Abstract: A drilling tool comprising a tool holder that extends along a central axis and comprises a first cutting insert receptacle having a first abutment surface oriented parallel to the central axis.

Abstract: A chamfer tool which comprises a tool holder. The tool holder extends along a central axis and comprises a plurality of slot-shaped cutting insert receptacles, each having two opposing lateral abutment surfaces and a base abutment surface arranged between the two lateral abutment surfaces and extending transversely thereto. The chamfer tool further comprises a plurality of cutting inserts, which are fixed in the plurality of cutting insert receptacles in a firmly bonded manner, wherein each of the cutting inserts comprises two opposing lateral surfaces, which abut against or are connected in a firmly bonded manner to the two lateral abutment surfaces of the respective cutting insert receptacle, and a lower surface arranged between the two lateral surfaces and extending transversely thereto, wherein the lower surface abuts against or is connected in a firmly bonded manner to the base abutment surface of the respective cutting insert receptacle.

Abstract: A thread milling tool for producing a thread. The thread milling tool comprises a tool holder, which extends along a central axis and comprises a first slot-shaped cutting insert receptacle having two opposing lateral abutment surfaces and a base abutment surface arranged between the two lateral abutment surfaces and extending transversely thereto, the abutment surface forming a base of the first slot-shaped cutting insert receptacle.

Abstract: A chamfer tool which comprises a tool holder. The tool holder extends along a central axis and comprises a plurality of slot-shaped cutting insert receptacles, each having two opposing lateral abutment surfaces and a base abutment surface arranged between the two lateral abutment surfaces and extending transversely thereto. The chamfer tool further comprises a plurality of cutting inserts, which are fixed in the plurality of cutting insert receptacles in a firmly bonded manner, wherein each of the cutting inserts comprises two opposing lateral surfaces, which abut against or are connected in a firmly bonded manner to the two lateral abutment surfaces of the respective cutting insert receptacle, and a lower surface arranged between the two lateral surfaces and extending transversely thereto, wherein the lower surface abuts against or is connected in a firmly bonded manner to the base abutment surface of the respective cutting insert receptacle.

Abstract: A drilling tool comprising a tool holder that extends along a central axis and comprises a first cutting insert receptacle having a first abutment surface oriented parallel to the central axis.

Abstract: The invention relates to an arrangement of electronic semiconductor components on a carrier system for treating the semiconductor components with a liquid medium. A semiconductor component is detachably mounted on the carrier system with the active side thereof in such a way that the arrangement comprises a gap at least in the edge region and partially between the semiconductor components and the carrier system. The aim of the invention is to provide a detachable arrangement of electronic semiconductor components on a mechanically stable carrier system for safely handling the semiconductor components during the production process, wherein the capillarity of the gap between the semiconductor components and the carrier system is reduced in a controlled manner, thus preventing the damaging effect of a liquid medium seeping into the gap. To this end, the surface of the carrier system is shaped in such a way that the gap is widened along the entire edge region thereof.

Abstract: A workpiece machining method includes attaching a workpiece to a workpiece support with the aid of joining means. The workpiece and the workpiece support are joined to one another by an annular joining means. The composite produced is machined. The machined workpiece is separated from the workpiece support.

Abstract: A workpiece machining method includes attaching a workpiece to a workpiece support with the aid of joining means. The workpiece and the workpiece support are joined to one another by an annular joining means. The composite produced is machined. The machined workpiece is separated from the workpiece support.

Abstract: A semiconductor device having a topology adjustment and a method for adjusting the topology of a semiconductor device. The semiconductor device includes a semiconductor wafer having first and second opposing sides with an active area formed on a first portion of the first side having a topology extending a first distance above the first side. A support member is attached to a second portion of the first side and extending a second distance above the first side, wherein the first distance is about the same as the second distance. In some exemplary embodiments, the support member is formed by applying adhesive to the second portion. The wafer is then spun to adjust the second distance.

Abstract: A workpiece machining method includes attaching a workpiece to a workpiece support with the aid of joining means. The workpiece and the workpiece support are joined to one another by an annular joining means. The composite produced is machined. The machined workpiece is separated from the workpiece support.

Abstract: A semiconductor module. One embodiment provides at least two semiconductor chips placed on a carrier. The at least two semiconductor chips are then covered with a molding material to form a molded body. The molded body is thinned until the at least two semiconductor chips are exposed. Then, the carrier is removed from the at least two semiconductor chips. The at least two semiconductor chips are singulated.

