Patents by Inventor Jorge Padilla
Jorge Padilla has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240057297Abstract: Methods, systems, and apparatus for liquid coolant replacement in a cooling distribution unit during operation of the cooling distribution unit. Active liquid coolant to be replaced is removed from the flow cycle of the cooling distribution unit while the coolant distribution unit is operational and providing cooling to an electronic system. Additionally, replacement liquid coolant is provided to the flow cycle while the coolant distribution unit is operational and providing cooling to an electronic system.Type: ApplicationFiled: October 17, 2022Publication date: February 15, 2024Inventors: Jorge Padilla, Reza Khiabani, Madhusudan Krishnan Iyengar
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Patent number: 11832396Abstract: A server tray package includes a motherboard assembly that includes a plurality of data center electronic devices, the plurality of data center electronic devices including at least one heat generating processor device; and a liquid cold plate assembly. The liquid cold plate assembly includes a base portion mounted to the motherboard assembly, the base portion and motherboard assembly defining a volume that at least partially encloses the plurality of data center electronic devices; and a top portion mounted to the base portion and including a heat transfer member shaped to thermally contact the heat generating processor device, the heat transfer member including an inlet port and an outlet port that are in fluid communication with a cooling liquid flow path defined through the heat transfer member.Type: GrantFiled: June 2, 2020Date of Patent: November 28, 2023Assignee: Google LLCInventors: Madhusudan Krishnan Iyengar, Christopher Gregory Malone, Yuan Li, Jorge Padilla, Woon-Seong Kwon, Teckgyu Kang, Norman Paul Jouppi
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Publication number: 20230037380Abstract: Systems and methods for utilizing the dead space around the periphery of a chip for sealing a direct liquid cooled module are disclosed. One of the functions of a direct liquid cooled module is to provide cooling liquid to components located on a chip. A groove member for receiving a sealing member may be applied to the top surface of the chip. The groove member may be directly deposited to the top surface or coupled thereto via an adhesive and/or epoxy. The groove member may be in the form of opposing sidewalls or a u-shaped structure each of which form a partial enclosure for receipt of the sealing member. The groove member may be located entirely within the dead space or at least partially within the dead space and partially within a central area in which the chip components are located. The sealing member may be an O-ring or a gasket.Type: ApplicationFiled: October 21, 2022Publication date: February 9, 2023Inventors: Jorge Padilla, Madhusudan K. Iyengar, Connor Burgess, Padam Jain, Yuan Li, Feini Zhang
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Patent number: 11488890Abstract: Systems and methods for utilizing the dead space around the periphery of a chip for sealing a direct liquid cooled module are disclosed. One of the functions of a direct liquid cooled module is to provide cooling liquid to components located on a chip. A groove member for receiving a sealing member may be applied to the top surface of the chip. The groove member may be directly deposited to the top surface or coupled thereto via an adhesive and/or epoxy. The groove member may be in the form of opposing sidewalls or a u-shaped structure each of which form a partial enclosure for receipt of the sealing member. The groove member may be located entirely within the dead space or at least partially within the dead space and partially within a central area in which the chip components are located. The sealing member may be an O-ring or a gasket.Type: GrantFiled: May 21, 2020Date of Patent: November 1, 2022Assignee: Google LLCInventors: Jorge Padilla, Madhusudan K. Iyengar, Connor Burgess, Padam Jain, Yuan Li, Feini Zhang
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Publication number: 20220013435Abstract: Methods, systems, and apparatus, including an integrated circuit (IC) with a ring-shaped hot spot area. In one aspect, an IC includes a first area along an outside perimeter of a surface of the IC. The first area defines a first inner perimeter. The IC includes a second area that includes a center of the IC and that includes a first set of components. The second area defines a first outer. The IC includes a ring-shaped hot spot area between the first area and the second area. The ring-shaped hot spot area defines a ring outer perimeter that is juxtaposed with the first inner perimeter. The ring-shaped hot spot area defines a ring inner perimeter that is juxtaposed with the first outer perimeter. The ring-shaped hot spot area includes a second set of components that produce more heat than the first set of components.Type: ApplicationFiled: September 24, 2021Publication date: January 13, 2022Inventors: Madhusudan Krishnan Iyengar, Norman Paul Jouppi, Jorge Padilla, Christopher Gregory Malone
