Abstract: A laser ablation damascene process for the planarizing of metal/polymer structures. More specifically, the process is especially adapted for the fabrication of both interlevel via metallization and circuitization layers in integrated circuit (IC) interconnects. Subsequent to the forming or etching of holes or depressions in a polymer insulating layer, a metal layer or film is deposited thereon for the purpose of fabricating vias or trenches for metallization and circulation layers in IC connects. Thereafter, the surface of the metal layer which has been deposited or superimposed on the polymer substrate through any suitable method known in the art is irradiated with at least one laser pulse which will cause the metal layer to melt and reflow and resultingly fill the vias and trenches etched in the polymer substrate while simultaneously ablating and removing the metal from the planarized surface of the substrate in the regions about the vias and trenches.

Abstract: An apparatus is provided for electrochemically processing an anodic material in strip form, such as the stainless steel print bands used in high speed printers. Also provided is an electrochemical process including electroetching, electropolishing, or both to obtain microfinishing of the material. Moreover, an electrolyte is provided which is a mixture of phosphoric acid, sulfuric acid, and glycerol in which the material removal rate is controlled by the addition of small amounts of sodium chloride. The electrochemical process operates at ambient temperature over a wide range of current density.

Abstract: A laser assisted miniature heater 10 includes an elongated hollow bar 12 having a high thermal conductivity and a supporting member 14 for conveying an optical fiber 16 which transmits laser radiation to an interiorly disposed hollow cavity 18. The interior surfaces 20 of the cavity 18 are reflective to the laser radiation such that the radiation undergoes repetitive internal reflections along a longitudinal axis of the bar 12. While repetitively reflecting within the cavity 18 the laser radiation is gradually absorbed into the walls of the cavity 18. The absorption of the laser radiation induces a uniform heating of the bar 12 to a temperature which exceeds the melting temperature of eutectic solder. The outer surface 22 of the bar 12, when placed in contact with a plurality of component leads which are each adjacent to a respective solder-bearing bonding pad, induces a melting of the solder and the physical and electrical coupling of the leads to their associated bonding pads.