Patents by Inventor Jose Alvin Santos Caparas

Jose Alvin Santos Caparas has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Leadframe design for QFN package with top terminal leads
    Patent number: 7960815
    Abstract: A semiconductor package includes a leadframe. A first lead finger has a lower portion, a connecting portion extending vertically upward from the lower portion, and a substantially flat, top portion. The top portion forms a top terminal lead structure. A second lead finger is electrically connected to the first lead finger. A portion of the second lead finger forms a bottom terminal lead structure. A portion of the second lead finger corresponds to a bottom surface of the semiconductor package. A surface of the substantially flat, top portion corresponds to a top surface of the semiconductor package.
    Type: Grant
    Filed: March 5, 2009
    Date of Patent: June 14, 2011
    Assignee: STATS ChipPAC, Ltd.
    Inventors: Zigmund R. Camacho, Henry D. Bathan, Jose Alvin Santos Caparas, Lionel Chien Hui Tay
  • Leadframe Design for QFN Package with Top Terminal Leads
    Publication number: 20090166821
    Abstract: A semiconductor package includes a leadframe. A first lead finger has a lower portion, a connecting portion extending vertically upward from the lower portion, and a substantially flat, top portion. The top portion forms a top terminal lead structure. A second lead finger is electrically connected to the first lead finger. A portion of the second lead finger forms a bottom terminal lead structure. A portion of the second lead finger corresponds to a bottom surface of the semiconductor package. A surface of the substantially flat, top portion corresponds to a top surface of the semiconductor package.
    Type: Application
    Filed: March 5, 2009
    Publication date: July 2, 2009
    Applicant: STATS CHIPPAC, LTD.
    Inventors: Zigmund R. Camacho, Henry D. Bathan, Jose Alvin Santos Caparas, Lionel Chien Hui Tay
  • Leadframe design for QFN package with top terminal leads
    Patent number: 7517733
    Abstract: A semiconductor package includes a leadframe. A first lead finger has a lower portion, a connecting portion extending vertically upward from the lower portion, and a substantially flat, top portion. The top portion forms a top terminal lead structure. A second lead finger is electrically connected to the first lead finger. A portion of the second lead finger forms a bottom terminal lead structure. A portion of the second lead finger corresponds to a bottom surface of the semiconductor package. A surface of the substantially flat, top portion corresponds to a top surface of the semiconductor package.
    Type: Grant
    Filed: March 22, 2007
    Date of Patent: April 14, 2009
    Assignee: STATS ChipPAC, Ltd.
    Inventors: Zigmund R. Camacho, Henry D. Bathan, Jose Alvin Santos Caparas, Lionel Chien Hui Tay
  • Leadframe Design for QFN Package with Top Terminal Leads
    Publication number: 20080230876
    Abstract: A semiconductor package includes a leadframe. A first lead finger has a lower portion, a connecting portion extending vertically upward from the lower portion, and a substantially flat, top portion. The top portion forms a top terminal lead structure. A second lead finger is electrically connected to the first lead finger. A portion of the second lead finger forms a bottom terminal lead structure. A portion of the second lead finger corresponds to a bottom surface of the semiconductor package. A surface of the substantially flat, top portion corresponds to a top surface of the semiconductor package.
    Type: Application
    Filed: March 22, 2007
    Publication date: September 25, 2008
    Applicant: STATS ChipPAC, LTD.
    Inventors: Zigmund R. CAMACHO, Henry D. BATHAN, Jose Alvin Santos Caparas, Lionel Chien Hui TAY