Abstract: A frame 100 containing aperture(s) 102, 103, 104 is positioned on and joined to a permanent substrate 206a or temporary substrate 206b. Electrical component(s) 202, 203, 204 are placed into respective aperture(s) 102, 103, 104 with the leads 504, 1002 of the component(s) 202, 203, 204 positioned on and attached to the permanent substrate 206a or the temporary substrate 206b. Then an encapsulant 402, electrically insulating, but preferably thermally conductive, envelops the component(s) 102, 103, 104. At this point, temporary substrate 206b may be removed exposing component leads 1002. Or, if component(s) 102, 103, 104 are mounted on permanent substrate 206a, vias 502 extend from the surface of substrate 206a to leads 504. With leads 504, 1002 exposed, the completed subassembly 500, 1000 may be incorporated into various forms of reverse-interconnection process (RIP) assemblies as detailed in related applications.

Abstract: A frame 100 containing aperture(s) 102, 103, 104 is positioned on and joined to a permanent substrate 206a or temporary substrate 206b. Electrical component(s) 202, 203, 204 are placed into respective aperture(s) 102, 103, 104 with the leads 504, 1002 of the component(s) 202, 203, 204 positioned on and attached to the permanent substrate 206a or the temporary substrate 206b. Then an encapsulant 402, electrically insulating, but preferably thermally conductive, envelops the component(s) 102, 103, 104. At this point, temporary substrate 206b may be removed exposing component leads 1002. Or, if component(s) 102, 103, 104 are mounted on permanent substrate 206a, vias 502 extend from the surface of substrate 206a to leads 504. With leads 504, 1002 exposed, the completed subassembly 500, 1000 may be incorporated into various forms of reverse-interconnection process (RIP) assemblies as detailed in related applications.

Abstract: In an embodiment, an IC assembly comprises an IC having a top surface comprising a plurality of input/output terminations, a plurality of leads arranged around the IC, a plurality of bond wires, and an encapsulant. Each lead has a first surface and a second surface opposite the first surface, and has a feature protruding from the first surface proximate an inward end of the lead nearest the IC. The feature extends from the first surface to approximately a plane that includes a bottom surface of the IC. Each bond wire connects a respective lead to a respective I/O terminal on the IC. The encapsulant seals the bond wires, the IC, and a first portion of the leads that includes the feature. The feature creates on offset from the bottom of the IC to permit the encapsulant to surround the first portion.

Abstract: An IC package having multiple surfaces for interconnection with interconnection elements making connections from the IC chip to the I/O terminations of the package assembly which reside on more than one of its surfaces and which make interconnections to other devices or assemblies that are spatially separated.

Abstract: A method for producing an assembly of electronic components and assemblies in accord with this, wherein the electronic components have component terminals. A conductive firmament having a first side and a second side is provided. Then the component terminals are connected to the first side of the firmament with an anisotropic conductor. A pattern is applied to the second side of said firmament. And portions of the firmament are removed based on the pattern, such that remaining portions of said firmament form the electrical circuit interconnecting the component terminals.

Abstract: The present invention provides an electronic assembly 400 and a method for its manufacture 800, 900, 1000 1200, 1400, 1500, 1600, 1700. The assembly 400 uses no solder. Components 406, or component packages 402, 802, 804, 806 with I/O leads 412 are placed 800 onto a planar substrate 808. The assembly is encapsulated 900 with electrically insulating material 908 with vias 420, 1002 formed or drilled 1000 through the substrate 808 to the components' leads 412. Then the assembly is plated 1200 and the encapsulation and drilling process 1500 repeated to build up desired layers 422, 1502, 1702. Assemblies may be mated 1800. Within the mated assemblies, items may be inserted including pins 2202a, 2202b, and 2202c, mezzanine interconnection devices 2204, heat spreaders 2402, and combination heat spreaders and heat sinks 2602. Edge card connectors 2802 may be attached to the mated assemblies.

