Abstract: An opto-isolator is provided that is designed for optically interconnecting devices that are mounted on multiple PCBs. The opto-isolator is particularly well suited for arrangements where the PCB-to-PCB distance is very small. In such cases, using an optical fiber as the optical waveguide can result in the optical fiber being bent beyond its minimum bend radius, resulting in damage to the optical fiber and/or performance problems due to attenuation of the optical signal. The opto-isolator includes first and second generally rigid structures that engage one another with an alignment tolerance that ensures proper board-to-board alignment while also facilitating the ease with which the alignment process can be performed. Once the first and second generally rigid structures are in engagement with one another, they form a generally rigid optical waveguide structure for coupling light from an optical transmitter of one of the PCBs onto an optical receiver of the other PCB.

Abstract: Embedded Wafer-Level Packaging (eWLP) devices, packages and assemblies and methods of making them are provided. The eWLP methods allow back side electrical and/or thermal connections to be easily and economically made at the eWLP wafer level without having to use thru-mold vias (TMVs) or thru-silicon vias (TSVs) to make such connections. In order to create TMVs, processes such as reactive ion etching or laser drilling followed metallization are needed, which present difficulties and increase costs. In addition, the eWLP methods allow electrical and optical interfaces to be easily and economically formed on the front side and/or on the back side of the eWLP wafer, which allows the eWLP methods to be used to form optoelectronic devices having a variety of useful configurations.

Abstract: Embedded Wafer-Level Packaging (eWLP) devices, packages and assemblies and methods of making them are provided. The eWLP methods allow back side electrical and/or thermal connections to be easily and economically made at the eWLP wafer level without having to use thru-mold vias (TMVs) or thru-silicon vias (TSVs) to make such connections. In order to create TMVs, processes such as reactive ion etching or laser drilling followed metallization are needed, which present difficulties and increase costs. In addition, the eWLP methods allow electrical and optical interfaces to be easily and economically formed on the front side and/or on the back side of the eWLP wafer, which allows the eWLP methods to be used to form optoelectronic devices having a variety of useful configurations.

Abstract: Methods are provided for making embedded Wafer-Level Packaging (eWLP) devices, packages and assemblies. The eWLP methods allow back side electrical and/or thermal connections to be easily and economically made at the eWLP wafer level without having to use thru-mold vias (TMVs) or thru-silicon vias (TSVs) to make such connections. In order to create TMVs, processes such as reactive ion etching or laser drilling followed metallization are needed, which present difficulties and increase costs. In addition, the eWLP methods allow electrical and optical interfaces to be easily and economically formed on the front side and/or on the back side of the eWLP wafer, which allows the eWLP methods to be used to form optoelectronic devices having a variety of useful configurations.

Abstract: Methods are provided for making embedded Wafer-Level Packaging (eWLP) devices, packages and assemblies. The eWLP methods allow back side electrical and/or thermal connections to be easily and economically made at the eWLP wafer level without having to use thru-mold vias (TMVs) or thru-silicon vias (TSVs) to make such connections. In order to create TMVs, processes such as reactive ion etching or laser drilling followed metallization are needed, which present difficulties and increase costs. In addition, the eWLP methods allow electrical and optical interfaces to be easily and economically formed on the front side and/or on the back side of the eWLP wafer, which allows the eWLP methods to be used to form optoelectronic devices having a variety of useful configurations.

Abstract: An optical connector is provided having a housing with a cavity formed therein through which an optical fiber passes. Within the cavity, a slightly bent, unjacketed portion of the core of the optical fiber is disposed. If conditions are such that pistoning of the core begins to occur, the slightly bent, unjacketed portion of the core straightens, thereby causing the end of the core to remain substantially flush with the end of the ferrule of the connector housing. In this way, the pistoning effect at the end of the fiber is prevented and optical losses associated with the occurrence of the pistoning effect are avoided.

Abstract: An optical connector is provided having a housing with a cavity formed therein through which an optical fiber passes. Within the cavity, a slightly bent, unjacketed portion of the core of the optical fiber is disposed. If conditions are such that pistoning of the core begins to occur, the slightly bent, unjacketed portion of the core straightens, thereby causing the end of the core to remain substantially flush with the end of the ferrule of the connector housing. In this way, the pistoning effect at the end of the fiber is prevented and optical losses associated with the occurrence of the pistoning effect are avoided.

Abstract: The invention relates to a method and a device for operating an optical transmitting device having a plurality of optical transmitters that can be driven independently. The method includes detecting the parameter values of the individual transmitters, comparing the parameter values determined with one another and/or with a prescribed comparison value, and selecting one of the transmitters for the communication operation of the transmitting device based on the comparison. The method further includes operating the transmitting device with the selected transmitter.

Abstract: The invention relates to an electro-optical data transmission arrangement with an optical multicore fiber, on the respective end faces of which an electro-optical transducer is arranged, wherein at least one of the electro-optical transducers consists of several segments. The electro-optical data transmission arrangement allows high data transmission rates and broad tolerances in the manufacture.

