Patents by Inventor Jong-Seok Yang
Jong-Seok Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240164013Abstract: A printed circuit board including a first insulating layer; a plurality of first circuit patterns respectively disposed on the first insulating layer; a second insulating layer disposed on the first insulating layer and covering a portion of a side surface of each of the plurality of first circuit patterns; and an insulator disposed between at least one pair of adjacent first circuit patterns, among the plurality of first circuit patterns, and integrated with the first insulating layer, and a method for manufacturing a printed circuit board, are provided.Type: ApplicationFiled: July 12, 2023Publication date: May 16, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Heun LEE, Jong Eun PARK, Chan Jin PARK, Hyun Seok YANG, Tae Hee YOO
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Patent number: 11017918Abstract: Provided is a semi-conductive composition for a power cable, more particularly, a semi-conductive composition for a power cable having excellent mechanical properties and electrical properties, and more specifically, a semi-conductive composition for a power cable capable of having improved scorch stability, improved surface smoothness, improved space charge accumulation suppression characteristic to thereby be applicable to an ultra-high voltage direct current power cable.Type: GrantFiled: December 7, 2017Date of Patent: May 25, 2021Assignee: DYM SOLUTION CO., LTD.Inventors: Jong Seok Yang, Ki Joung Lee, Geun Bae Jeon, Dong Ha Park
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Patent number: 10626260Abstract: Provided is a semiconductive resin composition which may be used for both an internal semiconductive layer and an external semiconductive layer of a power cable, and in particular has excellent peelability to be used for the external semiconductive layer. In addition, a novel semiconductive resin composition having improved thermal resistance and mechanical physical properties, and an improved deterioration property is provided. The semiconductive resin composition for a power cable includes: 20 to 70 parts by weight of any one or two or more conductive particles selected from the group consisting of carbon black, graphite and graphene, based on 100 parts by weight of a composite resin including a polypropylene homopolymer having a melting point of 150 to 170° C. and an ethylene-(meth)acrylate-based resin.Type: GrantFiled: August 2, 2018Date of Patent: April 21, 2020Assignee: DYM SOLUTION CO., LTD.Inventors: Jong Seok Yang, Ki Joung Lee, Geun Bae Jeon, Dong Ha Park
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Patent number: 10442923Abstract: Provided is a semiconductive resin composition which may be used for both an internal semiconductive layer and an internal semiconductive layer of a power cable, and in particular has excellent peelability to be used for the external semiconductive layer. In addition, a novel semiconductive resin composition having improved thermal resistance and mechanical physical properties, and an improved deterioration property is provided. The semiconductive resin composition for a cable includes: 1 to 15 parts by weight of a multiwalled carbon nanotube as a conductive particle, and 1 to 10 parts by weight of an enhancer, based on 100 parts by weight of a composite resin including 10 to 250 parts by weight of an ethylene-(meth)acrylate-based resin and 1 to 100 parts by weight of an olefinic elastomer, based on 100 parts by weight of a polypropylene-based resin.Type: GrantFiled: August 2, 2018Date of Patent: October 15, 2019Assignee: DYM Solution Co., Ltd.Inventors: Jong Seok Yang, Jae Gyu Han, Geun Bae Jeon, Dong Ha Park
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Publication number: 20190180889Abstract: Provided is a semi-conductive composition for a power cable, more particularly, a semi-conductive composition for a power cable having excellent mechanical properties and electrical properties, and more specifically, a semi-conductive composition for a power cable capable of having improved scorch stability, improved surface smoothness, improved space charge accumulation suppression characteristic to thereby be applicable to an ultra-high voltage direct current power cable.Type: ApplicationFiled: December 7, 2017Publication date: June 13, 2019Inventors: Jong Seok Yang, Ki Joung Lee, Geun Bae Jeon, Dong Ha Park
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Publication number: 20190040244Abstract: Provided is a semiconductive resin composition which may be used for both an internal semiconductive layer and an external semiconductive layer of a power cable, and in particular has excellent peelability to be used for the external semiconductive layer. In addition, a novel semiconductive resin composition having improved thermal resistance and mechanical physical properties, and an improved deterioration property is provided. The semiconductive resin composition for a power cable includes: 20 to 70 parts by weight of any one or two or more conductive particles selected from the group consisting of carbon black, graphite and graphene, based on 100 parts by weight of a composite resin including a polypropylene homopolymer having a melting point of 150 to 170° C. and an ethylene-(meth)acrylate-based resin.Type: ApplicationFiled: August 2, 2018Publication date: February 7, 2019Inventors: Jong Seok YANG, Ki Joung Lee, Geun Bae Jeon, Dong Ha Park
