Patents by Inventor Jong-Sup Song
Jong-Sup Song has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240160486Abstract: A computing resource management system using software modularization in a cluster computing environment in which computing devices are connected, including an application process running on each computing device and an algorithm processing process configured to run independently of the application process and perform task processing on the application process, the computing resource management system including: a task managing system configured to receive a task request message from an application process requiring a task from each computing device; a process managing system configured to confirm an algorithm processing process of computing devices connected to the cluster computing environment, and determine whether there is an algorithm processing process in an idle state to which the application process requested for a task will be assigned; and a performed managing system configured to confirm a result of an application process whose task is performed by the algorithm processing process.Type: ApplicationFiled: October 17, 2023Publication date: May 16, 2024Inventors: Sang Hyun SON, Yeon Chul Song, Myeong Jun Lim, Ji Hoon Yoo, Kwang Sup Kim, Jong Min Lee, Young Ho Park, Jun Ho Oh, Joong Chol Shin, Hyun Cheol Cho
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Publication number: 20240139934Abstract: The inventive concept provides a teaching method for teaching a transfer position of a transfer robot. The teaching method includes: searching for an object on which a target object to be transferred by the transfer robot is placed, based on a 3D position information acquired by a first sensor; and acquiring coordinates of a second direction and coordinates of a third direction of the object based on a data acquired from a second sensor which is a different type from the first sensor.Type: ApplicationFiled: March 8, 2023Publication date: May 2, 2024Applicant: SEMES CO., LTD.Inventors: Jong Min Lee, Kwang Sup Kim, Myeong Jun Lim, Young Ho Park, Yeon Chul Song, Sang Hyun Son, Jun Ho Oh, Ji Hoon Yoo, Joong Chol Shin
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Patent number: 11677059Abstract: A light-emitting device package includes a lead frame, a light-emitting device chip, a molding structure, and a plurality of slots. The lead frame includes a first lead and a second lead including metal and spaced apart from each other. The light-emitting device chip is mounted on a first area of the lead frame, which includes a part of the first lead and a part of the second lead. The molding structure includes an outer barrier surrounding an outside of the lead frame and an inner barrier. The plurality of slots are formed in each of the first lead and the second lead. The inner barrier divides the lead from into the first area and a second area. The inner barrier fills between the first lead in the second lead. The second area is located outside of the first area. The plurality of slots are filled by the molding structure.Type: GrantFiled: April 6, 2021Date of Patent: June 13, 2023Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Ji-hoon Yun, Jong-sup Song, Seol-young Choi
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Patent number: 11631791Abstract: A semiconductor light-emitting device includes: a package substrate having a mounting surface on which a first circuit pattern and a second circuit pattern are disposed; a semiconductor LED chip mounted on the mounting surface, having a first surface which faces the mounting surface and on which a first electrode and a second electrode are disposed, a second surface opposing the first surface, and side surfaces located between the first surface and the second surface, the first electrode and the second electrode being connected to the first circuit pattern and the second circuit pattern, respectively; a wavelength conversion film disposed on the second surface; and a side surface inclined portion disposed on the side surfaces of the semiconductor LED chip, providing inclined surfaces, and including a light-transmitting resin containing a wavelength conversion material.Type: GrantFiled: March 29, 2021Date of Patent: April 18, 2023Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Mi Jeong Yun, Jong Sup Song
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Publication number: 20210226110Abstract: A light-emitting device package includes a lead frame, a light-emitting device chip, a molding structure, and a plurality of slots. The lead frame includes a first lead and a second lead including metal and spaced apart from each other. The light-emitting device chip is mounted on a first area of the lead frame, which includes a part of the first lead and a part of the second lead. The molding structure includes an outer barrier surrounding an outside of the lead frame and an inner barrier. The plurality of slots are formed in each of the first lead and the second lead. The inner barrier divides the lead from into the first area and a second area. The inner barrier fills between the first lead in the second lead. The second area is located outside of the first area. The plurality of slots are filled by the molding structure.Type: ApplicationFiled: April 6, 2021Publication date: July 22, 2021Inventors: JI-HOON YUN, Jong-sup Song, Seol-young Choi
