Patents by Inventor Josef Gaida
Josef Gaida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230142446Abstract: The invention relates to an acidic aqueous composition for electrolytic copper plating, the composition comprising (i) copper (II) ions, (ii) one or more than one suppressor consisting of or comprising one single N-heteroaromatic mono-ring, said mono-ring comprising at least two ring nitrogen atoms and more than one substituent covalently connected to one of said ring nitrogen atoms and/or a ring carbon atom, wherein said substituent independently is or comprises one or more than one linear or branched polyalkylene glycol moiety, and/or one or more than one linear or branched polyalkylene glycol block polyalkylene glycol, or random polyalkylene glycol moiety, with the proviso that if said suppressor comprises a OH group, then it is a terminal OH group of said polyalkylene glycol moiety, polyalkylene glycol block polyalkylene glycol, and random polyalkylene glycol moiety, respectively, and said suppressor does not comprise NH2 groups, halogen atoms, and sulfur atoms; a method of electrolytic copper platingType: ApplicationFiled: April 22, 2021Publication date: May 11, 2023Inventors: Ralf SCHMIDT, Josef GAIDA, Willi ROHLAND, Jens PALM, Himendra JHA
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Publication number: 20220154343Abstract: Method for activating a surface of a non-conductive or carbon-fibres containing substrate for metallization, the method including: (a) providing said substrate, (b) providing an aqueous, palladium-free activation composition comprising (i) a first species of dissolved transition metal ions and additionally metal particles thereof, (ii) at least one complexing agent, (iii) permanently or temporarily at least one reducing agent, (iv) optionally one or more second species of dissolved metal ions different from the first species, (c) contacting the substrate with said activation composition such that a transition metal or a transition metal alloy is deposited on the surface of said substrate and an activated surface for metallization is obtained.Type: ApplicationFiled: April 1, 2020Publication date: May 19, 2022Inventors: Josef GAIDA, Lutz STAMP, Lena IVANOVA, Thomas THOMAS
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Publication number: 20210262105Abstract: The present invention relates to a composition comprising one or a mixture of two or more quinoline-polyethylene glycol containing compound, each quinoline-polyethylene glycol containing compound comprising: one to three quinoline group and one or more polyethylene glycol group, wherein, in each said quinoline-polyethylene glycol containing compound, one to three of said one to three quinoline group is connected via one or more oxygen atom of said one or more polyethylene glycol group via carbon 6 or carbon 8 of said one to three quinoline group.Type: ApplicationFiled: May 10, 2021Publication date: August 26, 2021Inventors: Kun SI, Ralf SCHMIDT, Onas BOLTON, Josef GAIDA, Frank VON HORSTEN, Dirk ROHDE, Himendra JHA, Jens PALM, Olivier MANN, Angela LLAVONA-SERRANO
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Patent number: 11091849Abstract: An aqueous bath for filling a vertical interconnect access or trench of a work piece with nickel or a nickel alloy, the bath comprising a source of nickel ions, and optionally a source of ions of at least one alloying metal, at least one buffering agent, at least one of a dimer of a compound of formula (I) or mixtures thereof wherein R1 is a substituted or unsubstituted alkenyl group, R2 may be present or not, and if present R2 is a —(CH2)n—SO3? group, wherein n is an integer in the range of 1-6, and wherein one or more of the hydrogens in the group may be replaced by a substituent, preferably hydroxide; and a method for filling a vertical interconnect access or trench of a work piece with nickel or a nickel alloy with said aqueous bath.Type: GrantFiled: September 13, 2018Date of Patent: August 17, 2021Assignee: Atotech Deutschland GmbHInventors: Josef Gaida, Jan Sperling, Mauro Castellani, Grigory Vazhenin, Stefanie Ackermann, Heiko Brunner, Dirk Rohde
