Abstract: One or more embodiments of the invention relate to a method comprising: treating a fin of a first n-channel access transistor in a static random access memory cell to have a lower charge carrier mobility than a fin of a first n-channel pull-down transistor in a first inverter in the memory cell, the first n-channel access transistor being coupled between a first bit line and a first node of the first inverter; and treating a fin of a second n-channel access transistor in the memory cell to have a lower charge carrier mobility than a fin of a second n-channel pull-down transistor in a second inverter in the memory cell, the second n-channel access transistor being coupled between a second bit line and a second node of the second inverter.

Abstract: One or more embodiments relate to an apparatus comprising: a first transistor including a fin; and a second transistor including a fin, the fin of the first transistor having a lower charge carrier mobility than the fin of the second transistor.

Abstract: A device includes a first transistor including a fin and a second transistor including a fin, the fin of the first transistor having a lower charge carrier mobility than the fin of the second transistor. In a method, the fin of the first transistor is treated to have a lower charge carrier mobility than the fin of the second transistor.

Abstract: A device includes a first transistor including a fin and a second transistor including a fin, the fin of the first transistor having a lower charge carrier mobility than the fin of the second transistor. In a method, the fin of the first transistor is treated to have a lower charge carrier mobility than the fin of the second transistor.

Abstract: An integrated circuit includes functional blocks, a power control unit controlling the provision of power to the different functional blocks of the integrated circuit, a detecting unit detecting if a turned off functional block is to be turned on, and a clock signal control unit controlling the provision of the clock signal for the functional blocks. The clock signal control unit interrupts the clock signal for the activated functional blocks of the integrated circuit for a predetermined number of clock cycles. The power control unit provides power to the turned off functional block during the interrupted clock cycles.

Abstract: A digital circuit unit includes at least one circuit block, a voltage source for supplying the circuit block, a detection unit, which monitors the change of current drain by the at least one circuit block, an additional power consumption unit, which upon activation consumes power in addition to the at least one circuit block, and a control unit, which controls the power consumption unit in such a way that upon a change in the power consumption of the circuit block the power consumption unit is activated and drains current.

Abstract: A device includes a first transistor including a fin and a second transistor including a fin, the fin of the first transistor having a lower charge carrier mobility than the fin of the second transistor. In a method, the fin of the first transistor is treated to have a lower charge carrier mobility than the fin of the second transistor.

Abstract: P-type multi gate field effect transistor access devices are adapted to be coupled to a memory cell to provide access to the memory cell. A method is described that uses a power switch to switch off address decoding circuitry allowing word lines to float toward a high supply voltage, turning off the p-type multi gate field effect transistor access devices.

Abstract: A method and an apparatus for switching on a voltage supply of a voltage domain of a semiconductor circuit is disclosed. A voltage supply is connected to a supply voltage of the semiconductor circuit by means of a switchable element. The switchable element is activated in such a way that, for switching on the voltage supply of the voltage domain, a current through the switchable element rises progressively with at least one intermediate value, in particular stepwise manner.

Abstract: A multi-gate field effect transistor power switch is used to selectively couple a circuit to a supply voltage. In various embodiments, both n and p-type multi-gate field effect transistor power switches may be used to couple sub-circuits of varying granularity to different voltage supplies.

Abstract: Logic activation circuit for switching a logic circuit having at least one supply voltage line on or off, said logic activation circuit having: (a) at least one voltage supply switching device for connecting a supply voltage to a supply voltage line of the logic circuit in a manner dependent on a changeover control signal that is applied to a control terminal of the voltage supply switching device; and having (b) a charge equalization switching device which, in a manner dependent on a control switching pulse, connects the supply voltage line of the logic circuit to the control terminal of the voltage supply switching device for the duration of the control switching pulse so that charge equalization is effected between the supply voltage line and the control terminal of the voltage supply switching device in order to generate the changeover control signal.