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Publication number: 20210217933Abstract: A semiconductor light-emitting device includes: a package substrate having a mounting surface on which a first circuit pattern and a second circuit pattern are disposed; a semiconductor LED chip mounted on the mounting surface, having a first surface which faces the mounting surface and on which a first electrode and a second electrode are disposed, a second surface opposing the first surface, and side surfaces located between the first surface and the second surface, the first electrode and the second electrode being connected to the first circuit pattern and the second circuit pattern, respectively; a wavelength conversion film disposed on the second surface; and a side surface inclined portion disposed on the side surfaces of the semiconductor LED chip, providing inclined surfaces, and including a light-transmitting resin containing a wavelength conversion material.Type: ApplicationFiled: March 29, 2021Publication date: July 15, 2021Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Mi Jeong YUN, Jong Sup SONG
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Patent number: 10971668Abstract: A light-emitting device package includes a lead frame, a light-emitting device chip, a molding structure, and a plurality of slots. The lead frame includes a first lead and a second lead including metal and spaced apart from each other. The light-emitting device chip is mounted on a first area of the lead frame, which includes a part of the first lead and a part of the second lead. The molding structure includes an outer barrier surrounding an outside of the lead frame and an inner barrier. The plurality of slots are formed in each of the first lead and the second lead. The inner barrier divides the lead from into the first area and a second area. The inner barrier fills between the first lead in the second lead. The second area is located outside of the first area. The plurality of slots are filled by the molding structure.Type: GrantFiled: April 21, 2020Date of Patent: April 6, 2021Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Ji-hoon Yun, Jong-sup Song, Seol-young Choi
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Patent number: 10964854Abstract: A semiconductor light-emitting device includes: a package substrate having a mounting surface on which a first circuit pattern and a second circuit pattern are disposed; a semiconductor LED chip mounted on the mounting surface, having a first surface which faces the mounting surface and on which a first electrode and a second electrode are disposed, a second surface opposing the first surface, and side surfaces located between the first surface and the second surface, the first electrode and the second electrode being connected to the first circuit pattern and the second circuit pattern, respectively; a wavelength conversion film disposed on the second surface; and a side surface inclined portion disposed on the side surfaces of the semiconductor LED chip, providing inclined surfaces, and including a light-transmitting resin containing a wavelength conversion material.Type: GrantFiled: September 14, 2020Date of Patent: March 30, 2021Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Mi Jeong Yun, Jong Sup Song
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Patent number: 10892391Abstract: A light-emitting device package includes a lead frame, a light-emitting device chip, a molding structure, and a plurality of slots. The lead frame includes a first lead and a second lead including metal and spaced apart from each other. The light-emitting device chip is mounted on a first area of the lead frame, which includes a part of the first lead and a part of the second lead. The molding structure includes an outer barrier surrounding an outside of the lead frame and an inner barrier. The plurality of slots are formed in each of the first lead and the second lead. The inner barrier divides the lead from into the first area and a second area. The inner barrier fills between the first lead in the second lead. The second area is located outside of the first area. The plurality of slots are filled by the molding structure.Type: GrantFiled: August 26, 2019Date of Patent: January 12, 2021Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Ji-hoon Yun, Jong-sup Song, Seol-young Choi
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Publication number: 20200411732Abstract: A semiconductor light-emitting device includes: a package substrate having a mounting surface on which a first circuit pattern and a second circuit pattern are disposed; a semiconductor LED chip mounted on the mounting surface, having a first surface which faces the mounting surface and on which a first electrode and a second electrode are disposed, a second surface opposing the first surface, and side surfaces located between the first surface and the second surface, the first electrode and the second electrode being connected to the first circuit pattern and the second circuit pattern, respectively; a wavelength conversion film disposed on the second surface; and a side surface inclined portion disposed on the side surfaces of the semiconductor LED chip, providing inclined surfaces, and including a light-transmitting resin containing a wavelength conversion material.Type: ApplicationFiled: September 14, 2020Publication date: December 31, 2020Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Mi Jeong YUN, Jong Sup Song
