Abstract: Various implementations include an adjustable implant such as a distraction/compression device. In certain cases, the adjustable implant can include a housing; an adjustable member at least partially positioned within the housing and configured to translate relative to the housing; and an intermediary member positioned between the housing and the adjustable member.

Abstract: One aspect of the disclosure relates to an extramedullary biocompatible implant for moving bone in a patient's body. In some cases, the implant includes: a first plate configured to be attached to bone at a first location; a second plate configured to be attached to bone at a second location; and a distractor extending from the first plate and being at least partially contained within the second plate, where the distractor houses a drive system including a driver and a gear system coupled with the driver, and where the drive system is configured to cause translation of the second plate relative to the first plate.

Abstract: An adjustable implant system configured to non-invasively guide bone growth in a patient. The adjustable implant system includes a tether having a first end coupled to a fixed bone anchor and a second end coupled to an adjustable bone anchor. The adjustable bone anchor includes a driver disposed within a housing and the driver is configured to actuate in response to an externally applied magnetic field. The adjustable implant system includes an external adjustment device configured to non-invasively actuate the driver disposed within the adjustable bone anchor. Non-invasive actuation of the driver can cause the adjustable bone anchor to increase or decrease the amount of tension on the tether.

Abstract: In a described example, an apparatus includes: a package substrate having a planar die mount surface; recesses extending into the planar die mount surface; and a semiconductor device die flip chip mounted to the package substrate on the planar die mount surface, the semiconductor device die having post connects having proximate ends on bond pads on an active surface of the semiconductor device die, and extending to distal ends away from the semiconductor device die having solder bumps, wherein the solder bumps form solder joints to the package substrate within the recesses.

Abstract: A semiconductor package includes a leadframe including a die pad and a plurality of lead terminals. A vertical semiconductor device is attached on a first side by a die attach material to the die pad. A first clip is on the first vertical device that is solder connected to a terminal of the first vertical device on a second side opposite to the first side providing a first solder bonded interface, wherein the first clip is connected to at least a first of the lead terminals. The first solder bonded interface includes a first protruding surface standoff therein that extends from a surface on the second side of the first vertical device to physically contact the first clip.

Abstract: In some examples, a semiconductor package comprises a multi-layer package substrate. The multi-layer package substrate includes first and second metal layers, the first metal layer positioned above the second metal layer and coupled to the second metal layer by way of a via. The substrate also includes a dielectric covering at least part of the first and second metal layers and the via. The package includes a plated metal layer plated on at least part of the first metal layer and positioned above the dielectric, a combination of the first metal layer and the plated metal layer being thicker than the second metal layer. The package includes a semiconductor die having a device side, the device side vertically aligned with and coupled to the plated metal layer.

Abstract: A method for performing a surgical procedure includes: positioning a patient in a surgical patient interface device that includes: a base, a platform coupled to the base, and a first abutment and a second abutment each coupled to the platform; rotating the platform between a first position and a second position, where, in the first position, the platform extends in a substantially horizontal direction relative to the base, and the first and second abutments are separated by a first distance, and in the second position, the platform extends in a substantially vertical direction relative to the base; adjusting one or both of the first and second abutments relative to the platform such that, in the second position, the first and second abutments are separated by a second distance different from the first distance; and accessing a target portion of skin of the patient for the surgical procedure.

Abstract: Modeling cross-sections of yarn may include receiving yarn simulation input comprising a descriptive model of a general curvature followed by the yarn, providing a plurality of fibers distributed radially from the center of a ply, setting a base position based on parameters, applying a strain model to simulate the effect of stretch forces applied to the yarn, and outputting a yarn model indicating position and directionality of fibers in the yarn. The technology also relates to real-time modeling of a garment comprising a fabric. For instance, real-time modeling of a garment may include providing an input associated with one or more parameters of the fabric, receiving frames of a computer simulated garment, the computer simulated garment including a simulation of the fabric, the fabric simulation including yarns simulated based on a yarn model.

Abstract: Disclosed herein are lock mechanisms configured for locking and unlocking rotation of a driver and a driven gear system in implantable distraction and compression systems, and implantable medical devices and implantable distraction and compression systems including such lock mechanisms. The lock mechanisms include a keeper that is configured to move from a locked position to an unlocked position in response to a rotation of the driver, wherein, in the locked position, the keeper is configured to resist rotation of the driven features and the driver under a load on the driven features, and in the unlocked position, permits rotation of the drive gear and the driver.

