Abstract: Provided are a tungsten precursor compound to which a substituent is bonded so as to obtain thermal stability and a method of forming a tungsten-containing film using the precursor.

Abstract: The present invention relates to a tungsten precursor compound to which a substituent is bonded so as to obtain thermal stability and a tungsten-containing film in a mild condition at a high yield, and a process for producing the same. The present invention also provides a method for depositing tungsten-containing film.

Abstract: The present invention relates to a conductive metal ink composition, comprising: a first metal powder having conductivity; a non-aqueous solvent; an attachment improving agent; and a polymer coating property improving agent, and a method for forming a conductive pattern by using the conductive metal ink composition, and the conductive metal ink composition can be appropriately applied to a roll printing process and a conductive pattern exhibiting more improved conductivity and excellent attachment ability with respect to a board can be formed.

Abstract: An exemplary embodiment of the present invention relates to a conductive metal ink composition comprising a conductive metal powder; a non-aqueous solvent; an organo phosphate compound; and a polymer coating property improving agent, and a method for forming a conductive pattern by using the conductive metal ink composition.

Abstract: The present invention relates to a conductive metal ink composition which is properly applied for roll-printing process to form conductive pattern with improved conductivity, and the method of preparing a conductive pattern using the same. The conductive metal ink composition comprises a conductive metal powder; an organic silver complex where an organic ligand including amine group and hydroxyl group binds with a silver (Ag) salt of aliphatic carboxylic acid; a non-aqueous solvent comprising a first non-aqueous solvent having a vapor pressure of 3 torr or lower at 25° C. and a second non-aqueous solvent having a vapor pressure of higher than 3 torr at 25° C.; and a coatability improving polymer.

Abstract: The present invention relates to a conductive metal ink composition which is properly applied for roll-printing process to form conductive pattern, and the method of preparing a conductive pattern using the same. The conductive metal ink composition comprises a conductive metal powder; a non-aqueous solvent comprising a first non-aqueous solvent having a vapor pressure of 3 torr or lower at 25° C. and a second non-aqueous solvent having a vapor pressure of higher than 3 torr at 25° C.; and a coatability improving polymer and is coated for forming the conductive pattern by the roll printing method.

Abstract: The present invention relates to a conductive metal ink composition which is properly applied for roll-printing process to form conductive pattern with improved conductivity, and the method of preparing a conductive pattern using the same. The conductive metal ink composition comprises a conductive metal powder; an organic silver complex where an organic ligand including amine group and hydroxyl group binds with a silver (Ag) salt of aliphatic carboxylic acid; a non-aqueous solvent comprising a first non-aqueous solvent having a vapor pressure of 3 torr or lower at 25° C. and a second non-aqueous solvent having a vapor pressure of higher than 3 torr at 25° C.; and a coatability improving polymer.

Abstract: Disclosed are lead free glass frit powder for manufacturing a silicon solar cell, its producing method, a metal paste composition containing the same and a silicon solar cell. The lead free glass frit powder for manufacturing a silicon solar cell includes Bi2O3; B2O3; and any one metal oxide selected from the group consisting of ZnO, Al2O3 and BaCO3, or mixtures thereof. The glass frit powder is free of lead, and thus, it is environmental friendly. A front electrode of a solar cell formed using the glass frit powder has low resistance against contact with a substrate and high adhesion to the substrate.

Abstract: The present invention relates to a conductive metal ink composition which is properly applied for roll-printing process to form conductive pattern with improved conductivity, and the method of preparing a conductive pattern using the same. The conductive metal ink composition comprises a conductive metal powder; an organic silver complex where an organic ligand including amine group and hydroxyl group binds with a silver (Ag) salt of aliphatic carboxylic acid; a non-aqueous solvent comprising a first non-aqueous solvent having a vapor pressure of 3 torr or lower at 25° C. and a second non-aqueous solvent having a vapor pressure of higher than 3 torr at 25° C.; and a coatability improving polymer.

Abstract: The present invention relates to a conductive metal ink composition, comprising: a first metal powder having conductivity; a non-aqueous solvent; an attachment improving agent; and a polymer coating property improving agent, and a method for forming a conductive pattern by using the conductive metal ink composition, and the conductive metal ink composition can be appropriately applied to a roll printing process and a conductive pattern exhibiting more improved conductivity and excellent attachment ability with respect to a board can be formed.

Abstract: An exemplary embodiment of the present invention relates to a conductive metal ink composition comprising a conductive metal powder; a non-aqueous solvent; an organo phosphate compound; and a polymer coating property improving agent, and a method for forming a conductive pattern by using the conductive metal ink composition.

