Patents by Inventor Jong-Yong Park
Jong-Yong Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11988228Abstract: Air compressor for a vehicle having improved internal cooling efficiency by ensuring a circulation flow of compressed air for internal cooling and allowing the compressed air to sufficiently flow. The air compressor comprises: a housing with a compression unit for introducing and compressing air from outside; a motor unit which includes a rotor and a stator, and drives the compression unit to rotate according to the rotation of the rotor; a bearing unit supporting the rotor to be rotatable; a cooling circulation flow path formed inside the housing for moving, in an axial direction, some of the air compressed in the compression unit and circulating the air to the compression unit; and a bypass flow path which receives some of the air passing through the cooling circulation flow path and bypasses a partial region of the bearing unit to join the cooling circulation flow path.Type: GrantFiled: September 29, 2020Date of Patent: May 21, 2024Assignee: Hanon SystemsInventors: Gun Woong Park, Chi Yong Park, Jong Sung Lee, Kyu Sung Choi
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Patent number: 11981659Abstract: The present invention relates to novel mesylate salt of N-(5-(4-(4-((dimethylamino)methyl)-3-phenyl-1H-pyrazol-1-yl)pyrimidine-2-ylamino)-4-methoxy-2-morpholinophenyl)acrylamide, a novel crystalline form thereof, and a process for preparing the same. More specifically, the present invention relates to mesylate salt of N-(5-(4-(4-((dimethylamino)methyl)-3-phenyl-1H-pyrazol-1-yl)pyrimidine-2-ylamino)-4-methoxy-2-morpholinophenyl)acrylamide, which is excellent in stability, solubility, and bioavailability when it is administered not only alone but also in combination with other drugs and which has a high purity, a crystalline form thereof, and a process for preparing the same.Type: GrantFiled: March 17, 2022Date of Patent: May 14, 2024Assignee: Yuhan CorporationInventors: Sang Ho Oh, Jong Gyun Kim, Se-Woong Oh, Tae Dong Han, Soo Yong Chung, Seong Ran Lee, Kyeong Bae Kim, Young Sung Lee, Woo Seob Shin, Hyun Ju, Jeong Ki Kang, Su Min Park, Dong Kyun Kim
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Patent number: 11982283Abstract: The present invention relates to a compressor and, more specifically, to an air compressor for a vehicle, which can support a rotor disk and form a cooling flow channel by a first cover and a second cover, and thus can improve cooling efficiency while increasing manufacturability.Type: GrantFiled: April 1, 2021Date of Patent: May 14, 2024Assignee: Hanon SystemsInventors: Chi Yong Park, Hyun Chil Kim, Gunwoong Park, Min Gyu Park, Yeol Woo Sung, Hyun Sup Yang, Jong Sung Lee, Kyu Sung Choi
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Publication number: 20240125334Abstract: An air compressor according to an aspect of the present invention comprises: a housing; a rotating shaft which is disposed in the housing; a compression unit which is connected to the rotating shaft to compress and discharge inlet air; a motor unit which drives the rotating shaft; a control board which controls the motor unit; and a filter unit which filters out noise from external power and supplies the external power to the control board, wherein the housing includes a first cooling flow channel for cooling the motor unit and a second cooling flow channel for cooling the filter unit, and the first cooling flow channel communicates with the second cooling flow channel.Type: ApplicationFiled: March 30, 2022Publication date: April 18, 2024Inventors: Kyu Sung CHOI, Hyun Chil KIM, Gun Woong PARK, Min Gyu PARK, Chi Yong PARK, Yeol Woo SUNG, Hyun Sup YANG, Jong Sung LEE
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Publication number: 20240128173Abstract: A semiconductor package includes a first package substrate having a first region and a second region, which do not overlap each other, a first connection element having a first height on the first region, a first semiconductor chip having a second height connected to the first connection element, a second connection element having a third height on the second region, a third connection element having a fourth height on the second connection element and electrically connected to the second connection element, a second package on the third connection element, the second package including a second package substrate and a second semiconductor chip, and a first mold layer covering at least a portion of the first semiconductor chip, covering at least a portion of the second connection element, covering the first package substrate, exposing upper surfaces of the first semiconductor chip and the second connection element, and having a fifth height.Type: ApplicationFiled: May 19, 2023Publication date: April 18, 2024Inventors: Ji-Yong Park, Jong Bo Shim, Dae Hun Lee, Choong Bin Yim
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Publication number: 20240105567Abstract: A semiconductor package includes a first package substrate having a first area and a second area that is distinct and separate from the first area, a first connection element disposed on the first area and having a first thickness, a first semiconductor chip connected to the first connection element, a second connection element disposed on the second area and having a second thickness that is greater than the first thickness, a third connection element disposed on the second connection element and electrically connected to the second connection element, a second package substrate disposed on the third connection element, and a second semiconductor chip disposed on the second package substrate.Type: ApplicationFiled: August 23, 2023Publication date: March 28, 2024Inventors: Choong Bin YIM, Ji Yong PARK, Jong Bo SHIM
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Publication number: 20240107002Abstract: A method for coding image information includes generating prediction information by predicting information on a current coding unit, and determining whether the information on the current coding unit is the same as the prediction information. When the information on the current coding unit is the same as the prediction information, a flag indicating that the information on the current coding unit is the same as the prediction information is coded and transmitted. When the information on the current coding unit is not the same as the prediction information, a flag indicating that the information on the current coding unit is not the same as the prediction information and the information on the current coding unit are coded and transmitted.Type: ApplicationFiled: December 6, 2023Publication date: March 28, 2024Applicants: Electronics and Telecommunications Research Institute, University-Industry Cooperation Group of Kyung Hee UniversityInventors: Se Yoon JEONG, Hui Yong KIM, Sung Chang LIM, Jin Ho LEE, Ha Hyun LEE, Jong Ho KIM, Jin Soo CHOI, Jin Woong KIM, Chie Teuk AHN, Gwang Hoon PARK, Kyung Yong KIM, Tae Ryong KIM, Han Soo LEE
