Abstract: The invention relates to a short pulse laser (1) having a seed laser oscillator (2), a controllable pulse picker (4) for coupling out a laser pulse or a sequence of laser pulses, and an amplifier unit (5, 6) being mounted downstream of the pulse picker (5) and having at least one first amplifier stage (5) and a controllable first pump laser (8). The short pulse laser further includes a control unit (10) which is designed to control the pulse picker (4) and/or the first pump laser (8) such that the post-amplified laser pulses reach a predetermined power.

Abstract: The invention relates to a short pulse laser (1) having a first optical plate (3) on which a seed laser oscillator (4), a pulse picker (5), and a fiber coupling-in optical unit (6) are mounted so as to be mechanically stable in relation to one another, and second optical plate (7), which is separate from the first optical plate (3) and on which a fiber coupling-out optical unit (9) and at least one amplifier stage (8, 30, 31) are mounted so as to be mechanically stable in relation to one another. The fiber coupling-in optical unit (6) of the first optical plate (3) and the fiber coupling-out optical unit (9) of the second optical plate (7) are optically interconnected by a flexible light guiding element (10). The hybrid short pulse laser (1) has a compact design and can be operated at low cost.

Abstract: The invention relates to a short pulse laser (1) having a seed laser oscillator (2), a controllable pulse picker (4) for coupling out a laser pulse or a sequence of laser pulses, and an amplifier unit (5, 6) being mounted downstream of the pulse picker (5) and having at least one first amplifier stage (5) and a controllable first pump laser (8). The short pulse laser further includes a control unit (10) which is designed to control the pulse picker (4) and/or the first pump laser (8) such that the post-amplified laser pulses reach a predetermined power.

Abstract: The invention relates to a short pulse laser (1) having a first optical plate (3) on which a seed laser oscillator (4), a pulse picker (5), and a fiber coupling-in optical unit (6) are mounted so as to be mechanically stable in relation to one another, and second optical plate (7), which is separate from the first optical plate (3) and on which a fiber coupling-out optical unit (9) and at least one amplifier stage (8, 30, 31) are mounted so as to be mechanically stable in relation to one another. The fiber coupling-in optical unit (6) of the first optical plate (3) and the fiber coupling-out optical unit (9) of the second optical plate (7) are optically interconnected by a flexible light guiding element (10). The hybrid short pulse laser (1) has a compact design and can be operated at low cost.

Abstract: An electronic component with a plastic package and to a method for its production, includes a semiconductor chip. An underside of the plastic package has external contacts. The external contacts are connected to contact areas on an active upper side of the semiconductor chip by contact pillars of the semiconductor chip and wiring lines arranged on the plastic package molding compound. In this case, the contact pillars represent an electrically conducting elevation of the contact areas.

Abstract: The invention relates to an electronic component having at least one semiconductor chip and a flat chip carrier assigned to the semiconductor chip. Electrical connections between contact areas on an active chip surface of the semiconductor chip and contact terminal areas on an upper side of the chip carrier are formed by strips of material that can undergo microstructuring and that are provided with an electrically conductive coating. The invention also relates to a method for producing the electronic component.

Abstract: An electronic component with a plastic package and to a method for its production, includes a semiconductor chip. An underside of the plastic package has external contacts. The external contacts are connected to contact areas on an active upper side of the semiconductor chip by contact pillars of the semiconductor chip and wiring lines arranged on the plastic package molding compound. In this case, the contact pillars represent an electrically conducting elevation of the contact areas.

Abstract: An electronic component is formed with at least two semiconductor chips that are disposed on a carrier substrate. Active chip surfaces of the semiconductor chips include central contact surfaces on which opposing solder contact surfaces are formed. These are conductively connected to an intermediate carrier which is disposed between the semiconductor chips and which produces rewirings from them to the carrier substrate. A method for fabricating the component is also described.

Abstract: An electronic component has at least a first semiconductor chip module, a second semiconductor chip module, and a substrate to accommodate the semiconductor chip modules. In this case, active chip surfaces of the two semiconductor chip modules each have a central contact area, which are disposed to face each other. The individual solder contact areas formed on the central contact areas and corresponding with one another are opposite and aligned with one another and are electrically conductively connected.

Abstract: The invention relates to an electronic component (2) with at least one semiconductor chip (4) and a flat chip carrier (6) assigned to the at least one semiconductor chip, electrical connections between contact areas (43) on an active chip surface (41) of the semiconductor chip and contact terminal areas (63) on an upper side (61) of the chip carrier being formed by means of strips (81) of material which can undergo microstructuring and are provided with an electrically conductive coating. The invention also relates to a method for producing the electronic component (2).

Abstract: An electronic component is formed with at least two semiconductor chips that are disposed on a carrier substrate. Active chip surfaces of the semiconductor chips include central contact surfaces on which opposing solder contact surfaces are formed. These are conductively connected to an intermediate carrier which is disposed between the semiconductor chips and which produces rewirings from them to the carrier substrate. A method for fabricating the component is also described.

Abstract: An electronic component is formed with at least two semiconductor chips disposed on a carrier substrate. Active chip surfaces of the semiconductor chips comprise central contact surfaces, respectively, on which opposing solder contact surfaces are formed. These are conductively connected to an intermediate carrier which is disposed between the semiconductor chips and which produces rewirings from the chips to the carrier substrate.

Abstract: An electronic component has a carrier substrate to accommodate two semiconductor chips that are connected to each other. The second semiconductor chip rests with two opposite marginal supporting regions on an upper side of the carrier substrate. The first semiconductor chip is disposed at a distance from a frame of the carrier substrate, in a central recess in the latter. A process for the production of the electronic component is further described.

Abstract: An electronic component has at least a first semiconductor chip module, a second semiconductor chip module, and a substrate to accommodate the semiconductor chip modules. In this case, active chip surfaces of the two semiconductor chip modules each have a central contact area, which are disposed to face each other. The individual solder contact areas formed on the central contact areas and corresponding with one another are opposite and aligned with one another and are electrically conductively connected.

Abstract: The adhesion of plastic to metal surfaces is improved by adding a specific filler in the sheathing material. The filler is formed of spherical SiO2 particles with a graduated diameter distribution defining individual diameter stages wherein the standard deviation in mean particle diameter of at least one diameter stage of said SiO2 particles is less than 10%. Spherical SiO2 particles with a graduated diameter distribution defining individual diameter stages are also mixed together in such ratio to obtain packing densities of 90% or more. Said spherical SiO2 particles with a graduated diameter distribution defining individual diameter stages may also be characterized as having an index of refraction which increases from the center of a particle to the surface.