Patents by Inventor Jongwoo Ha

Jongwoo Ha has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240114754
    Abstract: A display device includes a first substrate including a first region and a second region surrounding the first region in a plan view, a first filler disposed on the first substrate and overlapping the first region, a second filler disposed on the first substrate and overlapping the second region, and including a material different from the first filler, and a second substrate disposed on the first filler and the second filler.
    Type: Application
    Filed: September 15, 2023
    Publication date: April 4, 2024
    Inventors: CHANGYEONG SONG, Yeonguk Kim, Jongwoo Kim, Heeyeon Park, Yongchan Ju, Jaeheung Ha
  • Publication number: 20240098215
    Abstract: Disclosed are a signal processing device and an image display apparatus including the same. The signal processing device of an embodiment of the present disclosure includes: a quality calculator configured to calculate a source quality of an image signal received from an external settop box or a network; an image quality setter configured to set an image quality of the image signal based on the calculated source quality; and an image quality processor configured to perform image quality processing on the image signal based on the set image quality, wherein in response to the source quality of the received image signal being changed at a first time point, the image quality setter changes an image quality setting sequentially from a first setting to a second setting; and based on the image quality setting, the image quality processor performs image quality processing. Accordingly, flicker may be reduced when an image quality is changed due to a change in the source quality of the received image signal.
    Type: Application
    Filed: November 29, 2023
    Publication date: March 21, 2024
    Applicant: LG ELECTRONICS INC.
    Inventors: Saem PARK, Seokpan KANG, Yongtaek GONG, Sangchurl NAM, Yeonoh NAM, Jeonghyu YANG, Kyungmee LEE, Myongyoung LEE, Seoksoo LEE, Wonwoo LEE, Seungjong CHOI, Jongwoo HA
  • Patent number: 11849250
    Abstract: Disclosed are a signal processing device and an image display apparatus including the same. The signal processing device of an embodiment of the present disclosure includes: a quality calculator configured to calculate a source quality of an image signal received from an external settop box or a network; an image quality setter configured to set an image quality of the image signal based on the calculated source quality; and an image quality processor configured to perform image quality processing on the image signal based on the set image quality, wherein in response to the source quality of the received image signal being changed at a first time point, the image quality setter changes an image quality setting sequentially from a first setting to a second setting; and based on the image quality setting, the image quality processor performs image quality processing. Accordingly, flicker may be reduced when an image quality is changed due to a change in the source quality of the received image signal.
    Type: Grant
    Filed: October 5, 2022
    Date of Patent: December 19, 2023
    Assignee: LG ELECTRONICS INC.
    Inventors: Saem Park, Seokpan Kang, Yongtaek Gong, Sangchurl Nam, Yeonoh Nam, Jeonghyu Yang, Kyungmee Lee, Myongyoung Lee, Seoksoo Lee, Wonwoo Lee, Seungjong Choi, Jongwoo Ha
  • Patent number: 11616930
    Abstract: Disclosed are a signal processing device and an image display apparatus including the same. The signal processing device of an embodiment of the present disclosure includes: a quality calculator configured to calculate an source quality of an image signal received from an external settop box or a network; an image quality setter configured to set an image quality of the image signal based on the calculated source quality; and an image quality processor configured to perform image quality processing on the image signal based on the set image quality, wherein in response to the source quality of the received image signal being changed at a first time point, the image quality setter changes an image quality setting sequentially from a first setting to a second setting; and based on the image quality setting, the image quality processor performs image quality processing. Accordingly, flicker may be reduced when an image quality is changed due to a change in the source quality of the received image signal.
    Type: Grant
    Filed: October 23, 2019
    Date of Patent: March 28, 2023
    Assignee: LG ELECTRONICS INC.
    Inventors: Saem Park, Seokpan Kang, Yongtaek Gong, Sangchurl Nam, Yeonoh Nam, Jeonghyu Yang, Kyungmee Lee, Myongyoung Lee, Seoksoo Lee, Wonwoo Lee, Seungjong Choi, Jongwoo Ha
  • Publication number: 20230044956
    Abstract: Disclosed are a signal processing device and an image display apparatus including the same. The signal processing device of an embodiment of the present disclosure includes: a quality calculator configured to calculate a source quality of an image signal received from an external settop box or a network; an image quality setter configured to set an image quality of the image signal based on the calculated source quality; and an image quality processor configured to perform image quality processing on the image signal based on the set image quality, wherein in response to the source quality of the received image signal being changed at a first time point, the image quality setter changes an image quality setting sequentially from a first setting to a second setting; and based on the image quality setting, the image quality processor performs image quality processing. Accordingly, flicker may be reduced when an image quality is changed due to a change in the source quality of the received image signal.
    Type: Application
    Filed: October 5, 2022
    Publication date: February 9, 2023
    Applicant: LG ELECTRONICS INC.
    Inventors: Saem PARK, Seokpan KANG, Yongtaek GONG, Sangchurl NAM, Yeonoh NAM, Jeonghyu YANG, Kyungmee LEE, Myongyoung LEE, Seoksoo LEE, Wonwoo LEE, Seungjong CHOI, Jongwoo HA
  • Publication number: 20210400231
    Abstract: Disclosed are a signal processing device and an image display apparatus including the same. The signal processing device of an embodiment of the present disclosure includes: a quality calculator configured to calculate an source quality of an image signal received from an external settop box or a network; an image quality setter configured to set an image quality of the image signal based on the calculated source quality; and an image quality processor configured to perform image quality processing on the image signal based on the set image quality, wherein in response to the source quality of the received image signal being changed at a first time point, the image quality setter changes an image quality setting sequentially from a first setting to a second setting; and based on the image quality setting, the image quality processor performs image quality processing. Accordingly, flicker may be reduced when an image quality is changed due to a change in the source quality of the received image signal.
