Abstract: Improved coating and method of forming a nondewettable coating in a reactive carbon monoxide atmosphere wherein a small portion of palladium, platinum or mixture thereof is added to the coating mixture before the mixture is applied to the substrate. Alternatively, in the case of electrolytic deposition, a thin layer of palladium, platinum or mixture thereof is, e.g. electrolessly or by sputtering or silkscreening, deposited on a substrate before a tin or tin alloy coating is deposited, such as by sputtering, silkscreening, etc. The reaction temperature required to form a nondewettable bond is reduced or increased depending on the tin alloy content, but it appears that if platinum or palladium is participating in the reaction for the same alloy, the temperature for achieving the bond appears to be reduced.

Abstract: This invention relates to nitrides, oxides, arsenides, borides, phosphides, tellurides, titanates, silicides, carbides, etc. of metals or metalloids, such as or in their compacted forms, as substrates or base elements. These can be readily joined with various other substrates employing as a coating, film, layer or interlayer former a tin, lead, indium, or alloys thereof, in an admixture with a carbide or carbonyl former and joining the substrate or base in a carbon monoxide atmosphere with the coating, etc. former.

Abstract: As an article for manufacture, a tin, lead, indium, and alloys of each, admixed with a carbide or carbonyl former, for forming these with said tin, lead and indium, and their alloys into an "active" alloy form; these "active" alloy forms are suitable for making wettable carbon, graphite, diamond, sapphire, alumina, metal carbide, quartz, silicon metal, etc., composites which will not dewet upon heating but form strong bonds; methods for preparing said composites of various shapes, layers, coatings, and sandwiches; alloys, preforms and various metal-graphite, diamond, sapphire, alumina, metal carbide, quartz, silicon metal etc., structures also disclosed.

Abstract: Highly adhesive composites with an active tin alloy are obtained as coating on beryllia by depositing tin with, e.g. vanadium on beryllia, and heating in a carbon monoxide atmosphere of up to 1000.degree. C.

Abstract: Substrates such as boron nitride and titanium diboride and the like joined to other metal or metal sandwiches useful as resistance elements.

Abstract: As an article for manufacture, a tin, lead, indium, alloys of each with a carbide or carbonyl former in an admixture for forming said tin, lead and indium, wettable graphite composites which will not dewet upon heating; methods for preparing the composites of various shapes, layers, coatings, and sandwiches, of alloys, preforms and metal-graphite etc, structures are also disclosed.

Abstract: Apparatus for removing deposited matter, such as silicon and contaminants, from the interior of quartz diffusion tubes including an acid holding tank; a quartz-tube support for vertically holding the tube, neck down; a flexible seal for connecting the neck of the tube to the holding tank; an immersion pump and associated tubing for circulating the acid; and a spray head, connected with the pump and tubing, to spray the acid against the inside surface of the quartz tube to clean off the deposited matter. In order to prevent the acid sprayed on the inside surface from forming channels in the silicon or other deposited matter, two groups of nozzles are provided in the spray head--one group with its nozzles arranged at about 30.degree. from vertical, the other group with its nozzles arranged at about 60.degree. from vertical--so that the jets sprayed from each of the two groups are directed 90.degree.

Abstract: A semiconductor assembly devoid of wire bonds presents economies of manufacture and is especially suited for light emitting diodes. The semiconductor assembly comprises a semiconductor, an electrode-containing substrate supporting the semiconductor, and an electrode-containing cover supported by the semiconductor. Novel cure-shrinkable adhesive means incorporating an oxide remover (preferably a halogen) physically bonds together the semiconductor and the cover electrode.