Abstract: A semiconductor package and a method for forming the same are provided. The semiconductor package comprises a chip having an active surface and a back surface. The semiconductor package further comprises a substrate having an upper surface and a lower surface opposite the upper surface. The chip is electrically connected to the upper surface of the substrate. A lid is thermally coupled to the back surface of the chip. A thermal interface material (TIM) is located between the chip and the lid. The TIM includes voids to reduce thermomechanical stresses applied on the chip and the TIM, thereby preventing package cracks.

Abstract: A semiconductor module with vertically arranged semiconductor packages may include a module board with a plurality of insertion holes. A plurality of semiconductor packages may be inserted in a vertical direction into corresponding insertion holes. The module may include a heat sink composed of a base plate and a plurality of protrusions. The protrusion may extend downward from the base plate.

Abstract: A heat pipe structure may include a plurality of heat pipes. Each heat pipe may include at least one ring arranged to form a passage through which a gas flows, and at least one globe arranged to form a wick, or capillary structure through which a fluid may flow. The at least one ring and the at least one globe may be arranged in a tube, which may connect a heat source and a heat dissipation part, and the fluid may be a working fluid for transferring heat.

Abstract: A multi-chip package having a heat dissipating path. The multi-chip package includes a stack of integrated circuit (IC) chips, a heat sink part interposed between the IC chips so that one end portion of the heat sink part can be exposed from a side of the stack of integrated circuit chips, a substrate on which the stack of integrated circuit chips is mounted, and solder or solder ball-shaped thermally connecting parts to thermally connect the exposed end portion of the heat sink part to the substrate to dissipate heat collected in the heat sink part through the substrate.

Abstract: The semiconductor chip package may include a substrate having circuit patterns and substrate pads connected with the circuit patterns. At least one semiconductor chip is mounted on the substrate, and a thermoelectric cooler having a P-type material plate and an N-type material plate is mounted on the semiconductor chip. Portions of the P-type and N-type material plates may be attached on the semiconductor chip. The P-type and N-type material plates may be electrically connected to the circuit patterns of the substrate to be provided with DC power.

Abstract: In a memory module, a gap filler for eliminating an air gap may be formed on an end of a PCB where a tab may be formed. The gap filler may be formed on a surface of a socket receiving the memory module. A grease may be coated on the tab to provide a heat conduction path away from the memory module.

Abstract: A semiconductor stack package includes lower and upper individual packages. When the upper individual package is stacked on the lower individual package, a heat-conducting layer provided under the upper package touches a heat-mediating layer provided on the lower package. Thus, a layer of trapped air found in conventional stack packages is eliminated, and a direct heat-dissipating path is produced through both the heat-conducting layer and the heat-mediating layer. Therefore, the heat dissipation of the stack package is improved. Alternatively, the stack package may have a symmetric configuration in which each IC chip faces away from each other. A memory module has several stack packages mounted on one or both surfaces of a module board. The method includes forming the packages and stacking the packages. The method further includes forming a module board and mounting the stack packages on the module board.

Abstract: A semiconductor module, including a semiconductor device mounted on a printed circuit board (PCB), the PCB having an electrical connection to the semiconductor module, and a heat sink in direct contact with the semiconductor device, the heat sink being formed with a first end and a second end, the first end and the second end being formed with different heights, wherein the semiconductor module allows air flow to pass through the semiconductor module, radiating heat away from the heat sink. Another semiconductor module, including a semiconductor device mounted on a PCB, a heat sink in direct contact with the semiconductor device, the heat sink having a first portion and a second portion, wherein the first portion has a flat shape and is in direct contact with the semiconductor device and the second portion has a corrugated shape and is not in contact with the semiconductor device, wherein the semiconductor module allows air flow to pass through the semiconductor module, radiating heat away from the heat sink.

Abstract: A stack package with improved heat radiation capability and a module having the stack package mounted thereon are provided in which the back surfaces of first and second chips are exposed through the bottom and top surfaces of the stack package, allowing improved heat radiation capability as well as reduced thickness of the stack package. A heat sink may be attached to the stack package for increasing heat radiation capability. A solder bonding portion may be formed between the stack package and a module substrate, establishing good solder bondability between the stack package and the module substrate.

Abstract: A semiconductor module with vertically arranged semiconductor packages may include a module board with a plurality of insertion holes. A plurality of semiconductor packages may be inserted in a vertical direction into corresponding insertion holes. The module may include a heat sink composed of a base plate and a plurality of protrusions. The protrusion may extend downward from the base plate.