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Publication number: 20240073416Abstract: The present invention relates to an apparatus and method for encoding and decoding an image by skip encoding. The image-encoding method by skip encoding, which performs intra-prediction, comprises: performing a filtering operation on the signal which is reconstructed prior to an encoding object signal in an encoding object image; using the filtered reconstructed signal to generate a prediction signal for the encoding object signal; setting the generated prediction signal as a reconstruction signal for the encoding object signal; and not encoding the residual signal which can be generated on the basis of the difference between the encoding object signal and the prediction signal, thereby performing skip encoding on the encoding object signal.Type: ApplicationFiled: November 6, 2023Publication date: February 29, 2024Applicants: Electronics and Telecommunications Research Institute, Kwangwoon University Industry-Academic Collaboration Foundation, Universily-lndustry Cooperation Group of Kyung Hee UniversityInventors: Sung Chang LIM, Ha Hyun LEE, Se Yoon JEONG, Hui Yong KIM, Suk Hee CHO, Jong Ho KIM, Jin Ho LEE, Jin Soo CHOI, Jin Woong KIM, Chie Teuk AHN, Dong Gyu SIM, Seoung Jun OH, Gwang Hoon PARK, Sea Nae PARK, Chan Woong JEON
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Publication number: 20230199947Abstract: Disclosed are a copper-clad laminate film and an electronic device including the same. The copper-clad laminate film includes a fluorine-containing substrate, a tie layer disposed on the fluorine-containing substrate, and a copper layer disposed on the tie layer, wherein the tie layer may be a metal layer or metal alloy layer including a metal of a metal-oxygen (M-O) bond dissociation energy of 400 kJ/mol or more, and the tie layer may have a thickness of about 10 nm to about 100 nm.Type: ApplicationFiled: December 14, 2022Publication date: June 22, 2023Inventors: Jong Hun Cheon, Ha Soo Lee, Jong Yong Park
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Publication number: 20230125635Abstract: Disclosed are a copper-clad laminate film and an electronic device including the same. The copper-clad laminate film includes: a polyimide-based substrate having a fluorine layer disposed on at least one side thereof; a tie-layer disposed on the polyimide-based substrate having the fluorine layer placed thereon; and a copper layer disposed on the tie layer, wherein the tie-layer includes at least one metal element selected from among metal elements of Group 4, Group 6, Group 13, and Group 14 in the Periodic Table, and the at least one metal element may have a metal-oxygen (M-O) bond dissociation energy of 400 kJ/mol or more.Type: ApplicationFiled: September 28, 2022Publication date: April 27, 2023Inventors: Jong Yong Park, Ha Soo Lee, Jong Hun Cheon
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Patent number: 11048307Abstract: A dual camera module includes a single housing accommodating a plurality of lens modules, a first actuator configured to move one of the plurality of lens modules in an optical axis direction, and a plurality of printed circuit boards attached to a lower portion of the single housing. One printed circuit board corresponding to a lens module moved by the first actuator, among the plurality of printed circuit boards, is disposed to be lower than the other printed circuit boards in the optical axis direction.Type: GrantFiled: March 26, 2019Date of Patent: June 29, 2021Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Won Ki Park, Jong Woo Kim, Jong Yong Park, Seok Jo Hwang, Ick Chan Shim, Dae Hyun Jeong, Byung Gi An, Dae Wook Kim, Kyung Hoon Choi
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Publication number: 20190369678Abstract: A dual camera module includes a single housing accommodating a plurality of lens modules, a first actuator configured to move one of the plurality of lens modules in an optical axis direction, and a plurality of printed circuit boards attached to a lower portion of the single housing. One printed circuit board corresponding to a lens module moved by the first actuator, among the plurality of printed circuit boards, is disposed to be lower than the other printed circuit boards in the optical axis direction.Type: ApplicationFiled: March 26, 2019Publication date: December 5, 2019Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Won Ki PARK, Jong Woo KIM, Jong Yong PARK, Seok Jo HWANG, Ick Chan SHIM, Dae Hyun JEONG, Byung Gi AN, Dae Wook KIM, Kyung Hoon CHOI
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Patent number: 5990642Abstract: A method and an apparatus for driving a sensorless DC motor having a bridge-type inductance detecting circuit. The method of driving a sensorless DC motor including a rotor having Y-winding phase coils and a plurality of magnetic poles comprises the steps of applying an alternating current voltage signal to bridge circuits coupled to the phase coils, respectively, inputting an output voltage signal of each bridge circuit as an inductance detecting signal of each phase coil, amplifying the inputted inductance detecting signal of each phase coil, comparing a value of the amplified inductance detecting signal of each phase coil to each other, and determining an initial position of the rotor for rotating the rotor, the phase coils except for a phase coil having a maximum inductance detecting signal being magnetized at the initial position. By the method, the initial position of the rotor can be precisely detected even when the rotor is rotated at a low speed or in a stop state, so the motor is reliably driven.Type: GrantFiled: June 8, 1998Date of Patent: November 23, 1999Assignee: Daewoo Electronics Co., Ltd.Inventor: Jong-Yong Park
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Patent number: D940294Type: GrantFiled: November 6, 2019Date of Patent: January 4, 2022Assignee: SK NETWORKS CO., LTD.Inventors: Jong Yong Park, Je Young Kwon
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Patent number: D940296Type: GrantFiled: November 6, 2019Date of Patent: January 4, 2022Assignee: SK NETWORKS CO., LTD.Inventors: Jong Yong Park, Je Young Kwon