Abstract: Disclosed are a decorative tape including a printing layer, a base film layer on the printing layer, a nickel deposited layer on the base film layer and a pressure-sensitive adhesive layer on the nickel deposited layer; a method of manufacturing the decorative tape; and a decorative cover using the decorative tape.

Abstract: A method for processing substrates includes providing a bonding layer between a substrate and a carrier to bond the substrate to the carrier, processing the substrate while the substrate is supported by the carrier, and removing the bonding layer to separate the substrate from the carrier. The bonding layer may include a thermosetting release layer and thermosetting glue layers, wherein at least one of the thermosetting glue layers is provided on each side of the thermosetting release layer.

Abstract: A method for processing substrates includes providing a bonding layer between a substrate and a carrier to bond the substrate to the carrier, processing the substrate while the substrate is supported by the carrier, and removing the bonding layer to separate the substrate from the carrier. The bonding layer may include a thermosetting release layer and thermosetting glue layers, wherein at least one of the thermosetting glue layers is provided on each side of the thermosetting release layer.

Abstract: A water-soluble nanoparticle complex has a plurality of accumulated nanoparticles and has excellent uniformity and stability by forming a complex of nanoparticles using a water-soluble polymer and which allows for use of nanoparticles in biochemical applications.

Abstract: A power converter and an air conditioner having the same, in which the power converter includes a rectifying unit configured to rectify an input AC current and an interleave converter that has a plurality of converters and that is configured to convert rectified output from the rectifying unit to DC power and output the converted DC power. The power converter also includes a capacitor connected to an output terminal of the interleave converter, and a converter controller configured to control the interleave converter. The converter controller controls the interleave converter by calculating a load level of both terminals of the capacitor and changing a number of operating converters in the plurality of converters of the interleave converter based on the determined load level of both terminals of the capacitor.

Abstract: A method for processing substrates includes providing a bonding layer between a substrate and a carrier to bond the substrate to the carrier, processing the substrate while the substrate is supported by the carrier, and removing the bonding layer to separate the substrate from the carrier. The bonding layer may include a thermosetting release layer and thermosetting glue layers, wherein at least one of the thermosetting glue layers is provided on each side of the thermosetting release layer.

Abstract: A method of controlling an automatic cleaner in which the automatic cleaner is moved with a side brush assembly in a first operation type, a corner is determined during the movement of the automatic cleaner, the first operation type of the side brush assembly is changed to a second operation type to clean the corner when the corner is determined, whether the corner is cleaned is determined, and the second operation type of the side brush assembly is returned to the first operation type when the corner is cleaned.

Abstract: A water-soluble nanoparticle complex has a plurality of accumulated nanoparticles and has excellent uniformity and stability by forming a complex of nanoparticles using a water-soluble polymer and which allows for use of nanoparticles in biochemical applications.

Abstract: A method of manufacturing a semiconductor package that includes: forming a first board; forming second boards, in each of which at least one cavity is formed; attaching the second boards to both sides of the first board, such that the second boards are electrically connected with the first board; and connecting at least one component with the first board by a flip chip method by embedding the component in the cavity. The method can prevent damage to the semiconductor chips and lower manufacturing costs, while the connection material may also mitigate stresses, to prevent cracking in the boards and semiconductor chips, while preventing defects such as bending and warpage. Defects caused by temperature changes may also be avoided. Furthermore, it is not necessary to use an underfill in the portions where the semiconductor chips are connected with the printed circuit board, which allows for easier reworking and lower costs.

Abstract: A method of manufacturing a semiconductor package may include: forming a first board; forming second boards, in each of which at least one cavity is formed; attaching the second boards to both sides of the first board, such that the second boards are electrically connected with the first board; and connecting at least one component with the first board by a flip chip method by embedding the component in the cavity. The method can prevent damage to the semiconductor chips and lower manufacturing costs, while the connection material may also mitigate stresses, to prevent cracking in the boards and semiconductor chips, while preventing defects such as bending and warpage. Defects caused by temperature changes may also be avoided. Furthermore, it is not necessary to use an underfill in the portions where the semiconductor chips are connected with the printed circuit board, which allows for easier reworking and lower costs.

Abstract: A method of manufacturing a semiconductor package that includes: forming a first board; forming second boards, in each of which at least one cavity is formed; attaching the second boards to both sides of the first board, such that the second boards are electrically connected with the first board; and connecting at least one component with the first board by a flip chip method by embedding the component in the cavity. The method can prevent damage to the semiconductor chips and lower manufacturing costs, while the connection material may also mitigate stresses, to prevent cracking in the boards and semiconductor chips, while preventing defects such as bending and warpage. Defects caused by temperature changes may also be avoided. Furthermore, it is not necessary to use an underfill in the portions where the semiconductor chips are connected with the printed circuit board, which allows for easier reworking and lower costs.

Abstract: A method of manufacturing a semiconductor package may include: forming a first board; forming second boards, in each of which at least one cavity is formed; attaching the second boards to both sides of the first board, such that the second boards are electrically connected with the first board; and connecting at least one component with the first board by a flip chip method by embedding the component in the cavity. The method can prevent damage to the semiconductor chips and lower manufacturing costs, while the connection material may also mitigate stresses, to prevent cracking in the boards and semiconductor chips, while preventing defects such as bending and warpage. Defects caused by temperature changes may also be avoided. Furthermore, it is not necessary to use an underfill in the portions where the semiconductor chips are connected with the printed circuit board, which allows for easier reworking and lower costs.