Abstract: Disclosed is a pit lid antenna assembly including an antenna having an upper section and a lower section; and an antenna casing having a casing wall having an inner surface, the inner surface defining a first antenna slot, the first antenna slot sized to accept a portion of the lower section of the antenna.

Abstract: An antenna assembly includes a curved printed circuit board (PCB) configured to mount around a curved surface. The curved PCB can include an outward-facing first side and an inward-facing second side with a plurality of antenna structures disposed on one of the first side and second side of the PCB. The plurality of antenna structures can be configured to provide directional radiation in at least one frequency band.

Abstract: A nozzle cap assembly can include a nozzle cap housing configured to mount on a hydrant, a nozzle cap cover mounted on the nozzle cap housing, an antenna cover positioned on the nozzle cap housing and secured by the nozzle cap cover, the nozzle cap housing, the antenna cover, and the nozzle cap cover can define an antenna cover cavity, and an antenna assembly can be positioned in the antenna cover cavity.

Abstract: Disclosed is a pit lid antenna assembly including an antenna having an upper section and a lower section; and an antenna casing having a casing wall having an inner surface, the inner surface defining a first antenna slot, the first antenna slot sized to accept a portion of the lower section of the antenna.

Abstract: Antenna assemblies and methods of manufacturing antenna assemblies are provided. In one embodiment, an antenna assembly comprises a printed circuit board having a first surface and a second surface. The antenna assembly also includes a cellular antenna structure having a first section disposed on the first surface of the printed circuit board and a second section disposed on the second surface of the printed circuit board. The antenna assembly further includes a wireless local area antenna structure having a first section disposed on the first surface of the printed circuit board and a second section disposed on the second surface of the printed circuit board.