Abstract: A system for magnetic detection includes a magneto-optical defect center material including at least one magneto-optical defect center that emits an optical signal when excited by an excitation light; a radio frequency (RF) exciter system configured to provide RF excitation to the magneto-optical defect center material; an optical light source configured to direct the excitation light to the magneto-optical defect center material; and an optical detector configured to receive the optical signal emitted by the magneto-optical defect center material.

Abstract: A method includes passing a magnetometer along a length of a material. The method also includes measuring, via the magnetometer, a first magnetic field magnitude along a first portion of the length of the material and measuring, via the magnetometer, a second magnetic field magnitude along a second portion of the length of material. The method further includes determining that the material includes a defect along the second portion of the length of material by determining that the first magnetic field magnitude is different than the second magnetic field magnitude.

Abstract: A system for magnetic detection includes a magneto-optical defect center material including at least one magneto-optical defect center that emits an optical signal when excited by an excitation light; a radio frequency (RF) exciter system configured to provide RF excitation to the magneto-optical defect center material; an optical light source configured to direct the excitation light to the magneto-optical defect center material; and an optical detector configured to receive the optical signal emitted by the magneto-optical defect center material.

Abstract: A method includes passing a magnetometer along a length of a material. The method also includes measuring, via the magnetometer, a first magnetic field magnitude along a first portion of the length of the material and measuring, via the magnetometer, a second magnetic field magnitude along a second portion of the length of material. The method further includes determining that the material comprises a defect along the second portion of the length of material by determining that the first magnetic field magnitude is different than the second magnetic field magnitude.

Abstract: The present invention stacks integrated circuit packages into circuit modules. In a preferred embodiment, solder paste and primary adhesive respectively are applied to selected locations on the flex circuitry. Supplemental adhesive is applied to additional locations on the flex circuitry, CSP, or other component. The flex circuitry and the CSP are brought into proximity with each other. During solder reflow operation, a force is applied and the CSP collapses toward the flex circuitry, displacing the primary adhesive and the supplemental adhesive. The supplemental adhesive establishes a bond providing additional support to the flex circuitry. In another embodiment, CSPs or other integrated circuit packages are bonded to each other or to other components with a combination of adhesives. A rapid bond adhesive maintains alignment of the bonded packages and/or components during assembly, and a structural bond adhesive provides additional strength and/or structural integrity to the bond.

Abstract: The present invention stacks integrated circuit packages into circuit modules. In a preferred embodiment, solder paste and primary adhesive respectively are applied to selected locations on the flex circuitry. Supplemental adhesive is applied to add ional locations on the flex circuitry, CSP, or other component. The flex circuitry and the CSP are brought into proximity with each other. During solder reflow operation, a force is applied and the CSP collapses toward the flex circuitry, displacing the primary adhesive and the supplemental adhesive. The supplemental adhesive establishes a bond providing additional support to the flex circuitry. In another embodiment, CSPs or other integrated circuit packages are bonded to each other or to other components with a combination of adhesives. A rapid bond adhesive maintains alignment of the bonded packages and/or components during assembly, and a structural bond adhesive provides additional strength and/or structural integrity to the bond.