Abstract: A semiconductor device comprises a substrate having a first surface and a second surface opposite the first surface, at least one connection element arranged on the first surface of the substrate to electrically and mechanically connect the substrate to a printed circuit board, and a radar semiconductor chip arranged on the first surface of the substrate.

Abstract: A method for producing a waveguide in a multilayer substrate involves producing at least one cutout corresponding to a lateral course of the waveguide in a surface of a first layer arrangement comprising one or a plurality of layers. A metallization is produced on surfaces of the cutout. A second layer arrangement comprising one or a plurality of layers is applied on the first layer arrangement. The second layer arrangement comprises, on a surface thereof, a metallization which, after the second layer arrangement has been applied on the first layer arrangement, is arranged above the cutout and together with the metallization on the surfaces of the cutout forms the waveguide.

Abstract: A radar semiconductor chip includes a radar circuit component configured to generate at least part of a frequency-modulated ramp signal or process at least part of a reflected frequency-modulated ramp signal according to a control parameter; a memory configured to store a sequencing program associated with regulating the control parameter, wherein the sequencing program specifies a first data source, external to the sequencing program, that is configured to provide a first data value corresponding to the control parameter; and a decoder configured to read the sequencing program, access the first data value from the first data source specified by the sequencing program, derive a first control value for the control parameter from the first data value, and provide the first control value to the radar circuit component. The radar circuit component regulates a controlled circuit function in accordance with the control parameter based on the first control value.

Abstract: A method is proposed for determining at least one calibration parameter for a radar system having a first radar transceiver and a second radar transceiver. The method includes performing a first calibration measurement and a second calibration measurement. The first calibration measurement and the second calibration measurement both include generating a first frequency-modulated oscillation signal and a second frequency-modulated oscillation signal, and combining the first oscillation signal received via the second terminal with the second oscillation signal, in order to generate a first difference signal for the first calibration measurement and a second difference signal for the second calibration measurement, both having a frequency difference between the first oscillation signal and the second oscillation signal.

Abstract: A semiconductor device comprises a substrate having a first surface and a second surface opposite the first surface, at least one connection element arranged on the first surface of the substrate to electrically and mechanically connect the substrate to a printed circuit board, and a radar semiconductor chip arranged on the first surface of the substrate.

Abstract: A method for producing a waveguide in a multilayer substrate involves producing at least one cutout corresponding to a lateral course of the waveguide in a surface of a first layer arrangement comprising one or a plurality of layers. A metallization is produced on surfaces of the cutout. A second layer arrangement comprising one or a plurality of layers is applied on the first layer arrangement. The second layer arrangement comprises, on a surface thereof, a metallization which, after the second layer arrangement has been applied on the first layer arrangement, is arranged above the cutout and together with the metallization on the surfaces of the cutout forms the waveguide.

Abstract: A radio-frequency device comprises a semiconductor package, which comprises a radio-frequency chip and a radio-frequency antenna. The semiconductor package is designed to be mechanically and electrically connected to a circuit board via at least one connecting element of the semiconductor package, with one surface of the semiconductor package facing the circuit board. The radio-frequency device also comprises a waveguide structure oriented in a direction parallel to the surface of the semiconductor package, the radio-frequency antenna being designed for at least one of the following: to emit radiation into the waveguide structure in the direction parallel to the surface of the semiconductor package, or to receive signals via the waveguide structure in the direction parallel to the surface of the semiconductor package.

Abstract: The present disclosure relates to a transmission apparatus, including at least one first RF signal connection for an RF signal having a first phase, a ring coupler having a plurality of antenna connections for coupling a plurality of antennas in the first RF signal connection, wherein the ring coupler is configured to cause, at each of different antenna connections of the ring coupler, a constructive superposition of components of the RF signal that propagate from the first RF signal connection to the respective antenna connections in different directions in the ring coupler, wherein RF signals having different phases are obtained at the different antenna connections.

Abstract: A radio-frequency device comprises a semiconductor package, which comprises a radio-frequency chip and a radio-frequency antenna. The semiconductor package is designed to be mechanically and electrically connected to a circuit board via at least one connecting element of the semiconductor package, with one surface of the semiconductor package facing the circuit board. The radio-frequency device also comprises a waveguide structure oriented in a direction parallel to the surface of the semiconductor package, the radio-frequency antenna being designed for at least one of the following: to emit radiation into the waveguide structure in the direction parallel to the surface of the semiconductor package, or to receive signals via the waveguide structure in the direction parallel to the surface of the semiconductor package.

Abstract: A method is proposed for determining at least one calibration parameter for a radar system having a first radar transceiver and a second radar transceiver. The method includes performing a first calibration measurement and a second calibration measurement. The first calibration measurement and the second calibration measurement both include generating a first frequency-modulated oscillation signal and a second frequency-modulated oscillation signal, and combining the first oscillation signal received via the second terminal with the second oscillation signal, in order to generate a first difference signal for the first calibration measurement and a second difference signal for the second calibration measurement, both having a frequency difference between the first oscillation signal and the second oscillation signal.

Abstract: A semiconductor device comprises a substrate having a first surface and a second surface opposite the first surface, at least one connection element arranged on the first surface of the substrate to electrically and mechanically connect the substrate to a printed circuit board, and a radar semiconductor chip arranged on the first surface of the substrate.