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Publication number: 20210366807Abstract: Systems and methods for utilizing the dead space around the periphery of a chip for sealing a direct liquid cooled module are disclosed. One of the functions of a direct liquid cooled module is to provide cooling liquid to components located on a chip. A groove member for receiving a sealing member may be applied to the top surface of the chip. The groove member may be directly deposited to the top surface or coupled thereto via an adhesive and/or epoxy. The groove member may be in the form of opposing sidewalls or a u-shaped structure each of which form a partial enclosure for receipt of the sealing member. The groove member may be located entirely within the dead space or at least partially within the dead space and partially within a central area in which the chip components are located. The sealing member may be an O-ring or a gasket.Type: ApplicationFiled: May 21, 2020Publication date: November 25, 2021Inventors: Jorge Padilla, Madhusudan K. Iyengar, Connor Burgess, Padam Jain, Yuan Li, Feini Zhang
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Publication number: 20210366806Abstract: Systems and methods for using spring force based compliance to minimize the bypass liquid flow gaps between the tops of chip microfins and bottom side of manifold ports are disclosed herein. A fluid delivery and exhaust manifold structure provides direct liquid cooling of a module. The manifold sits on top of a chip with flow channels. Inlet and outlet channels of the manifold in contact with flow channels of the chip creates an intricate crossflow path for the coolant resulting in improved heat transfer between the chip and the working fluid. The module is also designed with pressure reduction features using internal leakage flow openings to account for pressure differential between fluid entering and being expelled from the module.Type: ApplicationFiled: May 20, 2020Publication date: November 25, 2021Inventors: Madhusudan K. Iyengar, Connor Burgess, Emad Samadiani, Padam Jain, Jorge Padilla, Feini Zhang, Yuan Li
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Patent number: 11158566Abstract: Methods, systems, and apparatus, including an integrated circuit (IC) with a ring-shaped hot spot area. In one aspect, an IC includes a first area along an outside perimeter of a surface of the IC. The first area defines a first inner perimeter. The IC includes a second area that includes a center of the IC and that includes a first set of components. The second area defines a first outer. The IC includes a ring-shaped hot spot area between the first area and the second area. The ring-shaped hot spot area defines a ring outer perimeter that is juxtaposed with the first inner perimeter. The ring-shaped hot spot area defines a ring inner perimeter that is juxtaposed with the first outer perimeter. The ring-shaped hot spot area includes a second set of components that produce more heat than the first set of components.Type: GrantFiled: June 14, 2019Date of Patent: October 26, 2021Assignee: Google LLCInventors: Madhusudan Krishnan Iyengar, Norman Paul Jouppi, Jorge Padilla, Christopher Gregory Malone
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Patent number: 11042200Abstract: An apparatus that first and second volumes are fluidly separated by a combination of a first second and a second sections, where the first section is insoluble to a cooling liquid and the second section is soluble to the cooling liquid. In the event of a leak of coolant liquid, the second sections dissolve, forming a fluid path from the first volume to the second volume. The coolant liquid may then escape the first volume in spaces that result from the dissolution of the second sections.Type: GrantFiled: October 28, 2020Date of Patent: June 22, 2021Assignee: Google LLCInventors: Shawn Emory Bender, Jorge Padilla
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Patent number: 10966352Abstract: This disclosure describes a cooling system, for example, for rack mounted electronic devices (e.g., servers, processors, memory, networking devices or otherwise) in a data center. In various disclosed implementations, the cooling system may be or include a liquid cold plate assembly that is part of or integrated with a server tray package. In some implementations, the liquid cold plate assembly includes a base portion and a top portion that, in combination, form a cooling liquid flow path through which a cooling liquid is circulated and a thermal interface between one or more heat generating devices and the cooling liquid.Type: GrantFiled: September 24, 2018Date of Patent: March 30, 2021Assignee: Google LLCInventors: Madhusudan Krishnan Iyengar, Jorge Padilla
