composition comprising genistein and kaempferol as active ingredients.
    Type: Application
    Filed: March 22, 2022
    Publication date: May 23, 2024
    Inventors: Seung Sook LEE, Jong Moon JEONG, Min Jee LEE, Jin A SHIN, Hua LI
  • Publication number: 20240164147
    Abstract: A display device includes: a base substrate; a first pixel electrode, a second pixel electrode, and a third pixel electrode arranged on the base substrate to be spaced apart from each other; a pixel defining film on the first pixel electrode, the second pixel electrode, and the third pixel electrode and including a first opening exposing the first pixel electrode, a second opening exposing the second pixel electrode and spaced apart from the first opening, and a third opening exposing the third pixel electrode and spaced apart from the first opening and the second opening; a first organic layer on the first pixel electrode exposed by the first opening; a second organic layer on the second pixel electrode exposed by the second opening; and a third organic layer on the third pixel electrode exposed by the third opening.
    Type: Application
    Filed: January 18, 2024
    Publication date: May 16, 2024
    Inventors: Sang Shin LEE, Joon Young PARK, Min Goo KANG, Jung Woo KO, Jong Sung PARK, Hong Kyun AHN, Sang Min YI, Sang Woo JO, Young Eun RYU, Yoon Seo LEE
  • Publication number: 20240162120
    Abstract: A semiconductor device is provided. The semiconductor device includes first through third active patterns extending in and spaced apart from each other along a first direction on a first surface of a substrate; a first gate electrode extending in a second direction on the first active pattern; a first active cut between the first and second active patterns, wherein the first active cut extends in the second direction, and the first active cut is spaced apart from the first gate electrode in the first direction; a second active cut between the second and third active patterns, wherein the second active cut extends in the second direction, and the second active cut is spaced apart from the first active cut in the first direction; and a first through via extending vertically through the second active pattern between the first and second active cuts, and into the substrate.
    Type: Application
    Filed: June 5, 2023
    Publication date: May 16, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kern RIM, Doo Hyun LEE, Heon Jong SHIN, Jin Young PARK
  • Patent number: 11984520
    Abstract: A light sensing device includes a semiconductor layer including a distributed Bragg reflector including a first surface of the semiconductor layer, and a photoelectric conversion unit including a second surface of the semiconductor layer, and the distributed Bragg reflector has a plurality of holes each having, in a cross-sectional view, a width gradually changing from a first width to a second width according to a width change period; a first electrode in one region of the semiconductor layer; and a second electrode on the second surface of the semiconductor layer and having a reflective metal.
    Type: Grant
    Filed: February 15, 2022
    Date of Patent: May 14, 2024
    Assignees: Samsung Electronics Co., Ltd., Korea Advanced Institute of Science and Technology
    Inventors: Insung Joe, Jonghwa Shin, Joonkyo Jung, Jong Uk Kim
  • Publication number: 20240136067
    Abstract: A method for monitoring an object is provided. The method includes the steps of: in response to information on a behavior of a domestic animal being estimated from sensor data measured by a sensor for the domestic animal using a machine learning-based behavior recognition model, estimating health status of the domestic animal with reference to the information on the behavior of the domestic animal and a health criterion for the domestic animal; and determining first breeding information on the domestic animal to be provided to a user on the basis of the health status.
    Type: Application
    Filed: August 22, 2021
    Publication date: April 25, 2024
    Applicant: Bodit Inc.
    Inventors: Kwang Jae Choo, Min Yong Shin, Heung Jong Yoo, Yoon Chul Choi, Seongjin Kim, Nayeon Kim
  • Publication number: 20240128332
    Abstract: A semiconductor device comprising: a lower insulating layer; a field insulating layer on the lower insulating layer; an upper insulating layer on the field insulating layer; a first through via in the upper insulating layer; a second through via in the field insulating layer; and a third through via in the lower insulating layer, wherein the second through via is connected to the first and third through vias, and wherein a width of a top surface of the second through via is greater than a width of a bottom surface of the first through via, a width of a bottom surface of the second through via is greater than a width of a top surface of the third through via, and a width of a middle portion of the second through via is greater than the widths of the top surface and the bottom surface of the second through via.