Abstract: In an embodiment of the invention, a CMOS circuit arrangement is provided. The CMOS circuit arrangement includes a PMOS logic circuit providing a logic function, having PMOS field effect transistors, wherein a first operating potential is fed to an input of a PMOS logic circuit, an NMOS logic circuit providing the logic function, having NMOS field effect transistors, a first clock transistor, the first source/drain terminal of which is coupled to an input of the NMOS logic circuit, wherein a clock signal is applied to the gate terminal of the first clock transistor, and wherein a second operating potential is fed to the second source/drain terminal. An output of the PMOS logic circuit and an output of the NMOS logic circuit are coupled to one another. Furthermore, an inverter circuit is coupled to the output of the PMOS logic circuit and to the output of the NMOS logic circuit.

Abstract: A clock transistor and a second operating potential functioning as a circuit breaker, are mounted between the outlet of an NMOS logic circuit.

Abstract: A method and an apparatus for switching on a voltage supply of a voltage domain of a semiconductor circuit is disclosed. A voltage supply is connected to a supply voltage of the semiconductor circuit by means of a switchable element. The switchable element is activated in such a way that, for switching on the voltage supply of the voltage domain, a current through the switchable element rises progressively with at least one intermediate value, in particular stepwise manner.

Abstract: An integrated circuit includes functional blocks, a power control unit controlling the provision of power to the different functional blocks of the integrated circuit, a detecting unit detecting if a turned off functional block is to be turned on, and a clock signal control unit controlling the provision of the clock signal for the functional blocks. The clock signal control unit interrupts the clock signal for the activated functional blocks of the integrated circuit for a predetermined number of clock cycles. The power control unit provides power to the turned off functional block during the interrupted clock cycles.

Abstract: A digital circuit unit includes at least one circuit block, a voltage source for supplying the circuit block, a detection unit, which monitors the change of current drain by the at least one circuit block, an additional power consumption unit, which upon activation consumes power in addition to the at least one circuit block, and a control unit, which controls the power consumption unit in such a way that upon a change in the power consumption of the circuit block the power consumption unit is activated and drains current.

Abstract: A master latch circuit (10) with signal level displacement for a flip-flop (1) clocked by a clock pulse signal (Clk), wherein the master latch circuit (10) comprises a signal delay circuit (13) which delays and inverts the clock pulse signal (ClK) resulting in a specific time delay (AT), and a circuit node (14) which, in a charging phase wherein the clock pulse signal (Clk) is logically low, is charged to an operational voltage (VB) an which, in an evaluation phase when the clock pulse signal (Clk) and delayed, inverted clock pulse signal (Clk<SB>DELAY</SB>) are logically high, is discharged according to a specific data signal (D), wherein the data signal controls only transistors of a single type (either only N-channel or only P-channel). The master latch circuit (10) has only one supply voltage.

Abstract: A method of determining the critical path of a circuit includes first determining the paths, their mean path transit times and their path transit time fluctuations. Paths having similar statistical parameters are combined to form one path group. For each path group, a statistical group figure is, then, calculated and, for the totality of paths considered, a statistical total figure is calculated. Finally, the critical paths of the circuit are determined by taking into consideration the total figure, comparing the group figures at or above a critical path transit time Tc.

Abstract: An integrated electrical circuit having a plurality of structure planes is described. Electrically active elements are situated on at least one element structure plane, where at least one insulation layer is disposed above the element structure plane. Electrical connecting leads are disposed within and/or above the insulation layer, where at least a portion of the connecting leads contain copper. At least one diffusion blocker is disposed underneath the connecting leads, which diffusion blocker impedes and/or prevents the diffusion of copper. The integrated electrical circuit is configured according to the invention such that the diffusion blocker is configured as a blocker layer which is interrupted only in the region of contact holes and/or connection pieces and that the blocker layer is situated between the element structure plane and the insulation layer.

Abstract: A semiconductor device detects and adjusts leakage current dependent on threshold voltage of an integrated semiconductor device. To adjust the threshold voltage variation due to uncertainties in the channel length induced by the fabrication process (short channel effect) in the semiconductor a comparison between small and long channel devices is proposed. According to the comparison result, a bias potential is provided to the semiconductor device to adjust the threshold voltage.