Abstract: Various embodiments of arrangements for optically coupling an optical waveguide to an optical unit of an optical module are provided. One embodiment is an optical module for optically coupling an optical waveguide to an optical unit. One such optical module comprises: a reference structure having a reference geometry that defines a first axis of symmetry; an optical unit having an optical axis along which light is transmitted or received, the optical unit positioned relative to the reference structure with an offset between the first axis of symmetry and the optical axis; and a coupling element that couples the optical unit to an optical waveguide, the coupling element having an eccentric hole which functions as a fiber guide and a structural geometry adapted to compensate for the offset between the first axis of symmetry and the optical axis.

Abstract: The invention relates to an electro-optical data transmission arrangement with an optical multicore fiber, on the respective end faces of which an electro-optical transducer is arranged, wherein at least one of the electro-optical transducers consists of several segments. The electro-optical data transmission arrangement allows high data transmission rates and broad tolerances in the manufacture.

Abstract: A method for producing an optical or electronic module provided with a plastic package including: providing at least one optical or electronic component, the component having an operative region, via which it is in operative connection with the surroundings in the finished module, encapsulating the component with at least one polymer compound to form the plastic package, before or after the encapsulation, ascertaining the position of the component by direct measurement of the position of the component, aligning the component with respect to a device for partially removing the polymer compound or alignment of such a device with respect to the component, the alignment taking place with allowance for the ascertained position of the component, and partial removal of the polymer compound from the outside such that the polymer compound between the operative region and the outer side of the plastic package is at least partially removed.

Abstract: An optoelectronic transmission and/or reception arrangement with an optical unit having a transmission component and/or a reception component, an electrical circuitry component for the transmission component and/or the reception component, a circuit carrier, on which the components are mounted and contact-connected, and a coupling part for receiving and coupling at least one optical fiber which can be optically coupled to the transmission component and/or the reception component. The electrical contact-connection of the circuit carrier is effected via the coupling part.

Abstract: Optoelectronic transmission and/or reception arrangements having a surface-mounted optoelectronic component and a circuit board provided with electrical lines, the optoelectronic component being surface-mounted on said circuit board, the optical axis of the optoelectronic component running perpendicular to the plane of the circuit board. In one embodiment, provision is made of a holding apparatus for receiving and orienting an optical waveguide to be coupled to the optoelectronic component, which holding apparatus directly adjoins the side of the optoelectronic component that is remote from the circuit board. In another embodiment, the circuit board has a cutout and light is coupled into or out of the optoelectronic component in the direction of the cutout of the circuit board.

Abstract: In a modular system of optoelectronic components each component has a standardized housing. The standard housing has a device for the mechanical connection to at least one housing of a further component, or it is connected to such a device. This allows different combinations to be produced using the same system components. Flat optoelectronic components are particularly suitable for use in the modular system. In this case, according to the invention, an optical waveguide is integrated in the component, runs parallel to a circuit mount, and forms an optical interface on one narrow housing face. The electrical contacts of the component are likewise arranged on a narrow housing face.

Abstract: The invention relates to a method and a device for operating an optical transmitting device having a plurality of optical transmitters that can be driven independently. The method includes detecting the parameter values of the individual transmitters, comparing the parameter values determined with one another and/or with a prescribed comparison value, and selecting one of the transmitters for the communication operation of the transmitting device based on the comparison. The method further includes operating the transmitting device with the selected transmitter.

Abstract: An optoelectronic transmitting and/or receiving module and an optical plug include a circuit carrier disposed at least partially in an alignment parallel to the optical axis of the module in a module housing. The circuit carrier forms a tongue-shaped region that protrudes into the continuation. A transmitting device and/or a receiving device is disposed in the continuation, where they are connected to the circuit carrier. The associated axial offsetting of the transmitting device and/or receiving device in the direction of an optical plug to be coupled on permits the provision of plug-in connections with improved protection of the devices and the fiber ends.

Abstract: The invention relates to an arrangement for optically coupling an optical waveguide to an optical unit of an optical module. The optical module has a reference geometry, which defines a first axis of symmetry. There is an offset between the optical axis of the optical unit and the axis of symmetry of the reference geometry. The invention provides a coupling element which eliminates the offset. The coupling element has, for this purpose, a hole, which is delimited by an inner surface, the inner surface of the coupling element defining a second axis of symmetry. The first axis of symmetry and the second axis of symmetry extend parallel to one another and have an offset with respect to one another which is essentially the same as the offset between the optical axis of the optical unit and the first axis of symmetry of the reference geometry as regards direction and magnitude.

Abstract: The invention relates to a method for producing an optical or electronic module provided with a plastic package. The method includes provision of at least one optical or electronic component, the component having an operative region via which it is in operative connection with the surroundings in the finished module, and application to the component of a protective layer which covers at least the operative region of the component. The method further includes encapsulation of the at least one component with at least one polymer compound to form the package, and partial removal of the polymer compound from the outside by a laser ablation device such that the polymer compound between the protective layer of the component and the outer side of the plastic package is removed. The protective layer is, in this case, not transparent with respect to the radiation emitted by the laser ablation device.

Abstract: One or more aspects of the invention relate to an optical or electronic module with at least one optical or electronic component and a plastic package within which the component is embedded. The component has an operative region that facilitates operative connection with surroundings. The plastic package has a first region, which comprises a transparent polymer compound, and a second region, which comprises a non-transparent polymer compound. The first region extends such that it borders the operative region of the component.