Abstract: A method for producing a waveguide in a multilayer substrate involves producing at least one cutout corresponding to a lateral course of the waveguide in a surface of a first layer arrangement comprising one or a plurality of layers. A metallization is produced on surfaces of the cutout. A second layer arrangement comprising one or a plurality of layers is applied on the first layer arrangement. The second layer arrangement comprises, on a surface thereof, a metallization which, after the second layer arrangement has been applied on the first layer arrangement, is arranged above the cutout and together with the metallization on the surfaces of the cutout forms the waveguide.

Abstract: The present disclosure relates to a transmission apparatus, including at least one first RF signal connection for an RF signal having a first phase, a ring coupler having a plurality of antenna connections for coupling a plurality of antennas in the first RF signal connection, wherein the ring coupler is configured to cause, at each of different antenna connections of the ring coupler, a constructive superposition of components of the RF signal that propagate from the first RF signal connection to the respective antenna connections in different directions in the ring coupler, wherein RF signals having different phases are obtained at the different antenna connections.

Abstract: The present disclosure describes a lighting system for vehicle interiors, comprising a light source that emits visible light and a component arranged relative to the light source in such a manner that light emitted from the light source passes through it. The lighting system further comprises a transparent substrate with a surface area through which light emitted from the light source passes, and a lenticular screen structure having a plurality of regularly arranged lens elements and being formed on the surface area of the transparent substrate. The present disclosure also describes using the lighting system and its component to illuminate the interior of vehicles, wherein generated three-dimensional lighting effects can be perceived differently by a viewer/occupant in the interior space, depending on the angle of viewing.

Abstract: An equipment part may comprise a carrier, a composite film, and a light source. The composite film may be disposed on the carrier and may form a visible side of the equipment part. The composite film may comprise a light-conducting layer into which the light rays emitted by the light source are coupled. A scatter layer may be disposed on a side of the light-conducting layer facing the carrier, with the light rays coupled into the light-conducting layer emitting through said scatter layer. The composite film may comprise a first and a second paint layer, where the first paint layer may be disposed on a side of the scatter layer facing the carrier, and the second paint layer may be disposed on a side of the light-conducting layer facing away from the carrier. The equipment part may be produced via a method for production of such an equipment part.

Abstract: The present disclosure describes a lighting system for vehicle interiors, comprising a light source that emits visible light and a component arranged relative to the light source in such a manner that light emitted from the light source passes through it. The lighting system further comprises a transparent substrate with a surface area through which light emitted from the light source passes, and a lenticular screen structure having a plurality of regularly arranged lens elements and being formed on the surface area of the transparent substrate. The invention present disclosure also describes using the lighting system and its component to illuminate the interior of vehicles, wherein generated three-dimensional lighting effects can be perceived differently by a viewer/occupant in the interior space, depending on the angle of viewing.

Abstract: The present invention relates to an equipment part, in particular for a motor vehicle, comprising a carrier (1), a composite film (2), and a light source (3). The composite film (2) is disposed on the carrier (1) and forms the visible side (4) of the equipment part. The composite film (2) comprises a light-conducting layer (5), a scatter layer (6), and two paint layers (7, 8), so that light rays (9) generated by the light source (3) can be coupled into the composite film, and the visible side (4) of the equipment part is extensively illuminated with the aid of the composite film (2). The present invention further comprises a method for the production of such an equipment part.

Abstract: The invention is based on a known rollover protection system for motor vehicles having two seat-related rotary bars permanently articulated to the vehicle body, said rotary bars each being fixable in the stored resting position by means of a holding device, and being rotatable into a locked support position by means of a sensor-controlled drive. To compactly design the system with several functional parts, the invention provides a toggle lever arrangement to convert the movement of the drive into a rotary bar movement, said arrangement being articulated to the drive and the rotary bar such that it is folded at least partially within the area framed by the rotary bar when the rotary bar is in its resting position.

Abstract: In the chemo-mechanical polishing, in particular, of semiconductor wafers, he abrasion and the geometrical quality of the wafers decreases with increasing service life of the polishing cloth. This can be prevented by treating the polishing cloth in each case after the polishing operation in a manner such that a pressure field is impressed, essentially without mechanical stress, on the polishing cloth, which pressure field causes a treatment liquid to flow through the interior of the polishing cloth and in this process the residues produced during polishing are rendered mobile and removed. A baseplate placed transversely across the polishing cloth and having a flat working surface provided with exit openings for the treatment liquid is suitable for carrying out the process. In the treatment, the treatment liquid is forced beneath the baseplate into the moving polishing cloth so that the latter is gradually traversed by the zone through which flow takes place.

Abstract: Semiconductor wafers, in particular, silicon wafers, with differently poled front and rear sides and high geometrical quality can be fabricated by double-sided polishing if the wafer surfaces are differently polarized during the polishing process. This can be achieved in a simple fashion, in that during polishing, an electric field is set up between the upper and lower polishing plates. This can be accomplished by providing the upper polishing plate between the plate surface and the polishing cloth with a thin conductive layer insulated with respect thereto, on which a voltage can be impressed, while both polishing plates are grounded to the frame.