Patents by Inventor Joon Ki PAEK

Joon Ki PAEK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240130053
    Abstract: A storage device includes a printed circuit board (PCB) with attached semiconductor chips, each including a memory, and with at least one wire coupling the semiconductor chips. The storage device includes a case including a first case surrounding a top portion of the printed circuit board and a second case surrounding a bottom portion of the printed circuit board. A sidewall of the first case and a protrusion of the second case form a concavo-convex structure. The sidewall of the first case and the protrusion of the second case cover a side of the printed circuit board.
    Type: Application
    Filed: February 21, 2023
    Publication date: April 18, 2024
    Inventors: Jong Won KIM, Gi Taek KIM, Joon Ki PAEK, Jung Hee CHO, Dong Hae LEE, Kyoung Soo CHO
  • Publication number: 20220076712
    Abstract: Provided is a non-volatile memory package that is electrically optimized with a plurality of different non-volatile memory chips through a ball map, by fixing positions of buffer chips connected to the plurality of different non-volatile memory chips.
    Type: Application
    Filed: August 23, 2021
    Publication date: March 10, 2022
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ji Woon PARK, Joon Ki PAEK
  • Patent number: 11006517
    Abstract: A printed circuit board may include a controller socket, first and second sockets provided on a top surface, third and fourth sockets provided on a bottom surface, and first, second, and third branching points. The first branching point may be spaced apart from the controller socket by a first distance in a horizontal direction parallel to the top surface and may be electrically connected to the controller socket. The second branching point may be spaced apart from the first branching point by a second distance longer than the first distance and may be electrically connected to the first branching point, the first and third sockets. The third branching point may be spaced apart from the first branching point by a third distance longer than the first distance and may be electrically connected to the first branching point, the second and fourth sockets.
    Type: Grant
    Filed: July 14, 2020
    Date of Patent: May 11, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Joon Ki Paek, KwangSoo Park, Heeju Kim
  • Publication number: 20200344876
    Abstract: A printed circuit board may include a controller socket, first and second sockets provided on a top surface, third and fourth sockets provided on a bottom surface, and first, second, and third branching points. The first branching point may be spaced apart from the controller socket by a first distance in a horizontal direction parallel to the top surface and may be electrically connected to the controller socket. The second branching point may be spaced apart from the first branching point by a second distance longer than the first distance and may be electrically connected to the first branching point, the first and third sockets. The third branching point may be spaced apart from the first branching point by a third distance longer than the first distance and may be electrically connected to the first branching point, the second and fourth sockets.
    Type: Application
    Filed: July 14, 2020
    Publication date: October 29, 2020
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Joon Ki PAEK, KwangSoo PARK, Heeju KIM
  • Patent number: 10750610
    Abstract: A printed circuit board may include a controller socket, first and second sockets provided on a top surface, third and fourth sockets provided on a bottom surface, and first, second, and third branching points. The first branching point may be spaced apart from the controller socket by a first distance in a horizontal direction parallel to the top surface and may be electrically connected to the controller socket. The second branching point may be spaced apart from the first branching point by a second distance longer than the first distance and may be electrically connected to the first branching point, the first and third sockets. The third branching point may be spaced apart from the first branching point by a third distance longer than the first distance and may be electrically connected to the first branching point, the second and fourth sockets.
    Type: Grant
    Filed: January 11, 2019
    Date of Patent: August 18, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Joon Ki Paek, KwangSoo Park, Heeju Kim
  • Publication number: 20190373714
    Abstract: A printed circuit board may include a controller socket, first and second sockets provided on a top surface, third and fourth sockets provided on a bottom surface, and first, second, and third branching points. The first branching point may be spaced apart from the controller socket by a first distance in a horizontal direction parallel to the top surface and may be electrically connected to the controller socket. The second branching point may be spaced apart from the first branching point by a second distance longer than the first distance and may be electrically connected to the first branching point, the first and third sockets. The third branching point may be spaced apart from the first branching point by a third distance longer than the first distance and may be electrically connected to the first branching point, the second and fourth sockets.
    Type: Application
    Filed: January 11, 2019
    Publication date: December 5, 2019
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Joon Ki PAEK, KwangSoo Park, Heeju Kim