Abstract: The method comprises: detecting the positions (u0, v0) and (u1, v1) of said photonic beam (L) according to the coordinate axes X, Y on a first and second plane XY, which cut an optical axis X at a first and second point, respectively; comparing the results of said positional detections (u0, v0) and (u1, v1), and: if there are discrepancies which lie outside the margin of error (p), adjusting the angle of the photonic beam (L) according to the angle ? and/or the angle ? in order to overcome said discrepancies; or if there are no discrepancies which lie outside said margin of error (p), considering the angle of said photonic beam (L) as being properly adjusted. The system is adapted to implement the method set out by the invention.

Abstract: A laser marking system includes a means for generating a laser beam and a marking control unit which generates individual signals applied to a laser system for producing an N×M matrix of dots used to mark an object. Each dot is created from the laser light from at least one laser diode. If multiple lasers are used, their power can be combined with a concentrator to produce a single beam with a higher power and also provide for simplified control over the beam's power.

Abstract: The invention relates to a system for marking or perforating by laser and to a marking or perforation process in said system, which is comprised of at least one laser (19) which produces a beam, a supply unit for at least one laser (19), a control means (12) with a control program which controls the laser (19), a deflector (16) particularly an optical-acoustic deflector which produces different beam deflection angles, in this case an optical system traversed by the beam, which produces a marking or a perforation configured like a matrix of points (n.times.m) on a surface of a product in relative motion between the product to be marked or perforated and the laser beam. The supply unit and/or the deflector (16) may be controlled by the control program. The system of the invention provides for a dynamic control of the marking or perforation resolution in a vertical direction.