Abstract: A method of manufacturing a semiconductor package includes preparing a core substrate having an upper surface and a lower surface, and including a cavity. A passive component is disposed in the cavity. A first insulating layer is formed on the upper surface of the core substrate and in the cavity and encapsulates the passive component. Through-vias are formed that penetrate the core substrate and the first insulating layer, and a first wiring layer is formed on the first insulating layer. The first wiring layer connects the through-vias and the passive component. A connection structure including an insulating member is formed on the first insulating layer and a redistribution layer is formed in the insulating member. The redistribution layer is connected to the first wiring layer. A semiconductor chip is disposed on an upper surface of the connection structure. The semiconductor chip has connection pads connected to the redistribution layer.

Abstract: A method of manufacturing a semiconductor package includes preparing a core substrate having an upper surface and a lower surface, and including a cavity. A passive component is disposed in the cavity. A first insulating layer is formed on the upper surface of the core substrate and in the cavity and encapsulates the passive component. Through-vias are formed that penetrate the core substrate and the first insulating layer, and a first wiring layer is formed on the first insulating layer. The first wiring layer connects the through-vias and the passive component. A connection structure including an insulating member is formed on the first insulating layer and a redistribution layer is formed in the insulating member. The redistribution layer is connected to the first wiring layer. A semiconductor chip is disposed on an upper surface of the connection structure. The semiconductor chip has connection pads connected to the redistribution layer.

Abstract: An electric grilling plate having a cooking surface connected to a heating element powered by an AC power source. The disclosed grilling plate is configured to be positioned in a bottom portion of a counter-top cooker, such as a convection oven, to provide direct and radiant heat to food items. Preferably, the appliance also includes an upper heating source with a fan to provide convection cooking as well.

Abstract: A semiconductor package includes: an interposer substrate including a core substrate and a connection structure, the core substrate having a cavity and having through-vias connecting upper and lower surfaces thereof, and the connection structure including an insulating member on the upper surface and a redistribution layer on the insulating member; a semiconductor chip on an upper surface of the connection structure and including connection pads connected to the redistribution layer; a passive component accommodated in the cavity; a first insulating layer disposed between the core substrate and the connection structure; a first wiring layer on the first insulating layer and connecting the through-vias and the passive component to the redistribution layer; a second insulating layer on the lower surface of the core substrate; and a second wiring layer on a lower surface of the second insulating layer and connected to the through-vias.

Abstract: A semiconductor package includes: an interposer substrate including a core substrate and a connection structure, the core substrate having a cavity and having through-vias connecting upper and lower surfaces thereof, and the connection structure including an insulating member on the upper surface and a redistribution layer on the insulating member; a semiconductor chip on an upper surface of the connection structure and including connection pads connected to the redistribution layer; a passive component accommodated in the cavity; a first insulating layer disposed between the core substrate and the connection structure; a first wiring layer on the first insulating layer and connecting the through-vias and the passive component to the redistribution layer; a second insulating layer on the lower surface of the core substrate; and a second wiring layer on a lower surface of the second insulating layer and connected to the through-vias.

Abstract: A semiconductor package may include: a connection structure including an insulating member having a first surface having a recess portion and a second surface opposing the first surface, a plurality of first pads disposed on a bottom surface of the recess portion, a plurality of second pads embedded in the second surface of the insulating member, and a redistribution layer disposed between the plurality of first pads and the plurality of second pads and connected to the plurality of first and second pads; a semiconductor chip disposed on the first surface of the insulating member and having a plurality of connection electrodes electrically connected, respectively, to the plurality of first pads; and a passivation layer disposed on the second surface of the insulating member and having a plurality of openings exposing, respectively, the plurality of second pads.