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Patent number: 11035051Abstract: The present invention relates to an acidic aqueous composition (plating bath) for electrolytic copper plating (electrolytic deposition of copper), the composition comprising (i) copper (II) ions, (ii) one or more than one compound of Formula (Ia) (iii) one, two, three or more than three further compounds, which are different from the compound of Formula (Ia), with the definitions given below, the use of the acidic aqueous composition according to the invention for electrolytic copper plating, the use of the compound of Formula (Ia) in an acidic aqueous composition for electrolytic metal plating, a method of electrolytic copper plating using the acidic aqueous composition according to the invention, and specific compounds derived from Formula (Ia) for an acidic aqueous composition for electrolytic metal plating.Type: GrantFiled: August 10, 2017Date of Patent: June 15, 2021Assignee: Atotech Deutschland GmbHInventors: Kun Si, Ralf Schmidt, Onas Bolton, Josef Gaida, Frank Von Horsten, Dirk Rohde, Himendra Jha, Jens Palm, Olivier Mann, Angela Llavona-Serrano
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Publication number: 20200199766Abstract: An aqueous bath for filling a vertical interconnect access or trench of a work piece with nickel or a nickel alloy, the bath comprising a source of nickel ions, and optionally a source of ions of at least one alloying metal, at least one buffering agent, at least one of a dimer of a compound of formula (I) or mixtures thereof wherein R1 is a substituted or unsubstituted alkenyl group, R2 may be present or not, and if present R2 is a —(CH2)n-SO3? group, wherein n is an integer in the range of 1-6, and wherein one or more of the hydrogens in the group may be replaced by a substituent, preferably hydroxide; and a method for filling a vertical interconnect access or trench of a work piece with nickel or a nickel alloy with said aqueous bath.Type: ApplicationFiled: September 13, 2018Publication date: June 25, 2020Inventors: Josef GAIDA, Jan SPERLING, Mauro CASTELLANI, Grigory VAZHENIN, Stefanie ACKERMANN, Heiko BRUNNER, Dirk ROHDE
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Patent number: 10619251Abstract: An etching solution for copper and copper alloy surfaces comprising at least one acid, at least one oxidising agent suitable to oxidise copper, at least one source of halide ions and further at least one polyamide containing at least one polymeric moiety according to formula (I) wherein each a is independently from each other selected from 1, 2 and 3; each b is an integer independently from each other ranging from 5 to 10000; each R1 is a monovalent residue independently from each other selected from the group consisting of substituted or unsubstituted C1-C8-alkyl groups and a method for its use are provided. Such etching solution is particularly useful for retaining the shape of treated copper and copper alloy lines.Type: GrantFiled: December 14, 2016Date of Patent: April 14, 2020Assignee: Atotech Deutschland GmbHInventors: Fabian Michalik, Norbert Lützow, Josef Gaida, Thomas Hülsmann, Gabriela Schmidt
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Publication number: 20190203369Abstract: The present invention relates to an acidic aqueous composition (plating bath) for electrolytic copper plating (electrolytic deposition of copper), the composition comprising (i) copper (II) ions, (ii) one or more than one compound of Formula (Ia) (iii) one, two, three or more than three further compounds, which are different from the compound of Formula (Ia), with the definitions given below, the use of the acidic aqueous composition according to the invention for electrolytic copper plating, the use of the compound of Formula (Ia) in an acidic aqueous composition for electrolytic metal plating, a method of electrolytic copper plating using the acidic aqueous composition according to the invention, and specific compounds derived from Formula (Ia) for an acidic aqueous composition for electrolytic metal plating.Type: ApplicationFiled: August 10, 2017Publication date: July 4, 2019Inventors: Kun SI, Ralf SCHMIDT, Onas BOLTON, Josef GAIDA, Frank VON HORSTEN, Dirk ROHDE, Himendra JHA, Jens PALM, Olivier MANN, Angela LLAVONA-SERRANO
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Publication number: 20190003061Abstract: An etching solution for copper and copper alloy surfaces comprising at least one acid, at least one oxidising agent suitable to oxidise copper, at least one source of halide ions and further at least one polyamide containing at least one polymeric moiety according to formula (I) wherein each a is independently from each other selected from 1, 2 and 3; each b is an integer independently from each other ranging from 5 to 10000; each R1 is a monovalent residue independently from each other selected from the group consisting of substituted or unsubstituted C1-C8-alkyl groups and a method for its use are provided. Such etching solution is particularly useful for retaining the shape of treated copper and copper alloy lines.Type: ApplicationFiled: December 14, 2016Publication date: January 3, 2019Applicant: Atotech Deutschland GmbHInventors: Fabian MICHALIK, Norbert LÜTZOW, Gabriela SCHMIDT, Josef GAIDA, Thomas HÜLSMANN