Abstract: Various implementations include implants and related methods for moving bone. Certain implementations include an implant for moving bone in a patient's body, the implant including: an implantable biocompatible housing having a first cavity; a first adjustment rod at least partially contained within the first cavity; and a drive mechanism configured to drive the first adjustment rod to enable both translation axially relative to the housing and rotation about a primary axis of the housing.

Abstract: A method of making a semiconductor device includes separating a conductive structure of a leadframe into interior conductive leads using an etching process. The method includes forming a first molded structure by applying a first molding compound to a leadframe having a conductive structure, separating the conductive structure into at least two interior contact portions, attaching a semiconductor die to at least one of the interior contact portions, the at least two interior contact portions being supported by the first molding compound, and forming a second molded structure by applying a second molding compound to at least part of the semiconductor die and at least two interior contact portions.

Abstract: A surgical patient interface including a base; a platform coupled to the base and including a first end and a second end, the platform configured to transition between a first position and a second position about a pivotable axis stationary relative to the base; a first abutment and a second abutment each adjustably coupled to the platform. In the first position, the platform extends between the first end and the second end in a substantially horizontal direction relative to the base, and the first abutment and the second abutment are separated by a first distance along the substantially horizontal direction. In the second position, the platform extends between the first end and the second end in a substantially vertical direction such that a torso of a patient extends in the substantially vertical direction, and the first abutment and the second abutment are separated by a second, different distance along the substantially vertical direction.

Abstract: In some examples, a semiconductor package comprises a multi-layer package substrate. The multi-layer package substrate includes first and second metal layers, the first metal layer positioned above the second metal layer and coupled to the second metal layer by way of a via. The substrate also includes a dielectric covering at least part of the first and second metal layers and the via. The package includes a plated metal layer plated on at least part of the first metal layer and positioned above the dielectric, a combination of the first metal layer and the plated metal layer being thicker than the second metal layer. The package includes a semiconductor die having a device side, the device side vertically aligned with and coupled to the plated metal layer.

Abstract: A packaged electronic device includes a stacked configuration of a first semiconductor die in a first recess in a first side of a first conductive plate, a second semiconductor die in a second recess in a first side of a second conductive plate, a third conductive plate electrically coupled to a second side of the second semiconductor die, and a package structure that encloses the first semiconductor die, and the second semiconductor die, where the package structure includes a side that exposes a portion of a second side of the first conductive plate.

Abstract: One aspect of the disclosure relates to an extramedullary distraction and compression system. The extramedullary distraction system includes: a housing configured to be attached to a bone at a first location, the housing having a magnet and a lead screw positioned therein, wherein the lead screw is coupled to the magnet such that rotation of the magnet causes rotation of the lead screw, at least one retainer clip disposed around the lead screw; a rod configured to be attached to the bone at a second location and configured to interact with the lead screw such that, upon rotation of the lead screw, the rod distracts or contracts relative to the housing.

Abstract: Various implementations include an adjustable implant such as a distraction/compression device. In certain cases, the adjustable implant can include a housing; an adjustable member at least partially positioned within the housing and configured to translate relative to the housing; and an intermediary member positioned between the housing and the adjustable member.

Abstract: The present disclosure provides implants, sensor modules, networks, and methods configured to establish transcutaneous power and transcutaneous bidirectional data communication using ultrasound signals between two or more medical devices located on and within a body of a patient.

Abstract: A packaged electronic device includes a semiconductor die, a conductive plate coupled to a lead, a solder structure and a package structure. The semiconductor die has opposite first and second sides and a terminal exposed along the second side. The conductive plate has opposite first and second sides and an indent that extends into the first side, the conductive plate, and the solder structure extends between the second side of the semiconductor die and the first side of the conductive plate to electrically couple the conductive plate to the terminal, and the solder structure extends into the indent. The package structure encloses the semiconductor die, the conductive plate and a portion of the lead.

Abstract: The present invention relates to a method for improving stability of a hydrogen gaseous dispensing system. An example of such system is hydrogen powered vehicle fuel filling station. Vehicle is filled by multiple high pressure gaseous hydrogen tubes, usually one tube at a time. For safety and reliability reasons a control requirement for such system is to be able to deliver the hydrogen at constant rate to the fuel tank so that its rate of pressure increase stays constant during entire filling process. A dual pressure regulator arrangement is proposed to better maintain flow continuity and/or pressure during tube switching.

Abstract: A packaged electronic device includes a stacked configuration of a first semiconductor die in a first recess in a first side of a first conductive plate, a second semiconductor die in a second recess in a first side of a second conductive plate, a third conductive plate electrically coupled to a second side of the second semiconductor die, and a package structure that encloses the first semiconductor die, and the second semiconductor die, where the package structure includes a side that exposes a portion of a second side of the first conductive plate.