Abstract: A process for fabricating a field emitter electrode includes: impregnating a cathode and anode in an electrolyte containing carbon nanotubes dispersed therein and applying a predetermined voltage to the cathode and anode so as to deposit carbon nanotubes on a substrate provided on the anode; recovering the substrate and applying a conductive polymer onto the surface of the substrate having carbon nanotubes deposited thereon; and heat treating the conductive polymer having carbon nanotubes deposited thereon, so as to completely cure it.

Abstract: A process for fabricating a field emitter electrode includes: impregnating a cathode and anode in an electrolyte containing carbon nanotubes dispersed therein and applying a predetermined voltage to the cathode and anode so as to deposit carbon nanotubes on a substrate provided on the anode; recovering the substrate and applying a conductive polymer onto the surface of the substrate having carbon nanotubes deposited thereon; and heat treating the conductive polymer having carbon nanotubes deposited thereon, so as to completely cure it.

Abstract: The present invention provides a field emitter electrode and a method for fabricating the same. The method comprises the steps of mixing a carbonizable polymer, carbon nanotubes and a solvent to prepare a carbon nanotube-containing polymer solution, electrospinning (or electrostatic spinning) the polymer solution to form a nanofiber web layer on a substrate, stabilizing the nanofiber web layer such that the polymer present in the nanofiber web layer is crosslinked, and carbonizing the nanofiber web layer such that the crosslinked polymer is converted to a carbon fiber.

Abstract: Provided is a method of manufacturing a high-power LED package, the method including the steps of: preparing a mold having an irregularity pattern; providing a transparent resin solid having an irregularity pattern provided on the surface thereof by using the mold; preparing an irregularity film with the irregularity pattern by cutting a portion of the transparent resin solid; preparing an LED package structure having a cavity in which an LED chip is mounted; filling transparent liquid resin into the cavity having the LED chip mounted therein; mounting the irregularity film on the transparent liquid resin such that the irregularity film projects from the cavity at a predetermined height; and curing the transparent liquid resin having the irregularity film mounted thereon. The irregularity pattern of the irregularity film projects from the cavity at a predetermined height.

Abstract: A light emitting diode package with reduced light loss includes a package substrate, a light emitting diode chip mounted on the package substrate and an encapsulant formed on the package substrate to encapsulate the light emitting diode chip. The encapsulant has a refractive index gradient with refractive indices continuously increasing from a peripheral surface thereof to a central axis thereof.

Abstract: A method of fabricating a micro lens, the method including: forming a photo-sensitive film on a substrate; placing a photo mask at a predetermined distance from a top of the photo-sensitive film; exposing the photo-sensitive film by varying an area of exposure of the photo-sensitive film so as to selectively expose three-dimensional structures of the photo-sensitive film corresponding to desired micro lenses; and developing the photo-sensitive film such that the exposed three-dimensional structures remain. Also, there is provided a method of fabricating a master for a micro lens, in which a master material is applied on the photo-sensitive film with the three-dimensional structures to form a master having the three-dimensional structures transferred thereonto.

Abstract: An LED package comprises a frame having a concave portion formed in the center thereof; one or more LED chips mounted on the bottom surface of the concave portion; and a lens filled in the concave portion, the lens having an upper surface formed of continuous prismatic irregularities forming concentric circles.

Abstract: A light emitting diode package with reduced light loss includes a package substrate, a light emitting diode chip mounted on the package substrate and an encapsulant formed on the package substrate to encapsulate the light emitting diode chip. The encapsulant has a refractive index gradient with refractive indices continuously increasing from a peripheral surface thereof to a central axis thereof.

Abstract: In a light emitting diode package, a package substrate includes a mounting area, an electrode and a light emitting diode chip disposed on the mounting area. A phosphor film encapsulates the light emitting diode chip in an upward convex configuration. A resin encapsulant encapsulates the phosphor film in an upward convex configuration. The light emitting diode package prevents light loss which arises from increased light scattering due to dense phosphors, thereby achieving excellent light extraction efficiency. Also, a phosphor film is formed by dispensing, thereby leading to no breaking of an upper wire even in a face-up chip.

Abstract: A light emitting diode package. A package substrate has first and second electrode structures and a light emitting diode is mounted on the package substrate and electrically connected to the first and second electrode structures. A resin encapsulant is made of a transparent resin to seal the light emitting diode. A plurality of transparent spherical particles having a refractive index higher than the transparent resin are dispersed in the resin encapsulant.

Abstract: A method of manufacturing a light emitting diode package. A cup-shaped package structure with a recess formed therein and an electrode structure formed on a bottom of the recess is prepared. A light emitting diode chip is mounted on a bottom of the recess with a terminal of the chip electrically connected to the electrode structure. A liquid-state transparent resin is injected in the recess and before the liquid-state transparent resin is completely cured, a stamp with a micro rough pattern engraved thereon is applied on an upper surface of the resin. The liquid-state transparent resin is cured with the stamp applied thereon to form a resin encapsulant and the stamp is removed from the resin encapsulant.

Abstract: The invention relates to a method of forming a phosphor film and a method of manufacturing an LED package incorporating the same. The method of forming a phosphor film includes mixing phosphor and light-transmitting beads in an aqueous solvent such that the nano-sized light-transmitting beads having a first charge are adsorbed onto surfaces of phosphor particles having a second charge. The method also includes coating a phosphor mixture obtained from the mixing step on an area where the phosphor film is to be formed, and drying the coated phosphor mixture to form the phosphor film. The invention further provides a method of manufacturing an LED package incorporating the method of forming the phosphor film.

Abstract: The present invention relates a manufacturing method for a multilayered piezoelectric/electrostrictive ceramic actuator by a sintering process at low temperature. The present invention makes feasible a high quality image and high speed printing, as large displacement and high speed actuation are feasible because it can get greater displacement and driving speed, even with small variation in driving voltage, because of piezoelectric/electrostrictive layer and upper electrode being alternately heaped to produce a multilayer structure.

Abstract: The present invention relates a manufacturing method of a multilayered piezoelectric/electrostrictive ceramic actuator by sintering process at low temperature and a multilayered piezoelectric/electrostrictive ceramic actuator manufactured by the method. The present invention as above makes effect feasible of high quality image and high speed printing as large displacement and high speed actuating is feasible because it can get great displacement and driving speed even with small variation in driving voltage because of piezoelectric/electrostrictive layer and upper electrode altenatingly heaped to multilayer.

Abstract: A manufacturing method for a multilayered piezoelectric/electrostrictive ceramic actuator by sintering process at low temperature, making feasible a high quality image and high speed printing, as large displacement and high speed actuation are feasible because it can get greater displacement and driving speed, even with small variation in driving voltage, because of piezoelectric/electrostrictive layer and upper electrode being alternately heaped to produce a multilayer structure.