Patents by Inventor Jonghun YOON

Jonghun YOON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Hole expansion ratio testing device, hole expansion ratio testing method, and operating program
    Patent number: 11913912
    Abstract: Disclosed are a hole expansion ratio testing device, a hole expansion ratio testing method, and an operation program. The hole expansion ratio testing device includes a chucking unit configured to chuck a plate member having a hole, a punching unit inserted into the hole and configured to expand the hole, an image acquisition unit configured to acquire an image of the hole expanded by the punching unit, and an analysis unit configured to extract an interest area corresponding to the hole from the acquired image, linearize the interest area, and provide information on a crack as a blob changes due to the linearization.
    Type: Grant
    Filed: March 16, 2021
    Date of Patent: February 27, 2024
    Assignee: INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY ERICA CAMPUS
    Inventors: Jonghun Yoon, Seungho Choi
  • HOLE EXPANSION RATIO TESTING DEVICE, HOLE EXPANSION RATIO TESTING METHOD, AND OPERATING PROGRAM
    Publication number: 20210223150
    Abstract: Disclosed are a hole expansion ratio testing device, a hole expansion ratio testing method, and an operation program. The hole expansion ratio testing device includes a chucking unit configured to chuck a plate member having a hole, a punching unit inserted into the hole and configured to expand the hole, an image acquisition unit configured to acquire an image of the hole expanded by the punching unit, and an analysis unit configured to extract an interest area corresponding to the hole from the acquired image, linearize the interest area, and provide information on a crack as a blob changes due to the linearization.
    Type: Application
    Filed: March 16, 2021
    Publication date: July 22, 2021
    Applicant: INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY ERICA CAMPUS
    Inventors: Jonghun YOON, Seungho CHOI