Patents by Inventor Jong Kuk Hong

Jong Kuk Hong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7351915
    Abstract: A printed circuit board (PCB) having at least one embedded capacitor and a method of fabricating the same is provided. A dielectric layer is formed using a ceramic material having a high capacitance, thereby assuring that the capacitors each have a high dielectric constant corresponding to the capacitance of a decoupling chip capacitor.
    Type: Grant
    Filed: November 29, 2004
    Date of Patent: April 1, 2008
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jin-Yong Ahn, Chang-Sup Ryu, Suk-Hyeon Cho, Seok-Kyu Lee, Jong-Kuk Hong, Ho-Sik Jun
  • Patent number: 7284317
    Abstract: Disclosed is a method of producing a printed circuit board (PCB) with an embedded resistor, in which a resistor with a desired shape and volume is precisely formed using a resistor paste so that resistance values according to a position of the PCB are uniform, thereby a laser trimming process is omitted or minimally utilized. The method has advantages in that a production time of the PCB is shortened and productivity is improved because an operation condition is rapidly set without being greatly affected by the position precision of a printing device. Other advantages of the method are that the resistor paste with a relatively uniform thickness is secured through a screen printing process, thereby easily forming the resistor and improving resistance tolerance.
    Type: Grant
    Filed: February 3, 2004
    Date of Patent: October 23, 2007
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Suk-Hyun Cho, Jang-Kyu Kang, Byung-Kook Sun, Jong-Kuk Hong, Seok-Kyu Lee, Jin-Yong Ahn
  • Patent number: 7277005
    Abstract: Disclosed is a PCB including an embedded resistor and a method of fabricating the same. The PCB includes a plurality of circuit layers in which circuit patterns are formed. A plurality of insulating layers is each interposed between the circuit layers. The embedded resistor is made of a resistive material and received in a receiving hole formed in the plurality of circuit layers and the plurality of insulating layers such that walls defining the receiving hole extends from one of the circuit layers to another circuit layer. The receiving hole has a closed section, and a conductive material is plated on the opposite walls of the walls defining the receiving hole.
    Type: Grant
    Filed: December 22, 2004
    Date of Patent: October 2, 2007
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Myung Sam Kang, Chang Sup Ryu, Jong Kuk Hong
  • Publication number: 20070146980
    Abstract: Disclosed is a PCB including embedded capacitors and a method of fabricating the same. A dielectric layer is formed using a ceramic material having a high capacitance, thereby assuring that the capacitors each have a high dielectric constant corresponding to the capacitance of a decoupling chip capacitor.
    Type: Application
    Filed: March 2, 2007
    Publication date: June 28, 2007
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin-Yong Ahn, Chang-Sup Ryu, Suk-Hyeon Cho, Seok-Kyu Lee, Jong-Kuk Hong, Ho-Sik Jun
  • Publication number: 20060044734
    Abstract: Disclosed is a PCB including embedded capacitors and a method of fabricating the same. A dielectric layer is formed using a ceramic material having a high capacitance, thereby assuring that the capacitors each have a high dielectric constant corresponding to the capacitance of a decoupling chip capacitor.
    Type: Application
    Filed: November 29, 2004
    Publication date: March 2, 2006
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jin-Yong Ahn, Chang-Sup Ryu, Suk-Hyeon Cho, Seok-Kyu Lee, Jong-Kuk Hong, Ho-Sik Jun
  • Publication number: 20060014327
    Abstract: Disclosed is a method of fabricating a PCB including an embedded passive chip, in which the passive chip is mounted on the PCB and an insulator is then laminated on the PCB, or in which a blind hole for receiving the passive chip is formed in the PCB and the passive chip is mounted in the blind hole.
    Type: Application
    Filed: October 29, 2004
    Publication date: January 19, 2006
    Inventors: Suk-Hyeon Cho, Seok-Kyu Lee, Jong-Kuk Hong, Ho-Sik Jun, Jin-Soo Jeong, Chang-Sup Ryu, Jin-Yong Ahn
  • Publication number: 20050175385
    Abstract: Disclosed is a method of producing a printed circuit board (PCB) with an embedded resistor, in which a resistor with a desired shape and volume is precisely formed using a resistor paste so that resistance values according to a position of the PCB are uniform, thereby a laser trimming process is omitted or minimally utilized. The method has advantages in that a production time of the PCB is shortened and productivity is improved because an operation condition is rapidly set without being greatly affected by the position precision of a printing device. Other advantages of the method are that the resistor paste with a relatively uniform thickness is secured through a screen printing process, thereby easily forming the resistor and improving resistance tolerance.