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Patent number: 10777712Abstract: A semiconductor light-emitting device includes: a package substrate having a mounting surface on which a first circuit pattern and a second circuit pattern are disposed; a semiconductor LED chip mounted on the mounting surface, having a first surface which faces the mounting surface and on which a first electrode and a second electrode are disposed, a second surface opposing the first surface, and side surfaces located between the first surface and the second surface, the first electrode and the second electrode being connected to the first circuit pattern and the second circuit pattern, respectively; a wavelength conversion film disposed on the second surface; and a side surface inclined portion disposed on the side surfaces of the semiconductor LED chip, providing inclined surfaces, and including a light-transmitting resin containing a wavelength conversion material.Type: GrantFiled: August 22, 2018Date of Patent: September 15, 2020Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Mi Jeong Yun, Jong Sup Song
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Publication number: 20200251643Abstract: A light-emitting device package includes a lead frame, a light-emitting device chip, a molding structure, and a plurality of slots. The lead frame includes a first lead and a second lead including metal and spaced apart from each other. The light-emitting device chip is mounted on a first area of the lead frame, which includes a part of the first lead and a part of the second lead. The molding structure includes an outer barrier surrounding an outside of the lead frame and an inner barrier. The plurality of slots are formed in each of the first lead and the second lead. The inner barrier divides the lead from into the first area and a second area. The inner barrier fills between the first lead in the second lead. The second area is located outside of the first area. The plurality of slots are filled by the molding structure.Type: ApplicationFiled: April 21, 2020Publication date: August 6, 2020Inventors: Ji-hoon YUN, Jong-sup SONG, Seol-young CHOI
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Patent number: 10699991Abstract: A packaged light emitting device can include a mounting substrate including first and second electrode portions that are separated by a recess defined by a first side surface of the first electrode portion and a second side surface of the second electrode portion that is opposite the first side surface. An insulation support member can partially fill a lower portion of the recess to partially cover the first side surface and partially cover the second side surface. A light emitting device can be coupled to the first and second electrode portions of the mounting substrate and a sealing member can be on the mounting substrate covering the light emitting device.Type: GrantFiled: December 14, 2017Date of Patent: June 30, 2020Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Chi-Goo Kang, Sun-Woo Kim, Jong-Sup Song, Ho-Young Song
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Patent number: 10678036Abstract: An optical device is provided. The optical device includes a first surface that defines a concave light incident surface facing a central axis and a light source; a second surface disposed opposite the first surface which is configured to reflect light incident on the concave light incident surface; and an inclined light exit surface between the first surface and the second surface. The second surface includes a concave first reflective portion curving toward the first surface, and a substantially flat second reflective portion which portion is interposed between a first reflective portion edge of the first reflective portion and an outer second surface edge of the second surface. The first reflective portion is configured to totally reflect light incident at a predetermined angle or more with respect to a top surface of the light source once to the light exit surface.Type: GrantFiled: June 28, 2018Date of Patent: June 9, 2020Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sang Woo Ha, Tetsuo Ariyoshi, Kyung Mi Moon, Jong Sup Song, Jong Pil Won
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Patent number: 10644191Abstract: A semiconductor package separating device is provided. The semiconductor package separating device includes a die configured to support a lead frame array including a fixing portion inserted into an insertion groove formed on at least a side surface of a semiconductor package to support the semiconductor package; and a cylindrical punch configured to rotate in a rotational direction, the cylindrical punch including a bending protrusion and a package separating protrusion that are provided on an outer circumferential surface of the cylindrical punch, the bending protrusion being configured to apply pressure to the fixing portion to bend the fixing portion, and the package separating protrusion being configured to apply pressure to the semiconductor package to separate the semiconductor package from the lead frame array in a state in which the fixing portion has been bent by the bending protrusion.Type: GrantFiled: May 15, 2018Date of Patent: May 5, 2020Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jong Ho Lim, Jong Sup Song, Houn Joung