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Publication number: 20190040243Abstract: Provided is a semiconductive resin composition which may be used for both an internal semiconductive layer and an internal semiconductive layer of a power cable, and in particular has excellent peelability to be used for the external semiconductive layer. In addition, a novel semiconductive resin composition having improved thermal resistance and mechanical physical properties, and an improved deterioration property is provided. The semiconductive resin composition for a cable includes: 1 to parts by weight of a multiwalled carbon nanotube as a conductive particle, and 1 to 10 parts by weight of an enhancer, based on 100 parts by weight of a composite resin including 10 to 250 parts by weight of an ethylene-(meth)acrylate-based resin and 1 to 100 parts by weight of an olefinic elastomer, based on 100 parts by weight of a polypropylene-based resin.Type: ApplicationFiled: August 2, 2018Publication date: February 7, 2019Inventors: Jong Seok Yang, Jae Gyu Han, Geun Bae Jeon, Dong Ha Park
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Patent number: 10174187Abstract: Provided are a room temperature crosslinked type halogen-free flame retardant resin composition and a method of preparing the same. Specifically, a room temperature crosslinked type halogen-free flame retardant resin composition according to the present invention including a polyethylene resin, a olefin-based elastomer, a metal hydroxy compound, a radical initiator, a crosslinked type alkoxysilane-based compound, a condensation catalyst of the crosslinked type alkoxysilane-based compound, and one or more crosslinking aids selected from the group consisting of an aliphatic acid and an aliphatic acid metal salt, and a method of preparing the same are provided. Further, a compound material and a masterbatch which are compositions for preparing the room temperature crosslinked type halogen-free flame retardant composition, and methods of preparing the same are provided.Type: GrantFiled: August 23, 2016Date of Patent: January 8, 2019Assignee: DYM SOLUTION CO., LTD.Inventors: Jong Seok Yang, Eun Ho Choi, Chan Ryoo, Baeg Yong Seong, Dong Ha Park
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Patent number: 9620261Abstract: A resin composition for producing an insulating material includes (A) 40 to 50% by weight of a base resin formed with a polyolefin-based resin or a derivative thereof, (B) 40 to 50% by weight of a magnesium hydroxide flame retardant of which surface is treated with vinyl silane, (C) 1 to 2% by weight of an antioxidant in which a first antioxidant and a second antioxidant are mixed in a weight ratio of 1:1 to 3, (D) 0.5 to 2% by weight of a lubricant, (E) 2 to 3% by weight of organosilane, (F) 0.05 to 0.2% by weight of an initiator, and (G) 1 to 4% by weight of a catalyst.Type: GrantFiled: February 9, 2015Date of Patent: April 11, 2017Assignees: HYUNDAI MOTOR COMPANY, DYM CO., LTD.Inventors: Seung Woo Choi, Dong Ha Park, Baeg Yong Seong, Eun Ho Choi, Jong Seok Yang
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Publication number: 20170058113Abstract: Provided are a room temperature crosslinked type halogen-free flame retardant resin composition and a method of preparing the same. Specifically, a room temperature crosslinked type halogen-free flame retardant resin composition according to the present invention including a polyethylene resin, a olefin-based elastomer, a metal hydroxy compound, a radical initiator, a crosslinked type alkoxysilane-based compound, a condensation catalyst of the crosslinked type alkoxysilane-based compound, and one or more crosslinking aids selected from the group consisting of an aliphatic acid and an aliphatic acid metal salt, and a method of preparing the same are provided. Further, a compound material and a masterbatch which are compositions for preparing the room temperature crosslinked type halogen-free flame retardant composition, and methods of preparing the same are provided.Type: ApplicationFiled: August 23, 2016Publication date: March 2, 2017Inventors: Jong Seok YANG, Eun Ho CHOI, Chan RYOO, Baeg Yong SEONG, Dong Ha PARK
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Publication number: 20150248948Abstract: A resin composition for producing an insulating material includes (A) 40 to 50% by weight of a base resin formed with a polyolefin-based resin or a derivative thereof, (B) 40 to 50% by weight of a magnesium hydroxide flame retardant of which surface is treated with vinyl silane, (C) 1 to 2% by weight of an antioxidant in which a first antioxidant and a second antioxidant are mixed in a weight ratio of 1:1 to 3, (D) 0.5 to 2% by weight of a lubricant, (E) 2 to 3% by weight of organosilane, (F) 0.05 to 0.2% by weight of an initiator, and (G) 1 to 4% by weight of a catalyst.Type: ApplicationFiled: February 9, 2015Publication date: September 3, 2015Inventors: Seung Woo CHOI, Dong Ha PARK, Baeg Yong SEONG, Eun Ho CHOI, Jong Seok YANG
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Publication number: 20100023927Abstract: An apparatus and method for MIDlet suite management using Digital Rights Management (DRM) in a mobile communication system are provided. A Java Application Descriptor (JAD) file transmission method of a transmit Mobile Station (MS) in a mobile communication system includes inserting a JAD file into an Open Mobile Alliance Digital Rights Management (OMA DRM) file, and transmitting the OMA DRM file in which the JAD file is inserted, to a receive MS.Type: ApplicationFiled: June 30, 2009Publication date: January 28, 2010Applicant: SAMSUNG ELECTRONICS CO. LTD.Inventors: Jong-Seok Yang, Kum-Hyun Cho