    Type: Application
    Filed: July 11, 2023
    Publication date: April 18, 2024
    Inventors: Sang Shin JANG, Jong Min BAEK, Sun Ki MIN, Na rae OH
  • Publication number: 20240125908
    Abstract: A method for manufacturing a LiDAR device is proposed. The method may include providing a LiDAR module including a laser emitting module and a laser detecting module to a target region. The method may also include adjusting, on the basis of first detecting data obtained from the laser detecting module, a relative position of a detecting optic module with respect to the laser detecting module. The method may further include adjusting, on the basis of image data obtained from at least one image sensor, a relative position of an emitting optic module with respect to the laser emitting module.
    Type: Application
    Filed: December 21, 2023
    Publication date: April 18, 2024
    Inventors: Chan M LIM, Dong Kyu KIM, Chang Mo JEONG, Hoon Il JEONG, Eunsung KWON, Junhyun JO, Bumsik WON, Suwoo NOH, Sang Shin BAE, Seong Min YUN, Jong Hyun YIM
  • Publication number: 20240128264
    Abstract: A semiconductor device includes a substrate, first and second active patterns extending in a first horizontal direction on the substrate, first and second gate electrodes extending in a second horizontal direction on the first and second active patterns, respectively, a first trench extending in the second horizontal direction between the first and second gate electrodes and separating the first and second active patterns, at least part of the first trench is in the substrate, an active cut extending along sidewalls and a bottom surface of the first trench and contacting each of the first and second active patterns, a second trench on the active cut in the first trench, and a flowable material layer in at least part of the second trench, the flowable material layer including a flowable insulating material and not being in contact with each of the substrate and the first and second active patterns.
    Type: Application
    Filed: June 8, 2023
    Publication date: April 18, 2024
    Inventors: Ji Min Yu, Heon Jong Shin, Doo Hyun Lee
  • Patent number: 11958332
    Abstract: A vehicle cooling/heating system includes a coolant line in which coolant is circulated between a heat source component of a vehicle that provides waste heat and a chiller and a refrigerant line in which refrigerant is circulated through a compressor, a condenser, an expansion valve, and an evaporator. The refrigerant line performs indoor cooling through the evaporator. A controller controls the coolant line such that, during a drying mode in which it is necessary to dry the evaporator, the coolant in the coolant line is circulated or not circulated through the heat source component and the chiller, and such that the refrigerant in the refrigerant line flows, in order, through the compressor, the evaporator, and the chiller.
    Type: Grant
    Filed: October 5, 2021
    Date of Patent: April 16, 2024
    Assignees: Hyundai Motor Company, Kia Corporation
    Inventors: Jong Won Kim, Sang Shin Lee, Uk Il Yang
  • Publication number: 20240112949
    Abstract: A semiconductor device including a first interlayer insulating film; a conductive pattern in the first interlayer insulating film; a resistance pattern on the conductive pattern; an upper etching stopper film spaced apart from the resistance pattern, extending in parallel with a top surface of the resistance pattern, and including a first metal; a lower etching stopper film on the conductive pattern, extending in parallel with a top surface of the first interlayer insulating film, and including a second metal; and a second interlayer insulating film on the upper etching stopper film and the lower etching stopper film, wherein a distance from a top surface of the second interlayer insulating film to a top surface of the upper etching stopper film is smaller than a distance from the top surface of the second interlayer insulating film to a top surface of the lower etching stopper film.
