Patents by Inventor Joon-seo Yim

Joon-seo Yim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230060209
    Abstract: An image evaluation method, including: obtaining a test image including a first lattice pattern formed by image edges; aligning the test image using the image edges to generate an aligned image including a second lattice pattern formed by aligned image edges; generating a compressed image by compressing the aligned image; and generating a quantified result by quantifying a per-pixel difference between the compressed image and the aligned image.
    Type: Application
    Filed: July 19, 2022
    Publication date: March 2, 2023
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seungwan JEON, Kundong KIM, Sungsu KIM, Daeil YU, YuGyung LEE, Joon-Seo YIM
  • Publication number: 20230069283
    Abstract: Provided is an image sensor evaluation method using a computing device including a processor, the method including receiving, by the processor, image data obtained by capturing a plurality of neighboring lines by an image sensor, performing, by the processor, a spatial domain analysis on the image data to generate a first quality score of the image sensor, performing, by the processor, a frequency domain analysis on the image data to generate a second quality score of the image sensor, and generating, by the processor, a final quality score of the image sensor based on the first quality score and the second quality score.
    Type: Application
    Filed: August 25, 2022
    Publication date: March 2, 2023
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sungho GIL, Ohyeong KIM, Sungsu KIM, Eun-Ji YONG, Joon-Seo YIM
  • Publication number: 20230069744
    Abstract: Provided is a method of operating an assessment device which communicates with an image sensor and includes an input buffer and a processor, the method including receiving, by the input buffer, raw image data from the image sensor that is configured to capture a test chart, generating, by the processor, conversion image data based on color domain transformation of the raw image data, generating, by the processor, estimation image data by estimating a non-distorted image based on the conversion image data, and assessing, by the processor, color distortion of the image sensor based on the estimation image data and the conversion image data.
    Type: Application
    Filed: August 19, 2022
    Publication date: March 2, 2023
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: JUNGMIN LEE, Seunghyeok JUNE, JIYUN BANG, SUNGSU KIM, JOON-SEO YIM
  • Patent number: 10257426
    Abstract: An image sensor module is provided. The image sensor module includes a printed circuit board (PCB), an image sensor chip disposed on a first plane of the PCB and electrically connected to the PCB, and an image signal processing chip disposed on the first plane of the PCB and electrically connected to the PCB. An aspect ratio of the image signal processing chip is at least two times greater than an aspect ratio of the image sensor chip. A minimum feature size of a metal line implemented in the image sensor chip is at least 1.5 times greater than a minimum feature size of a metal line implemented in the image signal processing chip.
    Type: Grant
    Filed: January 13, 2016
    Date of Patent: April 9, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yun Tae Lee, Joon Seo Yim, Je Suk Lee, Jae Yong Park, Jun-Woo Park, Su-Young Lee
  • Patent number: 10136110
    Abstract: A method of enhancing a low-light image includes receiving a first image from an RWB image sensor, receiving a second image from an RGB image sensor, receiving an illumination value from an illumination sensor, and selecting at least one of the first and second images and generating a third image using the at least one selected image.
    Type: Grant
    Filed: October 13, 2016
    Date of Patent: November 20, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yong Ju Jung, Kwang Hyuk Bae, Chae Sung Kim, Joon Seo Yim
  • Publication number: 20170118450
    Abstract: A method of enhancing a low-light image includes receiving a first image from an RWB image sensor, receiving a second image from an RGB image sensor, receiving an illumination value from an illumination sensor, and selecting at least one of the first and second images and generating a third image using the at least one selected image.
    Type: Application
    Filed: October 13, 2016
    Publication date: April 27, 2017
    Inventors: YONG JU JUNG, KWANG HYUK BAE, CHAE SUNG KIM, JOON SEO YIM
  • Publication number: 20160198095
    Abstract: An image sensor module is provided. The image sensor module includes a printed circuit board (PCB), an image sensor chip disposed on a first plane of the PCB and electrically connected to the PCB, and an image signal processing chip disposed on the first plane of the PCB and electrically connected to the PCB. An aspect ratio of the image signal processing chip is at least two times greater than an aspect ratio of the image sensor chip. A minimum feature size of a metal line implemented in the image sensor chip is at least 1.5 times greater than a minimum feature size of a metal line implemented in the image signal processing chip.
