Abstract: A semiconductor device includes a channel layer over an active region, first and second field regions adjacent the active region, and a gate structure over the channel layer and portions of the first and second field regions. The first and second field regions include grooves adjacent respective sidewalls of the channel layer, and bottom surfaces of the grooves are below a bottom surface of the channel layer.

Abstract: A semiconductor device includes an interlayer insulating film formed on a substrate, the insulating layer including a trench. A gate insulating layer is formed on a bottom surface of the trench and a reaction prevention layer is formed on the gate insulating layer on the bottom surface of the trench. A replacement metal gate structure is formed on the reaction prevention layer of the trench to fill the trench.

Abstract: A semiconductor device includes a device isolation layer disposed in a substrate and defining an active region, a first gate pattern on the active region, a first insulating layer on the substrate and the first gate pattern, a first body region on the first insulating layer, and a first substrate plug extending from the substrate into the first insulating layer, the first substrate plug penetrating the device isolation layer and contacting the substrate under the device isolation layer.

Abstract: Ternary CAM cells are provided. The ternary CAM cell includes a pair of half cells. Each of the half cells includes an isolation layer formed at a predetermined region of a semiconductor substrate to define a match cell active region. A search gate electrode and a node gate electrode are placed to cross over the match cell active region. A match line is electrically connected to the match cell active region, which is adjacent to the node gate electrode and is located opposite the search gate electrode. An SRAM cell is provided at the semiconductor substrate adjacent to the match cell active region. The node gate electrode is electrically connected to one of a pair of storage nodes of the SRAM cell.

Abstract: Ternary CAM cells are provided. The ternary CAM cell includes a pair of half cells. Each of the half cells includes an isolation layer formed at a predetermined region of a semiconductor substrate to define a match cell active region. A search gate electrode and a node gate electrode are placed to cross over the match cell active region. A match line is electrically connected to the match cell active region, which is adjacent to the node gate electrode and is located opposite the search gate electrode. An SRAM cell is provided at the semiconductor substrate adjacent to the match cell active region. The node gate electrode is electrically connected to one of a pair of storage nodes of the SRAM cell.

Abstract: A semiconductor device manufacturing method is provided. In this method for interconnecting conductive layers, an insulating layer is formed over the surface of a semiconductor substrate having conductive layers formed thereon. The insulating layer is removed from over the conductive layers and a silicon layer is coated on the overall surface of the resultant structure. The insulating layer and some silicon are then removed from an area except for the area from a first conductive layer through a second conductive layer, and a refractory metal layer is formed on the overall surface of the resultant structure. This refractory metal is used for silicidation. A metal silicide layer is then formed from the first conductive layer through the second conductive layer by thermally treating the refractory metal layer.

Abstract: A full CMOS SRAM cell having the capability of having a reduced aspect ratio is described. The SRAM cell includes first and second transfer transistors of n-channel types, first and second driving transistors of the n-channel types and first and second load transistors of p-channel types. Each of the transistors has source and drain regions on opposite sides of a channel region formed in a semiconductor substrate and a gate over the channel region. The cell includes a first common region defined by the drain regions of the first transfer transistor and the first driving transistor connected in series therethrough. A second common region is defined by the drain regions of the second transfer transistor and the second driving transistor connected in series therethrough. The drain region of the first load transistor is disposed adjacent to the first common region between the first and second common regions.

Abstract: A method for forming a bipolar transistor comprises the following steps. A collector region of a first conductivity type is formed in a substrate adjacent a surface thereof. A base region of a second conductivity type is then formed in the collector region adjacent the surface of the substrate. A base electrode is formed on a first portion of the substrate adjacent the base region wherein the base electrode comprises a dopant of the second conductivity type. Next, an emitter electrode is formed on a second portion of the substrate adjacent the base region wherein the emitter electrode comprises a dopant of the first conductivity type. The dopant of the second conductivity type from the base electrode is diffused into the first portion of the base region to increase a dopant concentration of the first portion of the base region adjacent the base electrode.

Abstract: A method for fabricating a BiCMOS device to achieve a maximum performance through a minimum processing steps, in which the BiCMOS device comprises high integration and high performance MOS transistors, self-aligned metal contact emitter type bipolar transistors having high load driving force, high performance matching characteristics and high integration, and self-aligned polycrystalline silicon emitter type bipolar transistors having high integration and high speed characteristics in low current, thereby being used in high integration, high speed digital and precise analog system. Said method comprises a plurality of fabrication steps including ion-implantation, formation of thin film oxide layer, deposition of nitride layer, etching of oxide layer, formation of windows and others, alternately or/and sequentially in a single chip substrate.

Abstract: A method with less processing steps for making a BiCMOS semiconductor device which can be used both in high-integration, high-speed digital devices and in precise analog devices by forming within a single substrate a CMOS transistor, a metal contact emitter bipolymer transistor having the high load driving power and highly effective matching characteristics, and a polycrystalline silicon emitter bipolar transistor having a high-speed characteristic at a low current level. Said device includes a first and a second MOSFET, and a first and a second bipolar transistor on a first conductivity-type silicon substrate, wherein performing a second conductivity-type of ion-implantation for producing a first substrate region to thereon form the first MOSFET, and a third and a fourth substrate region to thereon form the first and second bipolar transistors, respectively on said substrate. The second MOSFET is subsequently formed in a second substrate region being located between the first and third substrate regions.

Abstract: This invention provides a method for fabricating a semiconductor device comprising the steps of forming buried layers on the silicon substrate; etching an epitaxial layer after said layer is grown up, the step further including the processes of etching selectively the silicon epitaxial layer of well region on which a high speed bipolar transistor is formed to be thin and keeping the silicon epitaxial layer of well region on which nMOS transistor is formed remained the same thickness as grown up; and forming a pMOS transistor, a nMOS transistor and a bipolar transistor. High efficiency and high integration is easily attained in fabricating the high speed bipolar transistor and high performance CMOS transistor on same chip and by reducing the difficulty in processing according to the method of present invention.

Abstract: A method for fabricating a BiCMOS device to achieve a maximum performance through a of minimum processing steps, in which the BiCMOS device is exemplary for its high integration and high performance MOS transistors, self-aligned metal contact emitter type bipolar transistors having high load driving force, high performance matching characteristics and high integration, and self-aligned polycrystalline silicon emitter type bipolar transistors having high integration and high speed characteristics in low current, thereby being used in high integration, high speed digital and precise analog system. The method includes a plurality of fabrication steps including ion-implantation, formation of a thin film oxide layer, deposition of a nitride layer, etching of the oxide layer, formation of windows and others, alternately and/or sequentially in a single chip substrate.