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Publication number: 20210064107Abstract: An apparatus that first and second volumes are fluidly separated by a combination of a first second and a second sections, where the first section is insoluble to a cooling liquid and the second section is soluble to the cooling liquid. In the event of a leak of coolant liquid, the second sections dissolve, forming a fluid path from the first volume to the second volume. The coolant liquid may then escape the first volume in spaces that result from the dissolution of the second sections.Type: ApplicationFiled: October 28, 2020Publication date: March 4, 2021Inventors: Shawn Emory Bender, Jorge Padilla
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Patent number: 10852789Abstract: An apparatus that first and second volumes are fluidly separated by a combination of a first second and a second sections, where the first section is insoluble to a cooling liquid and the second section is soluble to the cooling liquid. In the event of a leak of coolant liquid, the second sections dissolve, forming a fluid path from the first volume to the second volume. The coolant liquid may then escape the first volume in spaces that result from the dissolution of the second sections.Type: GrantFiled: July 22, 2020Date of Patent: December 1, 2020Assignee: Google LLCInventors: Shawn Emory Bender, Jorge Padilla
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Publication number: 20200373222Abstract: Methods, systems, and apparatus, including an integrated circuit (IC) with a ring-shaped hot spot area. In one aspect, an IC includes a first area along an outside perimeter of a surface of the IC. The first area defines a first inner perimeter. The IC includes a second area that includes a center of the IC and that includes a first set of components. The second area defines a first outer. The IC includes a ring-shaped hot spot area between the first area and the second area. The ring-shaped hot spot area defines a ring outer perimeter that is juxtaposed with the first inner perimeter. The ring-shaped hot spot area defines a ring inner perimeter that is juxtaposed with the first outer perimeter. The ring-shaped hot spot area includes a second set of components that produce more heat than the first set of components.Type: ApplicationFiled: June 14, 2019Publication date: November 26, 2020Inventors: Madhusudan Krishnan Iyengar, Norman Paul Jouppi, Jorge Padilla, Christopher Gregory Malone
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Publication number: 20200296862Abstract: A server tray package includes a motherboard assembly that includes a plurality of data center electronic devices, the plurality of data center electronic devices including at least one heat generating processor device; and a liquid cold plate assembly. The liquid cold plate assembly includes a base portion mounted to the motherboard assembly, the base portion and motherboard assembly defining a volume that at least partially encloses the plurality of data center electronic devices; and a top portion mounted to the base portion and including a heat transfer member shaped to thermally contact the heat generating processor device, the heat transfer member including an inlet port and an outlet port that are in fluid communication with a cooling liquid flow path defined through the heat transfer member.Type: ApplicationFiled: June 2, 2020Publication date: September 17, 2020Inventors: Madhusudan Krishnan Iyengar, Christopher Gregory Malone, Yuan Li, Jorge Padilla, Woon-Seong Kwon, Teckgyu Kang, Norman Paul Jouppi
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Patent number: 10761577Abstract: An apparatus that first and second volumes are fluidly separated by a combination of a first second and a second sections, where the first section is insoluble to a cooling liquid and the second section is soluble to the cooling liquid. In the event of a leak of coolant liquid, the second sections dissolve, forming a fluid path from the first volume to the second volume. The coolant liquid may then escape the first volume in spaces that result from the dissolution of the second sections.Type: GrantFiled: August 29, 2019Date of Patent: September 1, 2020Assignee: Google LLCInventors: Shawn Emory Bender, Jorge Padilla
