Abstract: A capillary block can be provided in any of a number of different geometries for soldering and brazing. The capillary block can be configured to be positioned adjacent a joint to be formed prior to heating. Heat can then be applied to melt the capillary block and cause it to wick into the interface between the members being joined. The capillary block can be used in place of or in addition to a frame preform to create a joint such as a wall-to-floor joint of an assembly.

Abstract: A capillary block can be provided in any of a number of different geometries for soldering and brazing. The capillary block can be configured to be positioned adjacent a joint to be formed prior to heating. Heat can then be applied to melt the capillary block and cause it to wick into the interface between the members being joined. The capillary block can be used in place of or in addition to a frame preform to create a joint such as a wall-to-floor joint of an assembly.

Abstract: Methods and apparatus are provided for attaching a heat spreader to a die and includes disposing a solder thermal interface material between a first surface of a die and a first surface of a heat spreader without disposing a liquid flux between the die and the heat spreader to form an assembly, wherein at least one of the first surface of the die and a first surface of the heat spreader have disposed thereon a metallization structure comprising a transition layer and a sacrificial metallization layer, the sacrificial metallization layer disposed as an outer layer to the metallization structure adjacent the solder thermal interface material; and heating the assembly to melt the thermal interface and attach the die to the heat spreader.

Abstract: A method is provided for the forming of a metallic solder joint without a liquid flux to create a solder joint that has minimal voids and can be reflowed multiple times without void propagation. This process can be done for any solder alloy, and is most specifically used in the application of first level thermal interface in a IC or micro processor or BGA microprocessor.

Abstract: Methods and apparatus are provided for attaching a heat spreader to a die and includes disposing a solder thermal interface material between a first surface of a die and a first surface of a heat spreader without disposing a liquid flux between the die and the heat spreader to form an assembly, wherein at least one of the first surface of the die and a first surface of the heat spreader have disposed thereon a metallization structure comprising a transition layer and a sacrificial metallization layer, the sacrificial metallization layer disposed as an outer layer to the metallization structure adjacent the solder thermal interface material; and heating the assembly to melt the thermal interface and attach the die to the heat spreader.

Abstract: A method is provided for the forming of a metallic solder joint without a liquid flux to create a solder joint that has minimal voids and can be reflowed multiple times without void propagation. This process can be done for any solder alloy, and is most specifically used in the application of first level thermal interface in a IC or micro processor or BGA microprocessor.