Patents by Inventor Joseph Anthony Boduch

Joseph Anthony Boduch has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer probe resumption of die testing
    Patent number: 10955468
    Abstract: Wafer test control and methodologies are provided for resuming the probing of a wafer, in connection with random, distributed or statistical wafer probing. The resumption of testing may occur after an interruption of a previous probe of the wafer and removal of the wafer from a testing chuck. Parameter settings are retained in addition to probe results from the previous wafer probe session in order to construct a resume probe map according to applicable probing rules and conditions. Wafer probing may be restarted according to the resume probe map.
    Type: Grant
    Filed: January 22, 2019
    Date of Patent: March 23, 2021
    Assignee: Texas Instruments Incorporated
    Inventors: Joseph Anthony Boduch, Romano Schmidt
  • Data structures for semiconductor die packaging
    Patent number: 10658211
    Abstract: At least some embodiments are directed to a system that comprises storage comprising a data structure that cross-references an identifier of a semiconductor wafer, a location of a die in the wafer, an identifier of a lead frame strip, a location of a lead frame in the lead frame strip, and results of a first test on the die. The system also comprises mechanical equipment configured to test packaged die. The system further comprises a processor, coupled to the storage and to the mechanical equipment, configured to perform a second test on a package containing the die and the lead frame using the mechanical equipment and the results of the first test.
    Type: Grant
    Filed: August 7, 2018
    Date of Patent: May 19, 2020
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Joseph Anthony Boduch, Sandia You Ni Chiu, Robert Daniel Orr, Michael Francis Pas
  • Wafer Probe Resumption of Die Testing
    Publication number: 20190227116
    Abstract: Wafer test control and methodologies are provided for resuming the probing of a wafer, in connection with random, distributed or statistical wafer probing. The resumption of testing may occur after an interruption of a previous probe of the wafer and removal of the wafer from a testing chuck. Parameter settings are retained in addition to probe results from the previous wafer probe session in order to construct a resume probe map according to applicable probing rules and conditions. Wafer probing may be restarted according to the resume probe map.
    Type: Application
    Filed: January 22, 2019
    Publication date: July 25, 2019
    Inventors: Joseph Anthony Boduch, Romano Schmidt
  • Data Structures for Semiconductor Die Packaging
    Publication number: 20180350645
    Abstract: At least some embodiments are directed to a system that comprises storage comprising a data structure that cross-references an identifier of a semiconductor wafer, a location of a die in the wafer, an identifier of a lead frame strip, a location of a lead frame in the lead frame strip, and results of a first test on the die. The system also comprises mechanical equipment configured to test packaged die. The system further comprises a processor, coupled to the storage and to the mechanical equipment, configured to perform a second test on a package containing the die and the lead frame using the mechanical equipment and the results of the first test.
    Type: Application
    Filed: August 7, 2018
    Publication date: December 6, 2018
    Inventors: Joseph Anthony Boduch, Sandia You Ni Chiu, Robert Daniel Orr, Michael Francis Pas
  • Data structures for semiconductor die packaging
    Patent number: 10068786
    Abstract: At least some embodiments are directed to a system that comprises storage comprising a data structure that cross-references an identifier of a semiconductor wafer, a location of a die in the wafer, an identifier of a lead frame strip, a location of a lead frame in the lead frame strip, and results of a first test on the die. The system also comprises mechanical equipment configured to test packaged die. The system further comprises a processor, coupled to the storage and to the mechanical equipment, configured to perform a second test on a package containing the die and the lead frame using the mechanical equipment and the results of the first test.
    Type: Grant
    Filed: April 20, 2017
    Date of Patent: September 4, 2018
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Joseph Anthony Boduch, Sandia You Ni Chiu, Robert Daniel Orr, Michael Francis Pas