    Type: Application
    Filed: January 13, 2016
    Publication date: July 7, 2016
    Inventors: Yun Tae LEE, Joon Seo YIM, Je Suk LEE, Jae Yong PARK, Jun-Woo PARK, Su-Young LEE
  • Patent number: 9257467
    Abstract: An image sensor module is provided. The image sensor module includes a printed circuit board (PCB), an image sensor chip disposed on a first plane of the PCB and electrically connected to the PCB, and an image signal processing chip disposed on the first plane of the PCB and electrically connected to the PCB. An aspect ratio of the image signal processing chip is at least two times greater than an aspect ratio of the image sensor chip. A minimum feature size of a metal line implemented in the image sensor chip is at least 1.5 times greater than a minimum feature size of a metal line implemented in the image signal processing chip.
    Type: Grant
    Filed: November 29, 2010
    Date of Patent: February 9, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yun Tae Lee, Joon Seo Yim, Je Suk Lee, Jae Yong Park, Jun-Woo Park, Su-Young Lee
  • Patent number: 8462101
    Abstract: An apparatus controls a backlight of a display panel of a camera system. The apparatus includes a sub-pixel extracting unit, an ambient light luminance calculating unit, and a backlight controller. The sub-pixel extracting unit extracts sub-pixel luminance values from image data, where the image data is indicative of a current image frame defined by a plurality of pixels, and where each of the pixels includes a plurality of sub-pixels. The ambient light luminance calculating unit calculates an ambient light luminance value of the current image frame from the sub-pixel luminance values extracted by the sub-pixel extracting unit. The backlight controller which generates a backlight control signal based on a comparison between the calculated ambient light luminance value of the current image frame and an ambient light luminance value of a previous image frame.
    Type: Grant
    Filed: July 13, 2010
    Date of Patent: June 11, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Bing Han, Paul Gallagher, Yun-tae Lee, Joon-seo Yim
  • Publication number: 20110141318
    Abstract: An image sensor module is provided. The image sensor module includes a printed circuit board (PCB), an image sensor chip disposed on a first plane of the PCB and electrically connected to the PCB, and an image signal processing chip disposed on the first plane of the PCB and electrically connected to the PCB. An aspect ratio of the image signal processing chip is at least two times greater than an aspect ratio of the image sensor chip. A minimum feature size of a metal line implemented in the image sensor chip is at least 1.5 times greater than a minimum feature size of a metal line implemented in the image signal processing chip.
    Type: Application
    Filed: November 29, 2010
    Publication date: June 16, 2011
    Inventors: Yun Tae Lee, Joon Seo Yim, Je Suk Lee, Jae Yong Park, Jun-Woo Park, Su-Young Lee
  • Publication number: 20110007103
    Abstract: An apparatus controls a backlight of a display panel of a camera system. The apparatus includes a sub-pixel extracting unit, an ambient light luminance calculating unit, and a backlight controller. The sub-pixel extracting unit extracts sub-pixel luminance values from image data, where the image data is indicative of a current image frame defined by a plurality of pixels, and where each of the pixels includes a plurality of sub-pixels. The ambient light luminance calculating unit calculates an ambient light luminance value of the current image frame from the sub-pixel luminance values extracted by the sub-pixel extracting unit. The backlight controller which generates a backlight control signal based on a comparison between the calculated ambient light luminance value of the current image frame and an ambient light luminance value of a previous image frame.
    Type: Application
    Filed: July 13, 2010
    Publication date: January 13, 2011
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Bing Han, Paul Gallagher, Yun-tae Lee, Joon-seo Yim