    Type: Application
    Filed: October 23, 2019
    Publication date: December 23, 2021
    Applicant: LG ELECTRONICS INC.
    Inventors: Saem PARK, Seokpan KANG, Yongtaek GONG, Sangchurl NAM, Yeonoh NAM, Jeonghyu YANG, Kyungmee LEE, Myongyoung LEE, Seoksoo LEE, Wonwoo LEE, Seungjong CHOI, Jongwoo HA
  • Patent number: 9152723
    Abstract: A method and apparatus provide an Internet service in a mobile communication terminal. The method includes determining a user interest subject from user data existing within the mobile communication terminal, collecting service items through network access, determining a subject for each of the collected service items, determining relevance between the user interest subject and each of the service items, and recommending a service item according to the relevance.
    Type: Grant
    Filed: September 9, 2011
    Date of Patent: October 6, 2015
    Assignees: Samsung Electronics Co., Ltd., Korea University Research and Business Foundation
    Inventors: Jeong-Soo Lee, SangGeun Lee, JongWoo Ha, Jung-Hyun Lee, Kyu-Sun Shim
  • Publication number: 20120066234
    Abstract: A method and apparatus provide an Internet service in a mobile communication terminal. The method includes determining a user interest subject from user data existing within the mobile communication terminal, collecting service items through network access, determining a subject for each of the collected service items, determining relevance between the user interest subject and each of the service items, and recommending a service item according to the relevance.
    Type: Application
    Filed: September 9, 2011
    Publication date: March 15, 2012
    Applicants: KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION, SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jeong-Soo Lee, SangGeun Lee, JongWoo Ha, Jung-Hyun Lee, Kyu-Sun Shim
  • Patent number: 7436048
    Abstract: A multichip package has a leadframe including peripheral leads arranged about a centrally situated die paddle. A first die is attached to a first side of the leadframe die paddle. The second side of the leadframe is partially cut away so that an outer part of the die paddle is thinner, and an inner part of the leads is thinner. These partially cutaway portions in the second side of the leadframe provide a cavity, in which a second die is attached active side upward. The lower die may have bond pads near the center of the active surface, and electrical interconnection of the lower die may be made by wire bonds running through the gap between the die paddle and the leads; or, the lower die may be attached, and electrically interconnected, by flip chip interconnect to the die attach side of the cavity in the leadframe.
    Type: Grant
    Filed: March 14, 2007
    Date of Patent: October 14, 2008
    Assignee: Chippac, Inc.
    Inventors: Jongwoo Ha, Taebok Jung
  • Publication number: 20070152308
    Abstract: A multichip package has a leadframe including peripheral leads arranged about a centrally situated die paddle. A first (“upper”) die is attached to a first (“top”) side of the leadframe die paddle, which can be generally flat. The second (“bottom”) side of the leadframe is partially cut away (such as by partial etching), so that an outer part of the die paddle is thinner, and so that an inner part of the leads is thinner. These partially cutaway portions in the second (‘bottom”) side of the leadframe provide a cavity, in which a second (“lower”) die is attached active side upward. The lower die may have bond pads situated near the center of the active surface, and electrical interconnection of the lower die may be made by wire bonds running through the gap between the die paddle and the leads; or, the lower die may be attached, and electrically interconnected, by flip chip interconnect to the die attach side of the cavity in the leadframe.
    Type: Application
    Filed: March 14, 2007
    Publication date: July 5, 2007
    Applicant: ChipPAC, Inc
    Inventors: Jongwoo Ha, Taebok Jung
  • Patent number: 7208821
    Abstract: A multichip package has a leadframe including peripheral leads arranged about a centrally situated die paddle. A first (“upper”) die is attached to a first (“top”) side of the leadframe die paddle, which can be generally flat. The second (“bottom”) side of the leadframe is partially-cut away (such as by partial etching), so that an outer part of the die paddle is thinner, and so that an inner part of the leads is thinner. These partially cutaway portions in the second (“bottom”) side of the leadframe provide a cavity, in which a second (“lower”) die is attached active side upward. The lower die may have bond pads situated near the center of the active surface, and electrical interconnection of the lower die may be made by wire bonds running through the gap between the die paddle and the leads; or, the lower die may be attached, and electrically interconnected, by flip chip interconnect to the die attach side of the cavity in the leadframe.
    Type: Grant
    Filed: October 17, 2005
    Date of Patent: April 24, 2007
    Assignee: ChipPAC, Inc.
    Inventors: Jongwoo Ha, Taebok Jung
  • Publication number: 20060081967
    Abstract: A multichip package has a leadframe including peripheral leads arranged about a centrally situated die paddle. A first (“upper”) die is attached to a first (“top”) side of the leadframe die paddle, which can be generally flat. The second (“bottom”) side of the leadframe is partially-cut away (such as by partial etching), so that an outer part of the die paddle is thinner, and so that an inner part of the leads is thinner. These partially cutaway portions in the second (“bottom”) side of the leadframe provide a cavity, in which a second (“lower”) die is attached active side upward. The lower die may have bond pads situated near the center of the active surface, and electrical interconnection of the lower die may be made by wire bonds running through the gap between the die paddle and the leads; or, the lower die may be attached, and electrically interconnected, by flip chip interconnect to the die attach side of the cavity in the leadframe.
    Type: Application
    Filed: October 17, 2005
    Publication date: April 20, 2006
    Applicant: ChipPAC, Inc
    Inventors: Jongwoo Ha, Taebok Jung