Abstract: A process for soldering an electronic component onto a support which includes at least one heat drain for the component. The method uses a solder paste which incorporates a stripping flux activated at a first temperature, and a solder alloy melted at a second temperature. The process includes preheating the support on the face opposite the component through the heat drain up to the first temperature, placing the component on the support with the solder paste, heating the component by applying a hot gas at a sufficiently high temperature to bring the solder alloy to the melting temperature.

Abstract: The invention relates to a process for soldering an electronic component onto a support comprising at least one heat drain for the said component, using solder paste incorporating a stripping flux activated at a first temperature, and a solder alloy melting at a second temperature. The process is characterised by the fact that it consists of: preheating the support on the face opposite the component through the heat drain up to the said first temperature, placing the component on the support with the solder paste, heating the component by applying a hot gas at a sufficiently high temperature to bring the solder alloy to the melting temperature. The invention also relates to an installation for implementing the process. It is also used for the repair of an electronic card by replacing defective elements without the risk of unsoldering or damaging adjacent elements.