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Patent number: 9076773Abstract: The present invention concerns thin diffusion barriers in metal and metal alloy layer sequences of contact area/barrier layer/first bonding layer type for metal wire bonding applications. The diffusion barrier is selected from Co-M-P. Co-M-B and Co-M-B—P alloys wherein M is selected from Mn, Zr, Re, Mo, Ta and W having a thickness in the range 0.03 to 0.3 ?m. The first bonding layer is selected from palladium and palladium alloys.Type: GrantFiled: May 9, 2012Date of Patent: July 7, 2015Assignee: Atotech Deutschland GmbHInventors: Albrecht Uhlig, Josef Gaida, Christof Suchentrunk
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Patent number: 9057145Abstract: A method for electrodepositing a metal layer from an electrolytic bath is described, wherein the concentrations of at least two components of the electrolytic bath are monitored by carrying out the following steps: (a) a sample is taken from the electrolytic bath; (b) the sample is supplied to a column for solid phase extraction, which contains a solid sorbent material; (c) the column is subjected to a washing procedure with a first eluent, wherein the at least two components remain on the column, and undesired components are eluted from the column; (d) the at least two components are eluted from the column by a second eluent; (e) the concentrations of the at least two components in the eluate obtained in step (d) are determined without separating the components from each other. In this method the use of poly(divinyl benzene-co-N-vinyl pyrrolidone) for solid phase extraction is particularly advantageous.Type: GrantFiled: December 10, 2007Date of Patent: June 16, 2015Assignee: Atotech Deutschland GmbHInventors: Jürgen Barthelmes, Robert Rüther, Florence Lagorce-Broc, Olaf Kurtz, Oleg Sprenger, Marta Sainz-Vila, Thomas Moritz, Josef Gaida
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Patent number: 8986789Abstract: The invention relates to a substrate having a bondable metal coating comprising, in this order, on an Al or Cu surface: (a) a Ni—P layer, (b) a Pd layer and, optionally, (c) an Au layer, wherein the thickness of the Ni—P layer (a) is 0.2 to 10 m, the thickness of the Pd layer (b) is 0.05 to 1.0 m and the thickness of the optional Au layer (c) is 0.01 to 0.5 m, and wherein the Ni—P layer (a) has a P content of 10.5 to 14 wt.-%. The deposit internal stress of the resulting Ni—P/Pd stack is not higher than 34.48M?Pa (5,000 psi). Further, a process for the preparation of such a substrate is described.Type: GrantFiled: October 1, 2009Date of Patent: March 24, 2015Assignee: Atotech Deutschland GmbHInventors: Albrecht Uhlig, Josef Gaida, Christof Suchentrunk, Michael Boyle, Brian Washo
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Publication number: 20140110844Abstract: The present invention concerns thin diffusion barriers in metal and metal alloy layer sequences of contact area/barrier layer/first bonding layer type for metal wire bonding applications. The diffusion barrier is selected from Co-M-P. Co-M-B and Co-M-B—P alloys wherein M is selected from Mn, Zr, Re, Mo, Ta and W having a thickness in the range 0.03 to 0.3 ?m. The first bonding layer is selected from palladium and palladium alloys.Type: ApplicationFiled: May 9, 2012Publication date: April 24, 2014Applicant: ATOTECH DEUTSCHLAND GMBHInventors: Albrecht Uhlig, Josef Gaida, Christof Suchentrunk
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Publication number: 20110200842Abstract: The invention relates to a substrate having a bondable metal coating comprising, in this order, on an Al or Cu surface: (a) a Ni—P layer, (b) a Pd layer and, optionally, (c) an Au layer, wherein the thickness of the Ni—P layer (a) is 0.2 to 10 m, the thickness of the Pd layer (b) is 0.05 to 1.0 m and the thickness of the optional Au layer (c) is 0.01 to 0.5 m, and wherein the Ni—P layer (a) has a P content of 10.5 to 14 wt.-%. The deposit internal stress of the resulting Ni—P/Pd stack is not higher than 34.48 M?Pa (5,000 psi). Further, a process for the preparation of such a substrate is described.Type: ApplicationFiled: October 1, 2009Publication date: August 18, 2011Applicant: ATOTECH DEUTSCHLAND GMBHInventors: Albrecht Uhlig, Josef Gaida, Christof Suchentrunk, Michael Boyle, Brian Washo
