Abstract: An auxiliary power supply device can include a first power storage unit, a first charging circuit to receive input power and charge the first power storage unit, a second power storage unit having lower power supply speed than the first power storage unit and longer power supply time than the first power storage unit, a second charge circuit to receive input power and charge the second power storage unit, and a switching unit to supply the stored power of the first power storage unit to external devices for a predetermined time when a sudden power-off occurs and supply stored power of the second power storage unit to the external devices after the predetermined time elapses.

Abstract: An auxiliary power supply device can include a first power storage unit, a first charging circuit to receive input power and charge the first power storage unit, a second power storage unit having lower power supply speed than the first power storage unit and longer power supply time than the first power storage unit, a second charge circuit to receive input power and charge the second power storage unit, and a switching unit to supply the stored power of the first power storage unit to external devices for a predetermined time when a sudden power-off occurs and supply stored power of the second power storage unit to the external devices after the predetermined time elapses.

Abstract: Provided is a semiconductor package and a chip package of the same. The semiconductor package includes: a first semiconductor chip mounted on a first package substrate; a chip package stacked on the first semiconductor chip; and a first terminal connecting the chip package directly and electrically to the first semiconductor chip, wherein the chip package includes a second semiconductor chip mounted on a second package substrate, and the second package substrate includes a first pad coupled to the first terminal and a second pad electrically connected to the first pad and electrically spaced apart from the first terminal.

Abstract: Provided is a semiconductor package and a chip package of the same. The semiconductor package includes: a first semiconductor chip mounted on a first package substrate; a chip package stacked on the first semiconductor chip; and a first terminal connecting the chip package directly and electrically to the first semiconductor chip, wherein the chip package includes a second semiconductor chip mounted on a second package substrate, and the second package substrate includes a first pad coupled to the first terminal and a second pad electrically connected to the first pad and electrically spaced apart from the first terminal.

Abstract: A near electric-field probe is driven by a short laser pulse delayed through an optical delay-line for detecting vectors of near-field components of electrical signals propagating through a device under test including an electrical device or an electronic circuit based on a sampling principle. The near-field probe includes a photoconductive switch assembly including a thin semiconductor photoconductive body, at least two separated switch electrodes formed on the thin semiconductor photoconductive body, and an electrode gap formed between the two separated switch electrodes; and an optical waveguide attached to one side of the photoconductive switch assembly by using an optical adhesive, wherein the optical waveguide is partially coated with conductive material on the outer surface thereof.

Abstract: A near electric-field probe is driven by a short laser pulse delayed through an optical delay-line for detecting vectors of near-field components of electrical signals propagating through a device under test including an electrical device or an electronic circuit based on a sampling principle. The near-field probe includes a photoconductive switch assembly including a thin semiconductor photoconductive body, at least two separated switch electrodes formed on the thin semiconductor photoconductive body, and an electrode gap formed between the two separated switch electrodes; and an optical waveguide attached to one side of the photoconductive switch assembly by using an optical adhesive, wherein the optical waveguide is partially coated with conductive material on the outer surface thereof.