Abstract: A semiconductor module. One embodiment provides at least two semiconductor chips placed on a carrier. The at least two semiconductor chips are then covered with a molding material to form a molded body. The molded body is thinned until the at least two semiconductor chips are exposed. Then, the carrier is removed from the at least two semiconductor chips. The at least two semiconductor chips are singulated.

Abstract: The invention relates to an arrangement of electronic semiconductor components on a carrier system for treating the semiconductor components with a liquid medium. A semiconductor component is detachably mounted on the carrier system with the active side thereof in such a way that the arrangement comprises a gap at least in the edge region and partially between the semiconductor components and the carrier system. The aim of the invention is to provide a detachable arrangement of electronic semiconductor components on a mechanically stable carrier system for safely handling the semiconductor components during the production process, wherein the capillarity of the gap between the semiconductor components and the carrier system is reduced in a controlled manner, thus preventing the damaging effect of a liquid medium seeping into the gap. To this end, the surface of the carrier system is shaped in such a way that the gap is widened along the entire edge region thereof.

Abstract: The invention relates to an arrangement of electronic semiconductor components on a carrier system for treating the semiconductor components with a liquid medium. A semiconductor component is detachably mounted on the carrier system with the active side thereof in such a way that the arrangement comprises a gap at least in the edge region and partially between the semiconductor components and the carrier system. The aim of the invention is to provide a detachable arrangement of electronic semiconductor components on a mechanically stable carrier system for safely handling the semiconductor components during the production process, wherein the capillarity of the gap between the semiconductor components and the carrier system is reduced in a controlled manner, thus preventing the damaging effect of a liquid medium seeping into the gap. To this end, the surface of the carrier system is shaped in such a way that the gap is widened along the entire edge region thereof.

Abstract: A semiconductor device having a topology adjustment and a method for adjusting the topology of a semiconductor device. The semiconductor device includes a semiconductor wafer having first and second opposing sides with an active area formed on a first portion of the first side having a topology extending a first distance above the first side. A support member is attached to a second portion of the first side and extending a second distance above the first side, wherein the first distance is about the same as the second distance. In some exemplary embodiments, the support member is formed by applying adhesive to the second portion. The wafer is then spun to adjust the second distance.

Abstract: A device and a method for the processing of wafers is disclosed. One embodiment provides a method and a device in which a system wafer is bonded to a carrier work piece by using a bonding substance so as to increase the stability of the system wafer. After processing of the system wafer, the bonding effect of the bonding substance is cancelled. The system wafer can easily be detached from the carrier work piece without cutting out the carrier work piece, so that the dust exposure and the mechanical stress of the system wafer which occurs during the cutting out of the carrier work piece is avoided.

Abstract: A workpiece machining method includes attaching a workpiece to a workpiece support with the aid of joining means. The workpiece and the workpiece support are joined to one another by an annular joining means. The composite produced is machined. The machined workpiece is separated from the workpiece support.

Abstract: The invention relates to an arrangement of electronic semiconductor components on a carrier system for treating the semiconductor components with a liquid medium. A semiconductor component is detachably mounted on the carrier system with the active side thereof in such a way that the arrangement comprises a gap at least in the edge region and partially between the semiconductor components and the carrier system. The aim of the invention is to provide a detachable arrangement of electronic semiconductor components on a mechanically stable carrier system for safely handling the semiconductor components during the production process, wherein the capillarity of the gap between the semiconductor components and the carrier system is reduced in a controlled manner, thus preventing the damaging effect of a liquid medium seeping into the gap. To this end, the surface of the carrier system is shaped in such a way that the gap is widened along the entire edge region thereof.

Abstract: A stabilization device and method for stabilizing a workpiece such as a thin film wafer is presented. The thin wafer is fixed and oriented in planar fashion. The stabilization device is realized by a profiled ring which is arranged on the periphery of the wafer and is intimately connected thereto. The stabilization device and wafer are connected via negative pressure or by means of an adhesive having high thermal stability. The wafer and device are formed from similar semiconductor materials and have the same outline contour. The stabilization device remains on the wafer during process steps in the course of production and processing of the wafer.

Abstract: A gas pipe system for a process reactor is described, which may be, for example, a vertical oven for depositing an As-doped SiO2 layer onto wafers. The gas pipe system has a TEAS bubbler which is connected on the input side to a carrier gas source and, on the output side, is connected via at least one heated pipe to the process reactor. Furthermore, a TEOS evaporator is provided, which is connected on the input side to a gas source and, on the output side, is connected via at least one heated pipe to the process reactor. Furthermore, a vertical oven and a method for deposition of an As-doped SiO2 layer onto wafers are described, with the gas pipe system being used in each case.