    Type: Application
    Filed: February 3, 2004
    Publication date: August 11, 2005
    Inventors: Suk-Hyun Cho, Jang-Kyu Kang, Byung-Kook Sun, Jong-Kuk Hong, Seok-Kyu Lee, Jin-Yong Ahn
  • Patent number: 6683014
    Abstract: The present invention provides a piezoelectric ceramic composition having the formula: {[Pb(1−1.5x)±(0˜0.2)Lax][Ti(1−y−z)MnyCuz]O3} which meets the requirements: 0.02<x<0.14, 0.01≦y<0.04, and 0.002≦z≦0.008. The piezoelectric ceramic composition of the present invention can be stably sintered under normal atmosphere. That is, there is no need for an oxygen partial pressure to be 80% or more. Furthermore, the composition exhibits excellent piezoelectric property and thermal stability. Accordingly, the piezoelectric ceramic composition of the present invention has excellent piezoelectric property at a thickness longitudinal third harmonic frequency capable of producing a high frequency of 15 MHz or more, and can be used as a material of a piezoelectric ceramic device with a small electrode area.
    Type: Grant
    Filed: July 30, 2002
    Date of Patent: January 27, 2004
    Assignee: S-Cera Co., Ltd.
    Inventors: Dong Hwan Seo, Kang Heon Hur, Jong Kuk Hong, Sang Koo Kwon
  • Patent number: 6656378
    Abstract: Disclosed is a piezoelectric ceramic composition comprising a PZT piezoelectric composition, a B-site of which is substituted with a certain material, and chromium oxide, and a piezoelectric device using the piezoelectric ceramic composition. The piezoelectric ceramic composition has good heat resistance and frequency stability, and reduces a leakage current. There is provided the piezoelectric ceramic composition comprising a main component expressed by Pb[(Co1/2W1/2)xTi1−x−yZry]O3 (wherein, 0.001≦x≦0.04, and 0.35 ≦y≦0.55), Cr2O3 in an amount of 0.01 to 2 wt %, MnO2 in an amount of 0.1 to 0.5 wt %, and an additive in an amount of 0.01 to 2.0 wt %, based on the total weight of the piezoelectric ceramic composition, in which the additive is selected from the group consisting of CoO, MgO, ZnO, Al2O3, Fe2O3, Sb2O3, SnO2, CeO2, Nb2O5, V2O5 and WO3, and mixtures thereof.
    Type: Grant
    Filed: February 8, 2002
    Date of Patent: December 2, 2003
    Assignee: S-Cera Co., Ltd.
    Inventors: Sang Koo Kwon, Kang Heon Hur, Jong Kuk Hong, Dong Hwan Seo
  • Publication number: 20030132418
    Abstract: Disclosed is a piezoelectric ceramic composition comprising a PZT piezoelectric composition, a B-site of which is substituted with a certain material, and chromium oxide, and a piezoelectric device using the piezoelectric ceramic composition. The piezoelectric ceramic composition has good heat resistance and frequency stability, and reduces a leakage current. There is provided the piezoelectric ceramic composition comprising a main component expressed by Pb[(Co1/2W1/2)xTi1-x-yZry]O3 (wherein, 0.001≦x≦0.04, and 0.35≦y≦0.55), Cr2O3 in an amount of 0.01 to 2 wt %, MnO2 in an amount of 0.1 to 0.5 wt %, and an additive in an amount of 0.01 to 2.0 wt %, based on the total weight of the piezoelectric ceramic composition, in which the additive is selected from the group consisting of CoO, MgO, ZnO, Al2O3, Fe2O3, Sb2O3, SnO2, CeO2, Nb2O5, V2O5 and WO3, and mixtures thereof.
    Type: Application
    Filed: February 8, 2002
    Publication date: July 17, 2003
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sang Koo Kwon, Kang Heon Hur, Jong Kuk Hong, Dong Hwan Seo
  • Publication number: 20030125190
    Abstract: The present invention provides a piezoelectric ceramic composition having the formula: {[Pb(1−1.5x)±(0˜0.2)Lax][Ti(1−y−z)MnyCUz]O3} which meets the requirements: 0.02<x<0.14, 0.01≦y<0.04, and 0.002≦z≦0.008.
    Type: Application
    Filed: July 30, 2002
    Publication date: July 3, 2003
    Applicant: Samsung Electro-Mechanics Co., Ltd
    Inventors: Dong Hwan Seo, Kang Heon Hur, Jong Kuk Hong, Sang Koo Kwon