Abstract: A method for manufacturing a chip package is provided. The method includes: forming an electrically insulating material over a chip side; selectively removing at least part of the electrically insulating material thereby forming a trench in the electrically insulating material, depositing electrically conductive material in the trench wherein the electrically conductive material is electrically connected to at least one contact pad formed over the chip side; forming an electrically conductive structure over the electrically insulating material, wherein at least part of the electrically conductive structure is in direct physical and electrical connection with the electrically conductive material; and depositing a joining structure over the electrically conductive structure.

Abstract: A method for producing a component and device including a component is disclosed. A basic substrate having paper as substrate material is provided, at least one integrated circuit is applied to the basic substrate, the at least one integrated circuit applied on the basic substrate is enveloped with an encapsulant, and at least parts of the basic substrate are removed from the at least one enveloped integrated circuit.

Abstract: A method for manufacturing a chip package is provided. The method includes: forming an electrically insulating material over a chip side; selectively removing at least part of the electrically insulating material thereby forming a trench in the electrically insulating material, depositing electrically conductive material in the trench wherein the electrically conductive material is electrically connected to at least one contact pad formed over the chip side; forming an electrically conductive structure over the electrically insulating material, wherein at least part of the electrically conductive structure is in direct physical and electrical connection with the electrically conductive material; and depositing a joining structure over the electrically conductive structure.

Abstract: A method for producing a component and device including a component is disclosed. A basic substrate having paper as substrate material is provided, at least one integrated circuit is applied to the basic substrate, the at least one integrated circuit applied on the basic substrate is enveloped with an encapsulant, and at least parts of the basic substrate are removed from the at least one enveloped integrated circuit.

Abstract: A method for producing a component and device including a component is disclosed. A basic substrate having paper as substrate material is provided, at least one integrated circuit is applied to the basic substrate, the at least one integrated circuit applied on the basic substrate is enveloped with an encapsulant, and at least parts of the basic substrate are removed from the at least one enveloped integrated circuit.

Abstract: A method for producing a component and device including a component is disclosed. A basic substrate having paper as substrate material is provided, at least one integrated circuit is applied to the basic substrate, the at least one integrated circuit applied on the basic substrate is enveloped with an encapsulant, and at least parts of the basic substrate are removed from the at least one enveloped integrated circuit.

Abstract: A method for designing and manufacturing a micromechanical device providing a substrate having an anchoring region forming a sacrificial layer on substrate while leaving bare the anchoring region depositing an adhesion layer (30) on the sacrificial layer (25) and the anchoring region (20; 120; 220; 320, 325; 420, 425; 620; 755); forming a mask on the adhesion layer; depositing an electroplating layer on the unmasked region of the adhesion layer; and removing the mask and the sacrificial layer.

Abstract: A manufacturing method for a micromechanical device. In this method, a substrate is prepared with a plating base area to accommodate an anchoring region, and an adhesive layer is formed and structured on the substrate, so that the anchoring region is formed in the plating base area in the form of a quasi-insular region in a recess of the adhesive layer. The quasi-insular region is connected to the adhesive layer outside of the plated based area by at least one thin web. A mask is formed on the adhesive layer and structured so that the anchoring region and an overgrowth region adjacent to the anchoring region remain unmasked. An electroplated layer is deposited on the unmasked anchoring region so that the overgrowth region is overgrown, and the mask and the part of the adhesive layer that has not been overgrown are removed.