Patents by Inventor Jonghyun HONG

Jonghyun HONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer chuck
    Patent number: 11658057
    Abstract: A wafer chuck includes a body portion; a vacuum barrier portion including a wall structure arranged at the same distance from a center point of the body portion; f protrusions arranged inside and outside the vacuum barrier portion, protruding from a top surface of the body portion and spaced apart from each other; and a vacuum portion including vacuum holes spaced apart from each other penetrating the body portion inside the vacuum barrier portion.
    Type: Grant
    Filed: September 23, 2020
    Date of Patent: May 23, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sungil Choi, Hyeondong Song, Myeongshik Shim, Jonghyun Hong, Bonggyo Seo
  • WAFER CHUCK
    Publication number: 20210242069
    Abstract: A wafer chuck includes a body portion; a vacuum barrier portion including a wall structure arranged at the same distance from a center point of the body portion; f protrusions arranged inside and outside the vacuum barrier portion, protruding from a top surface of the body portion and spaced apart from each other; and a vacuum portion including vacuum holes spaced apart from each other penetrating the body portion inside the vacuum barrier portion.
    Type: Application
    Filed: September 23, 2020
    Publication date: August 5, 2021
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Sungil CHOI, Hyeondong SONG, Myeongshik SHIM, Jonghyun HONG, Bonggyo SEO