Abstract: Disclosed are lead free glass frit powder for manufacturing a silicon solar cell, its producing method, a metal paste composition containing the same and a silicon solar cell. The lead free glass frit powder for manufacturing a silicon solar cell includes Bi2O3; B2O3; and any one metal oxide selected from the group consisting of ZnO, Al2O3 and BaCO3, or mixtures thereof. The glass frit powder is free of lead, and thus, it is environmental friendly. A front electrode of a solar cell formed using the glass frit powder has low resistance against contact with a substrate and high adhesion to the substrate.

Abstract: The present invention relates to a conductive metal ink composition which is properly applied for roll-printing process to form conductive pattern with improved conductivity, and the method of preparing a conductive pattern using the same. The conductive metal ink composition comprises a conductive metal powder; an organic silver complex where an organic ligand including amine group and hydroxyl group binds with a silver (Ag) salt of aliphatic carboxylic acid; a non-aqueous solvent comprising a first non-aqueous solvent having a vapor pressure of 3 torr or lower at 25° C. and a second non-aqueous solvent having a vapor pressure of higher than 3 torr at 25° C.; and a coatability improving polymer.

Abstract: The present invention relates to a conductive metal ink composition which is properly applied for roll-printing process to form conductive pattern, and the method of preparing a conductive pattern using the same. The conductive metal ink composition comprises a conductive metal powder; a non-aqueous solvent comprising a first non-aqueous solvent having a vapor pressure of 3 torr or lower at 25° C. and a second non-aqueous solvent having a vapor pressure of higher than 3 torr at 25° C.; and a coatability improving polymer and is coated for forming the conductive pattern by the roll printing method.

Abstract: Disclosed are lead free glass frit powder for manufacturing a silicon solar cell, its producing method, a metal paste composition containing the same and a silicon solar cell. The lead free glass frit powder for manufacturing a silicon solar cell includes Bi2O3; B2O3; and any one metal oxide selected from the group consisting of ZnO, Al2O3 and BaCO3, or mixtures thereof. The glass frit powder is free of lead, and thus, it is environmental friendly. A front electrode of a solar cell formed using the glass frit powder has low resistance against contact with a substrate and high adhesion to the substrate.

Abstract: Disclosed is ink for ink jet printing, which comprises: metal nanoparticles comprising a surfactant attached to surfaces thereof; and a first solvent, wherein the metal nanoparticles are present in an amount of 50˜70 parts by weight based on 100 parts by weight of the ink, and the surfactant is present in an amount of 0.5˜5 parts by weight based on 100 parts by weight of the metal nanoparticles. Metal nanoparticles used in the ink and a method for preparing the metal nanoparticles are also disclosed. The method for preparing metal nanoparticles for use in ink for ink jet printing comprises a step of washing surplus surfactant with at least one solvent. By doing so, the surplus surfactant remaining on the surfaces of the metal nanoparticles can be minimized, resulting in a drop in viscosity of ink comprising the metal nanoparticles.

Abstract: The present invention relates to a conductive pattern and a method for forming the conductive pattern, and more particularly, to a method for forming a conductive pattern, which comprises the steps of 1) preparing a substrate; 2) forming a first pattern by printing a first composition that includes an adhesion promoter and a solvent on the substrate; 3) forming a second pattern by printing a second composition that includes a conductive particle and a solvent on the first pattern; and 4) sintering the first pattern and the second pattern. The method for forming the conductive pattern according to the present invention may improve an adhesion property between a pattern and a substrate and may form a fine pattern having high resolution without formation of bank on a hydrophobic substrate.

Abstract: Disclosed is ink for ink jet printing, which comprises: metal nanoparticles comprising a surfactant attached to surfaces thereof; and a first solvent, wherein the metal nanoparticles are present in an amount of 50˜70 parts by weight based on 100 parts by weight of the ink, and the surfactant is present in an amount of 0.5˜5 parts by weight based on 100 parts by weight of the metal nanoparticles. Metal nanoparticles used in the ink and a method for preparing the metal nanoparticles are also disclosed. The method for preparing metal nanoparticles for use in ink for ink jet printing comprises a step of washing surplus surfactant with at least one solvent. By doing so, the surplus surfactant remaining on the surfaces of the metal nanoparticles can be minimized, resulting in a drop in viscosity of ink comprising the metal nanoparticles.

Abstract: Disclosed is a dispersion adjuvant for metal nanoparticles, which comprises an amide derivative. Metal nanoink comprising the dispersion adjuvant is also disclosed. The dispersion adjuvant helps metal nanoparticles to be dispersed in a solvent in the presence of a dispersant, inhibits metal particles from agglomerating among themselves, and increases the content of metal nanoparticles in a solvent. Additionally, interconnection lines formed by using the nanoink have an increased content of metal per unit area, and thus provide improved conductivity.