Abstract: A dry surface cleaning apparatus removes surface contaminants on a surface of a workpiece. The dry surface cleaning apparatus has a laser for generating a laser beam, a sealed chamber for holding the workpiece therein, wherein the sealed chamber has a transparent window through which the laser beam is transmitted, and a laser focusing lens for converging the laser beam on a laser focus around the surface of the workpiece to generate a plasma shock wave around the laser focus.

Abstract: A dry surface cleaning apparatus removes surface contaminants on a surface of a workpiece. The dry surface cleaning apparatus includes a laser for generating a laser beam, a beam delivery control unit for splitting the laser beam into a first and a second laser beam, a frequency modulator for modulating the second laser beam to generate a shorter wavelength laser beam and a laser focusing lens for converging the first laser beam on a laser focus around the surface of the workpiece to generate a plasma shock wave around the laser focus.

Abstract: A dry surface cleaning apparatus removes surface contaminants on a surface of a workpiece. The dry surface cleaning apparatus has a laser for generating a laser beam, a sealed chamber for holding the workpiece therein, wherein the sealed chamber has a transparent window through which the laser beam is transmitted, and a laser focusing lens for converging the laser beam on a laser focus around the surface of the workpiece to generate a plasma shock wave around the laser focus.

Abstract: A dry surface cleaning apparatus removes surface contaminants on a surface of a workpiece. The dry surface cleaning apparatus includes a laser for generating a laser beam, a beam delivery control unit for splitting the laser beam into a first and a second laser beam, a frequency modulator for modulating the second laser beam to generate a shorter wavelength laser beam and a laser focusing lens for converging the first laser beam on a laser focus around the surface of the workpiece to generate a plasma shock wave around the laser focus.

Abstract: A mold set for encapsulating semiconductor chips on lead frame strips with a molding compound supplied in tablets, includes a pot where molding compound tablets are loaded and pressed to form a fluid molding compound (FMC), and a main runner connected to the pot, through which the FMC passes from the pot. A plurality of sub-runners are connected to the main runner and are oriented substantially radially from a center region of the main runner. Each sub-runner has a proximal end, where it joins the main runner, and a distal end. A plurality of cavities are disposed on both sides of the main runner. Each of the plurality of cavities is in flow to communication with the distal end of a respective one of the plurality of sub-runners. The present invention allows the FMC to be introduced into all cavities at nearly the same time and at nearly a constant velocity.