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Publication number: 20200058839Abstract: A light-emitting device package includes a lead frame, a light-emitting device chip, a molding structure, and a plurality of slots. The lead frame includes a first lead and a second lead including metal and spaced apart from each other. The light-emitting device chip is mounted on a first area of the lead frame, which includes a part of the first lead and a part of the second lead. The molding structure includes an outer barrier surrounding an outside of the lead frame and an inner barrier. The plurality of slots are formed in each of the first lead and the second lead. The inner barrier divides the lead from into the first area and a second area. The inner barrier fills between the first lead in the second lead. The second area is located outside of the first area. The plurality of slots are filled by the molding structure.Type: ApplicationFiled: August 26, 2019Publication date: February 20, 2020Inventors: JI-HOON YUN, Jong-sup SONG, Seol-young CHOI
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Patent number: 10510936Abstract: A light-emitting device package includes a lead frame, a light-emitting device chip, a molding structure, and a plurality of slots. The lead frame includes a first lead and a second lead including metal and spaced apart from each other. The light-emitting device chip is mounted on a first area of the lead frame, which includes a part of the first lead and a part of the second lead. The molding structure includes an outer barrier surrounding an outside of the lead frame and an inner barrier. The plurality of slots are formed in each of the first lead and the second lead. The inner barrier divides the lead from into the first area and a second area. The inner barrier fills between the first lead in the second lead. The second area is located outside of the first area. The plurality of slots are filled by the molding structure.Type: GrantFiled: October 27, 2017Date of Patent: December 17, 2019Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Ji-hoon Yun, Jong-sup Song, Seol-young Choi
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Patent number: 10408430Abstract: There are provided a lighting lens, a lighting lens array, and a lighting apparatus. The lighting lens may include an incidence part to receive light from a light source and an emission part to emit light provided from the incidence part. The incidence part may have a concave region that contains a light source and a first protrusion at a rear side of the light source that protrudes downwards from a top surface of the concave region. The emission part may include a dome-shaped part that encloses the incidence part and a second protrusion at the rear side of the light source that protrudes upwards from a top surface of the dome-shaped part. A lowermost portion of the emission part may be formed at a first plane, and an angle between an outer surface of the emission part and the first plane is an obtuse angle.Type: GrantFiled: September 22, 2017Date of Patent: September 10, 2019Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Seung-gyun Jung, Won-soo Ji, Jong-sup Song, Sang-woo Ha
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Publication number: 20190155009Abstract: An optical device is provided. The optical device includes a first surface that defines a concave light incident surface facing a central axis and a light source; a second surface disposed opposite the first surface which is configured to reflect light incident on the concave light incident surface; and an inclined light exit surface between the first surface and the second surface. The second surface includes a concave first reflective portion curving toward the first surface, and a substantially flat second reflective portion which portion is interposed between a first reflective portion edge of the first reflective portion and an outer second surface edge of the second surface. The first reflective portion is configured to totally reflect light incident at a predetermined angle or more with respect to a top surface of the light source once to the light exit surface.Type: ApplicationFiled: June 28, 2018Publication date: May 23, 2019Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sang Woo HA, Tetsuo ARIYOSHI, Kyung Mi MOON, Jong Sup SONG, Jong Pil WON
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Publication number: 20190131488Abstract: A semiconductor package separating device is provided. The semiconductor package separating device includes a die configured to support a lead frame array including a fixing portion inserted into an insertion groove formed on at least a side surface of a semiconductor package to support the semiconductor package; and a cylindrical punch configured to rotate in a rotational direction, the cylindrical punch including a bending protrusion and a package separating protrusion that are provided on an outer circumferential surface of the cylindrical punch, the bending protrusion being configured to apply pressure to the fixing portion to bend the fixing portion, and the package separating protrusion being configured to apply pressure to the semiconductor package to separate the semiconductor package from the lead frame array in a state in which the fixing portion has been bent by the bending protrusion.Type: ApplicationFiled: May 15, 2018Publication date: May 2, 2019Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jong Ho LIM, Jong Sup SONG, Houn JOUNG