Abstract: A roaster for roasting coffee beans includes a roasting chamber having a top and a bottom. A cover is seated on the top of the roasting chamber and a bottom of the roasting chamber is seated on a base. A hot air supply is provided in the base for supplying hot airflow into the roasting chamber for heating the coffee beans. At least one air opening is formed on the bottom for enabling the airflow to enter the roasting chamber. A wind tunnel is provided over the air opening for increasing the speed of the airflow in the roasting chamber as the airflow passes through the wind tunnel.

Abstract: An electric cooker includes a base, a housing supported on the base and having an opening, and a power head configured to be removably attached to the housing at the opening. The power head includes a heating unit for generating and directing heat into the housing. At least one land piece is provided on the power head for securing the power head onto the housing, and at least one corresponding tab piece is provided on the housing and is configured to matingly engage the land piece for removably attaching the power head onto the housing. A locking device provided on the power head proximate the land piece prevents the land piece and the tab piece from disengaging from a temperature increase inside the housing.

Abstract: A counter-top cooker includes a base, a cooking chamber having a top end and a bottom end supported on the base, and a power head attached to the top end of the cooking chamber. The power head includes a heating element and a fan for directing airflow over the heating element and into the cooking chamber. The cooker also includes another heating element provided in the cooking chamber proximate the bottom end of the cooking chamber.

Abstract: A combined rotisserie and convection oven includes a cooking chamber having a first end and a second end. A fan is in fluid communication with the cooking chamber for creating an airflow in the cooking chamber, and a removable spit is rotatably suspended between the first and second ends of the cooking chamber. A heating element for providing the cooking temperature is provided in the cooking chamber, and is movable to a plurality of positions within the cooking chamber.

Abstract: A roaster for roasting coffee beans includes a roasting chamber having a top and a bottom for holding coffee beans when the beans are being roasted, a cover seated on the top of the roasting chamber and a base on which the bottom of the roasting chamber is seated. A device is provided in the base for supplying airflow into the roasting chamber. A controller controls the airflow supplying device to generate a roasting temperature inside the roasting chamber that tracks a predetermined temperature curve. The temperature curve includes a first stage in which the roasting temperature is set to a first predetermined level for a first predetermined time period, and a second stage in which the roasting temperature is set to a second predetermined level that is higher than the first predetermined level.

Abstract: A roaster for roasting coffee beans includes a roasting chamber having a top and a bottom. A cover is seated on the top of the roasting chamber and a bottom of the roasting chamber is seated on a base. A hot air supply is provided in the base for supplying hot airflow into the roasting chamber for heating the coffee beans. At least one air opening is formed on the bottom for enabling the airflow to enter the roasting chamber. A wind tunnel is provided over the air opening for increasing the speed of the airflow in the roasting chamber as the airflow passes through the wind tunnel.

Abstract: A counter-top cooker includes a base, a cooking chamber having a top end and a bottom end supported on the base, and a power head attached to the top end of the cooking chamber. The power head includes a heating element and a fan for directing airflow over the heating element and into the cooking chamber. The cooker also includes another heating element provided in the cooking chamber proximate the bottom end of the cooking chamber.

Abstract: A combined rotisserie and convection oven includes a cooking chamber having a first end and a second end. A fan is in fluid communication with the cooking chamber for creating an airflow in the cooking chamber, and a removable spit is rotatably suspended between the first and second ends of the cooking chamber. A heating element for providing the cooking temperature is provided in the cooking chamber, and is movable to a plurality of positions within the cooking chamber.

Abstract: A roaster for roasting coffee beans includes a roasting chamber having a top and a bottom for holding coffee beans when the beans are being roasted, a cover seated on the top of the roasting chamber and a base on which the bottom of the roasting chamber is seated. A device is provided in the base for supplying airflow into the roasting chamber. A controller controls the airflow supplying device to generate a roasting temperature inside the roasting chamber that tracks a predetermined temperature curve. The temperature curve includes a first stage in which the roasting temperature is set to a first predetermined level for a first predetermined time period, and a second stage in which the roasting temperature is set to a second predetermined level that is higher than the first predetermined level.