Patents by Inventor Jong Keun Chung

Jong Keun Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11952652
    Abstract: Provided is a method of manufacturing a zinc-plated steel sheet. The method includes: coating a metal on the steel sheet on a steel sheet; annealing the metal coated steel sheet; and zinc plating the annealed steel sheet by dipping in a molten zinc plating bath. Further provided is a method of manufacturing a hot-press part including: coating a metal on the steel sheet on a steel sheet; annealing the metal coated steel sheet; zinc plating the annealed steel sheet by dipping in a molten zinc plating bath; heating the zinc-plated steel sheet; and press forming the heated steel sheet.
    Type: Grant
    Filed: March 7, 2018
    Date of Patent: April 9, 2024
    Assignee: POSCO CO., LTD
    Inventors: Il-Ryoung Sohn, Jong-Sang Kim, Joong-Chul Park, Yeol-Rae Cho, Jin-Keun Oh, Han-Gu Cho, Bong-Hoon Chung, Jong-Seog Lee
  • Patent number: 11945744
    Abstract: Disclosed are a method and apparatus for reusing wastewater. The method for reusing wastewater disclosed herein includes: generating a mixed wastewater by mixing multiple types of wastewater (S20); performing a first purification by passing the mixed wastewater through a flocculation-sedimentation unit (S40); performing a second purification by passing an effluent of the flocculation-sedimentation unit through a membrane bioreactor (MBR) (S60); performing a third purification by passing an effluent of the MBR through a reverse-osmosis membrane unit (S80); and reusing an effluent of the reverse-osmosis membrane unit as cooling water or industrial water (S100).
    Type: Grant
    Filed: April 14, 2023
    Date of Patent: April 2, 2024
    Assignees: SAMSUNG ENGINEERING CO., LTD., SAMSUNG ELECTRONICS CO., LTD
    Inventors: Seok Hwan Hong, Dae Soo Park, Seung Joon Chung, Yong Xun Jin, Jae Hyung Park, Jae Hoon Choi, Jae Dong Hwang, Jong Keun Yi, Su Hyoung Cho, Kyu Won Hwang, June Yurl Hur, Je Hun Kim, Ji Won Chun
  • Patent number: 6491904
    Abstract: The present invention relates to a topical composition containing human epidermal growth factor (hEGF) and polyoxyethylene-polyoxypropylene copolymer having a viscosity of 4-10 cps at 37° C, 60 rpm as the base for topical formulation to improve the wound healing ability of hEGF.
    Type: Grant
    Filed: September 6, 2000
    Date of Patent: December 10, 2002
    Assignee: Daewoong Pharmaceutical Co., Ltd.
    Inventors: Seung Yeob Lee, Jin Seok Kang, Jeom Soon Shim, Seung Wook Lim, Seung Hee Han, Byoung Kwang Lee, Young Hyo Yu, Jong Keun Chung