Abstract: This invention relates to a process and an apparatus for cutting and trimming printed circuit board workpieces, particularly printed multilayer circuit board workpieces, which are cut to an exactly predetermined, selectable size at high speed in an operation in which the workpieces are subjected only to relatively low stresses. The workpieces are cut and trimmed and are profiled at each of their edges in a single operation. This is accomplished by means of two circular sawblades, which extend in a common plane and have interdigitating sawteeth, which preferably have diamond cutting edges. The interdigitating sawteeth of the two sawblades cut into the workpiece from opposite broadsides and the sawteeth of each of the sawblades penetrate into the workpiece only in part of its thickness.

Abstract: The apparatus comprises a board-clamping device for clamping a printed circuit board at an edge thereof in a predetermined position, at least one pair of gripping jaws, which can be moved toward and away from the plane of travel for the printed circuit boards by a movement having a component in the peeling direction, which is oblique to the direction of conveyance. The two gripping jaws of said pair are adapted to be closed in that only one jaw of said pair is moved in the peeling direction. Each of the jaws of the pair has an edge which is parallel to the plane of travel and transverse to the peeling direction. Said edge is engageable with the printed circuit board. Said edges of the gripping jaws of said pair define between them a nip. The apparatus also comprises a conveyor, which defines a plane of travel for each printed circuit board and serves to move each printed circuit board to a position in which the printed circuit board is engageable by the gripping jaws of said pair thereof.