Abstract: An underfill system for filling gaps between semiconductor chips and substrates is provided. The underfill system comprises a blower for blowing air, an air duct coupled to the blower, the air duct comprising a main duct coupled to the blower and a plurality of sub-ducts each having an outlet being connected to the main duct and an inlet to be located along one side of the semiconductor chip. A filling material from a dispenser fills the gaps by suction due to the pressure difference between the main duct and the sub-duct. Thus, the present invention shortens the filling time of the underfill process and prevents voids or air bubbles of the filling material from forming within the gap.

Abstract: A stacked semiconductor module includes a lower chip scale package (CSP) mounted on a module board, and an inverted upper CSP attached to the top of lower CSP to form a stacked semiconductor package. The lower and upper CSPs are electrically connected to each other outside of the stacked semiconductor package. This electrical connection may be made using the module board. Further, a conductive interconnection tape may be used to electrically connect the upper CSP to regions on the module board, which are electrically connected to the region at which the lower CSP is electrically connected to the module board.

Abstract: Some embodiments of the invention include two heat exchange members, which are arranged facing each other with a semiconductor module therebetween, the semiconductor module including a plurality of packages; a connection member formed in the middle of each of the heat exchange members to hinge join the heat exchange members such that portions of the heat exchange members protrude above the semiconductor module inserted between the heat exchange members; and an elastic member disposed between the heat exchange members to provide a force pushing portions of the heat exchange members below the connection member toward the packages of the semiconductor module. Other embodiments of the invention are described in the claims.

Abstract: A semiconductor package and a method for forming the same are provided. The semiconductor package comprises a chip having an active surface and a back surface. The semiconductor package further comprises a substrate having an upper surface and a lower surface opposite the upper surface. The chip is electrically connected to the upper surface of the substrate. A lid is thermally coupled to the back surface of the chip. A thermal interface material (TIM) is located between the chip and the lid. The TIM includes voids to reduce thermomechanical stresses applied on the chip and the TIM, thereby preventing package cracks.

Abstract: A multi-chip package (MCP) in which heat generated in first and second chips of the MCP is spread effectively and a method for manufacturing the same. The MCP includes first and second chips. The MCP further comprises a tape including a conductive material layer therein situated between the first chip and the second chip. Thus, the heat generated in the second chip can effectively spread to the outside through the tape.

Abstract: A semiconductor package and a method for forming the same are provided. The semiconductor package comprises a chip having an active surface and a back surface. The semiconductor package further comprises a substrate having an upper surface and a lower surface opposite the upper surface. The chip is electrically connected to the upper surface of the substrate. A lid is thermally coupled to the back surface of the chip. A thermal interface material (TIM) is located between the chip and the lid. The TIM includes voids to reduce thermomechanical stresses applied on the chip and the TIM, thereby preventing package cracks.

Abstract: A stacked semiconductor module includes a lower chip scale package (CSP) mounted on a module board, and an inverted upper CSP attached to the top of lower CSP to form a stacked semiconductor package. The lower and upper CSPs are electrically connected to each other outside of the stacked semiconductor package. This electrical connection may be made using the module board. Further, a conductive interconnection tape may be used to electrically connect the upper CSP to regions on the module board, which are electrically connected to the region at which the lower CSP is electrically connected to the module board.

Abstract: A multi-chip package (MCP) in which heat generated in first and second chips of the MCP is spread effectively and a method for manufacturing the same. The MCP includes first and second chips. The MCP further comprises a tape including a conductive material layer therein situated between the first chip and the second chip. Thus, the heat generated in the second chip can effectively spread to the outside through the tape.

Abstract: A semiconductor package and a method for forming the same are provided. The semiconductor package comprises a chip having an active surface and a back surface. The semiconductor package further comprises a substrate having an upper surface and a lower surface opposite the upper surface. The chip is electrically connected to the upper surface of the substrate. A lid is thermally coupled to the back surface of the chip. A thermal interface material (TIM) is located between the chip and the lid. The TIM includes voids to reduce thermomechanical stresses applied on the chip and the TIM, thereby preventing package cracks.

Abstract: Provided is a semiconductor memory module including semiconductor devices using solder balls as outer connection terminals, which reduces the deterioration of solder joint reliability (SJR) due to the difference in the thermal expansion coefficients of the module components. The memory module includes a module board, an upper heat sink, a lower heat sink and a linking means. The linking means is formed to have a structure that makes it possible to absorb contraction and expansion within the semiconductor module due to the different thermal expansion coefficients of the upper heat sink, the lower heat sink and the module board.