    Type: Application
    Filed: December 13, 2023
    Publication date: April 4, 2024
    Inventors: Sung Jin KANG, Jong Min BAEK, Woo Kyung YOU, Kyu-Hee HAN, Han Seong KIM, Jang Ho LEE, Sang Shin JANG
  • Patent number: 11945296
    Abstract: The present invention relates to a cooling module for a vehicle, and more particularly, to a cooling module for a vehicle including a condenser, a first radiator through which coolant for an engine flow, a second radiator through which coolant for electrical components flows, and an intercooler, and capable of evenly distributing air resistance of the front surface of the first radiator to secure an overall balance of an air volume distribution by disposing the condenser, the second radiator, and the first radiator in a flow direction of air or disposing the second radiator, the condenser, and the first radiator in this order, and disposing the intercooler on lower sides of the condenser and the second radiator, and capable of minimizing a gap of each heat exchange period by disposing the condenser C and the first radiator R to be in closely contact with the second radiator L.
    Type: Grant
    Filed: July 23, 2021
    Date of Patent: April 2, 2024
    Assignee: Hanon Systems
    Inventors: Ji Hun Han, Gwang Ok Ko, Hyun Keun Shin, Seok Jong Yoo
  • Publication number: 20240105127
    Abstract: A display apparatus includes a display panel, a driving controller, and a data driver. The driving controller generates a data signal based on input image data. The data driver converts the data signal into a data voltage and outputs the data voltage to the display panel. The driving controller includes a deterioration compensator. The deterioration compensator generates an alpha value based on a ratio between a sensed current read from a portion of the display panel applied with a high power voltage or a portion of the display panel applied with a low power voltage and a predicted current calculated from the input image data and generates the data signal using the input image data, a stress value of a pixel, and the alpha value.
    Type: Application
    Filed: July 18, 2023
    Publication date: March 28, 2024
    Applicant: Samsung Display Co., LTD.
    Inventors: JONG-WOONG PARK, WONJU SHIN, BYUNG KI CHUN, KANGHEE LEE
  • Patent number: 11940725
    Abstract: A blankmask for EUV lithography includes a substrate, a reflective layer, a capping layer, and a phase shift layer. The phase shift layer is made of a material containing ruthenium (Ru) and chromium (Cr), and a total content of ruthenium (Ru) and chromium (Cr) is 50 to 100 at %. The phase shift layer may further contain boron (B) or nitrogen (N). The phase shift layer of the present invention has a high relative reflectance (relative reflectance with respect to a reflectance of the reflective layer under the phase shift layer) with respect to a tantalum (Ta)-based phase shift layer and has a phase shift amount of 170 to 230°. It is possible to obtain excellent resolution when finally manufacturing a pattern of 7 nm or less by using a photomask manufactured using such a blankmask.
    Type: Grant
    Filed: December 6, 2021
    Date of Patent: March 26, 2024
    Assignee: S&S Tech Co., Ltd.
    Inventors: Cheol Shin, Yong-Dae Kim, Jong-Hwa Lee, Chul-Kyu Yang, Min-Kwang Park, Mi-Kyung Woo
  • Publication number: 20240093401
    Abstract: A method of manufacturing a multilayer metal plate by electroplating includes a first forming operation of forming one of a first metal layer and a second metal layer on a substrate by electroplating, wherein the second metal layer is less recrystallized than the first metal layer, the second metal layer is comprised of nanometer-size grains, and the second metal layer has a higher level of tensile strength than the first metal layer; and a second forming operation of forming, by electroplating, a third metal layer not formed in the first forming operation on a surface of one of the first metal layer and the second metal layer formed in the first forming operation.
    Type: Application
    Filed: September 18, 2023
    Publication date: March 21, 2024
    Applicant: DONG-A UNIVERSITY RESEARCH FOUNDATION FOR INDUSTRY-ACADEMY COOPERATION
    Inventors: Hyun PARK, Sung Jin KIM, Han Kyun SHIN, Hyo Jong LEE, Jong Bae JEON, Jung Han KIM, An Na LEE, Tae Hyun KIM, Hyung Won CHO
  • Patent number: 11936318
    Abstract: Charging system and method using a motor driving system are proposed. The charging system includes a battery, an inverter to which D.C. power stored in the battery is applied, including a plurality of legs each including two switching elements, a motor including a plurality of coils of which first ends are respectively connected to connection nodes of the switching elements of each of the plurality of legs, and second ends are connected to each other to form a neutral point, and an inverter driving part configured to control switching of the switching elements, so that switching speeds of the switching elements are different for each mode of a motor driving mode and a charging mode so as to change magnitude of charging voltage supplied to the neutral point of the motor and to output the charging voltage to the battery.