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Patent number: 10681846Abstract: A server tray package includes a motherboard assembly that includes a plurality of data center electronic devices, the plurality of data center electronic devices including at least one heat generating processor device; and a liquid cold plate assembly. The liquid cold plate assembly includes a base portion mounted to the motherboard assembly, the base portion and motherboard assembly defining a volume that at least partially encloses the plurality of data center electronic devices; and a top portion mounted to the base portion and including a heat transfer member shaped to thermally contact the heat generating processor device, the heat transfer member including an inlet port and an outlet port that are in fluid communication with a cooling liquid flow path defined through the heat transfer member.Type: GrantFiled: April 19, 2018Date of Patent: June 9, 2020Assignee: Google LLCInventors: Madhusudan Krishnan Iyengar, Christopher Gregory Malone, Yuan Li, Jorge Padilla, Woon-Seong Kwon, Teckgyu Kang, Norman Paul Jouppi
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Patent number: 10645847Abstract: A data center cooling system includes a server rack sub-assembly that includes a motherboard mounted on a support member and a heat generating electronic devices mounted on the a motherboard; a cold plate positioned in thermal communication with at least a portion of the heat generating electronic devices, the cold plate configured to receive a flow of a cooling liquid circulated through a supply conduit fluidly coupled to a liquid inlet of the cold plate, through the cold plate, and through a return conduit fluidly coupled to a liquid outlet of the cold plate; and a modulating control valve attached to either of the motherboard or the support member and positioned in either of the supply conduit or the return conduit, the modulating control valve configured to adjust a rate of the flow of the cooling liquid based on an operating condition of at least one of the heat generating electronic devices.Type: GrantFiled: April 20, 2018Date of Patent: May 5, 2020Assignee: Google LLCInventors: William Edwards, Madhusudan Krishnan Iyengar, Sundar Rajan, Jorge Padilla, Norman Paul Jouppi
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Publication number: 20200100396Abstract: This disclosure describes a cooling system, for example, for rack mounted electronic devices (e.g., servers, processors, memory, networking devices or otherwise) in a data center. In various disclosed implementations, the cooling system may be or include a liquid cold plate assembly that is part of or integrated with a server tray package. In some implementations, the liquid cold plate assembly includes a base portion and a top portion that, in combination, form a cooling liquid flow path through which a cooling liquid is circulated and a thermal interface between one or more heat generating devices and the cooling liquid.Type: ApplicationFiled: September 24, 2018Publication date: March 26, 2020Inventors: Madhusudan Krishnan Iyengar, Jorge Padilla
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Patent number: 10548239Abstract: A cooling system, for example, for rack mounted electronic devices (e.g., servers, processors, memory, networking devices or otherwise) in a data center. In various disclosed implementations, the cooling system may be or include a liquid cold plate assembly that is part of or integrated with a server tray package. In some implementations, the liquid cold plate assembly includes a base portion and a top portion that, in combination, form a cooling liquid flow path through which a cooling liquid is circulated and a thermal interface between one or more heat generating devices and the cooling liquid.Type: GrantFiled: October 23, 2018Date of Patent: January 28, 2020Assignee: Google LLCInventors: Madhusudan Krishnan Iyengar, Gregory Sizikov, Yuan Li, Jorge Padilla, Woon-Seong Kwon, Teckgyu Kang
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Patent number: 10548240Abstract: A server tray package includes a motherboard assembly that includes a plurality of data center electronic devices; and a liquid cold plate assembly. The liquid cold plate assembly includes a base portion mounted to the motherboard assembly, the base portion and motherboard assembly defining a volume that at least partially encloses the plurality of data center electronic devices; and a top portion mounted to the base portion and including a heat transfer member that includes a first number of inlet ports and a second number of outlet ports that are in fluid communication with a cooling liquid flow path defined through the heat transfer member, the first number of inlet ports being different that the second number of outlet ports.Type: GrantFiled: January 11, 2019Date of Patent: January 28, 2020Assignee: Google LLCInventors: Madhusudan Krishnan Iyengar, Christopher Gregory Malone, Yuan Li, Jorge Padilla, Woon-Seong Kwon, Teckgyu Kang, Norman Paul Jouppi