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Publication number: 20100059384Abstract: A method for electrodepositing a metal layer from an electrolytic bath is described, wherein the concentrations of at least two components of the electrolytic bath are monitored by carrying out the following steps: (a) a sample is taken from the electrolytic bath; (b) the sample is supplied to a column for solid phase extraction, which contains a solid sorbent material; (c) the column is subjected to a washing procedure with a first eluent, wherein the at least two components remain on the column, and undesired components are eluted from the column; (d) the at least two components are eluted from the column by a second eluent; (e) the concentrations of the at least two components in the eluate obtained in step (d) are determined without separating the components from each other. In this method the use of poly(divinyl benzene-co-N-vinyl pyrrolidone) for solid phase extraction is particularly advantageous.Type: ApplicationFiled: December 10, 2007Publication date: March 11, 2010Applicant: Atotech Deutschland GmbHInventors: Jürgen Barthelmes, Robert Rüther, Florence Lagorce-Broc, Olaf Kurtz, Oleg Sprenger, Marta Sainz-Vila, Thomas Moritz, Josef Gaida
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Publication number: 20030185757Abstract: The present invention relates to iron-containing nanoparticles having a modular structure, their production, and their use for diagnostic and therapeutic purposes.Type: ApplicationFiled: March 27, 2002Publication date: October 2, 2003Inventors: Mayk Kresse, Detlev Pfefferer, Ruediger Lawaczeck, Susanne Wagner, Wolfgang Ebert, Volker Elste, Wolfhard Semmler, Matthias Taupitz, Josef Gaida, Anja Herrmann, Monika Ebert, Udo Swiderski
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Patent number: 6576221Abstract: The present invention relates to iron-containing nanoparticles having a modular structure, their production, and their use for diagnostic and therapeutic purposes. The nanoparticles according to the invention are characterized in that they consist of an iron-containing core, a primary coat (synthesis polymer), and a secondary coat (targeting polymer) and, optionally, of pharmaceutic adjuvants, pharmaceuticals, and/or adsorption mediators/enhancers.Type: GrantFiled: November 30, 1999Date of Patent: June 10, 2003Assignees: Institut fur Diagnostikforschung GmbH, Der Freien Universitat BerlineInventors: Mayk Kresse, Detlev Pfefferer, Rüdiger Lawaczek, Susanne Wagner, Wolfgang Ebert, Volker Elste, Wolfhard Semmler, Matthias Taupitz, Josef Gaida, Anja Herrmann, Monika Jukl, Udo Swiderski
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Publication number: 20020141943Abstract: The present invention relates to iron-containing nanoparticles having a modular structure, their production, and their use for diagnostic and therapeutic purposes.Type: ApplicationFiled: September 26, 2001Publication date: October 3, 2002Applicant: INSTITUT FUR DIAGNOSTIKFORSCHUNG GMBHInventors: Mayk Kresse, Detlev Pfefferer, Ruediger Lawaczeck, Susanne Wagner, Wolfgang Ebert, Volker Elste, Wolfhard Semmler, Matthias Taupitz, Josef Gaida, Anja Herrmann, Monika Ebert, Udo Swiderski
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Patent number: 6048515Abstract: Modular iron-containing nanoparticles are disclosed, as well as their production and use in diagnosis and therapy. The nanoparticles are characterised in that they have an iron-containing core, a primary coat (synthetic polymer) and a secondary coat (target polymer), and optional auxiliary pharmaceutical substances, pharmaceuticals and/or adsorption mediators.Type: GrantFiled: June 25, 1997Date of Patent: April 11, 2000Assignees: Institut fur Diagnostikforschung GmbH, Der Freien Universitat BerlineInventors: Mayk Kresse, Detlev Pfefferer, Rudiger Lawaczek, Susanne Wagner, Wolfgang Ebert, Volker Elste, Wolfhard Semmler, Matthias Taupitz, Josef Gaida, Anja Herrmann, Monika Jukl, Udo Swiderski
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Patent number: 5849259Abstract: The invention relates to new 3,8-substituted deuteroporphyrin derivatives with various substituents in positions 13 and 17 of the porphyrin skeleton, pharmaceutical agents containing these compounds, their use in diagnosis and therapy as well as process for the production of these agents.Type: GrantFiled: May 24, 1995Date of Patent: December 15, 1998Assignee: Institut Fur Diagnostikforschung GmbHInventors: Christoph Stephan Hilger, Franz Karl Maier, Heinz Gries, Ulrich Niedballa, Johannes Platzek, Mary Lee-Vaupel, Wolfgang Ebert, Jurgen Conrad, Josef Gaida