    Type: Grant
    Filed: June 1, 2022
    Date of Patent: March 19, 2024
    Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: Ji Woong Jang, Sang Cheol Shin, Yoo Jong Lee, Ki Jong Lee, Ho Tae Chun
  • Publication number: 20240084176
    Abstract: An electrically conductive bonding tape includes a conductive first film between, and bonded to, conductive first and second adhesive layers. The first film and the first and second adhesive layers are conductive at least along a thickness direction of the bonding tape. Each of the first and second adhesive layers includes conductive particles dispersed substantially as a single layer in a substantially insulative adhesive material. The plurality of conductive particles in each of the first and second adhesive layers has an average particle size Pav and a standard of deviation Psd, such that Psd/Pav is less than about 0.2. Each of the first and second adhesive layers has an average thickness of no more than about 15% greater than the average particle size of the particles in the adhesive layer. An average surface roughness of opposing major first and second surfaces of the first film is less than 10 microns.
    Type: Application
    Filed: August 30, 2023
    Publication date: March 14, 2024
    Inventors: Junbeom Shin, Jeongwan Choi, Jong-Pil Kim
  • Patent number: 11921554
    Abstract: Disclosed is an apparatus for dynamic thermal management, which includes a thermal management unit that determines whether there is a need to perform thermal management on a processor based on temperatures measured from a plurality of temperature sensors included in the processor and generates an indication signal, and a controller that performs the thermal management on the processor in response to the indication signal, by using a first method of adjusting a state of each of a plurality of cores included in the processor, a second method of adjusting a level of an operating voltage and a frequency of a clock signal, which are provided to the processor, and/or a third method for adjusting only the frequency of the clock signal to be provided to the processor, and where each of the plurality of cores is in a wake-up state or an idle state.
    Type: Grant
    Filed: April 12, 2022
    Date of Patent: March 5, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jong-Lae Park, Bumgyu Park, Hanjun Shin, Daeyeong Lee, Choonghoon Park, Dahye Choi, Donghee Han
  • Patent number: 11918365
    Abstract: An electrocardiogram (ECG) measurement device for a vehicle is provided. The ECG measurement device includes an impedance compensator that corresponds to an electrode in contact with a body of a driver and configured to compensate an impedance of each of electrode signals received from the electrode. An electrode selector sequentially selects the electrode signals in response to receiving the electrode signals from the electrode. A differential amplifier differentially amplifies the electrode signals. In particular, each electrode signal has the compensated impedance. Additionally, a signal quality evaluator evaluates quality of an ECG signal output from the differential amplifier and a compensation controller then adjusts an impedance compensation value of each of the impedance compensators as a result of evaluating the quality of the ECG signal.
    Type: Grant
    Filed: November 15, 2021
    Date of Patent: March 5, 2024
    Assignees: Hyundai Motor Company, Kia Corporation
    Inventors: Yoon Jong Choi, Hyun Wook Jun, Yeong Joon Gil, Min Yong Shin, Soo Hwan Kim
  • Patent number: 11876019
    Abstract: Semiconductor devices and methods of forming the semiconductor devices are provided. The methods may include forming a fin, forming a first device isolating layer on a side of the fin, forming a second device isolating layer extending through the first device isolating layer, forming first and second gates traversing the fin and forming a third device isolating layer between the first and second gates. The first device isolating layer may include a first material and a lowermost surface at a first depth. The second device isolating layer may include a second material and a lowermost surface at a second depth greater than the first depth. The third device isolating layer may extend into the fin, may include a lowermost surface at a third depth less than the first depth and a third material different from the first and the second materials.
    Type: Grant
    Filed: November 10, 2021
    Date of Patent: January 16, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sung-Min Kim, Sunhom Steve Paak, Heon-Jong Shin, Dong-Ho Cha