Abstract: An electronic wiping torsional connector for use in connecting to mating contacts on an insulating base. The connector includes a plurality of contacts 1-10 each having a contact 13 and an anchor 14. Contacts 1-10 twist against anchor 14 when the insulating base is inserted into the connector to provide the wiping contact. In an alternative embodiment, the conductors are wires having two bends at different angles. One bend is elongated such that it engages a paddle before the other and rotates the other bend into contact with a ribbon contact located on the paddle.

Abstract: An electrical connector comprising a pair of elongated bodies, each having a facing ramp, the ramp having an notch, each having a rotatable torsion bar conductor with a tip located in the notch, the end of a tip spaced above the ramp such that when the two bodies are mated, the tips engage the ramp of the other connector and rotate against a torsional restoring force, and when fully mated, the two ramps abut each other, notches aligned, with the respective tips of the torsion bars engaging the torsion bar of the other body in the aligned notches.

Abstract: Provided is a flexible electronic assembly that uses no solder. Components or component packages are mounted on a flexible substrate. Vias connect through the substrate to the components' leads. Circuits are formed on the opposite side of the substrate interconnecting the component through the vias. The assembly is made flexible by removing encapsulent material between components.

Abstract: An assembly for conducting an electronic signal. The assembly includes a substrate and an electronic cable. The substrate has distinct first and second regions to enable connection to first and second circuit boards, respectively. First and second through-holes are formed in the substrate in the first and second regions, respectively. The electronic cable is disposed within the first through-hole and extends out of the first through hole, adjacent the substrate and into the second through-hole.

Abstract: An electronic wiping torsional connector for use in connecting to mating contacts on an insulating base. The connector includes a plurality of contacts 1-10 each having a contact 13 and an anchor 14. Contacts 1-10 twist against anchor 14 when the insulating base is inserted into the connector to provide the wiping contact. In an alternative embodiment, the conductors are wires having two bends at different angles. One bend is elongated such that it engages a paddle before the other and rotates the other bend into contact with a ribbon contact located on the paddle.

Abstract: Disclosed are low profile discrete electronic component structures that are suitable for placement and use in a vertical interconnection mode either within an electronic interconnection substrate, between interconnection substrate and electronic component or within an IC package.

Abstract: An electrical connector. An electrical connector a pair of cylindrical housings, one having a plurality of torsion bar conductors and a second having a plurality of ramps. Rotating the pair of housings relative to one another causes an angled tip on the torsion bar to rotate as it moves up the ramp. A land is provided to discontinue further rotation of the torsion bar tip as the housings continue to rotate.

Abstract: An apparatus is disclosed that improves density of electrical components in a circuit assembly. Electrical components 202, 204 are stacked so that they overlap each other and are encapsulated in an electronic insulating material 104. The resulting subassembly may be integrated onto a printed circuit board or into a reverse-interconnection process assembly.

Abstract: An electronic wiping torsional connector for use in connecting to mating contacts on an insulating base. The connector includes a plurality of contacts 1-10 each having a contact 13 and an anchor 14. Contacts 1-10 twist against anchor 14 when the insulating base is inserted into the connector to provide the wiping contact. In an alternative embodiment, the conductors are wires having two bends at different angles. One bend is elongated such that it engages a paddle before the other and rotates the other bend into contact with a ribbon contact located on the paddle.

Abstract: The present invention provides an electronic assembly. The assembly uses no solder. Components or component packages with I/O leads are mounted on a flexible substrate and encapsulated with an electrically insulating material. Vias connect through the substrate to the components' leads.

Abstract: An electronic wiping torsional connector for use in connecting to mating contacts on an insulating base. The connector includes a plurality of contacts 1-10, each having a contact area 93 adapted for wiping contact to a pad, an anchor area 92, and flattened, ribbon-like connector for receiving a wiping contact. Contacts 1-10 twist against an anchor 92 when the insulating base is inserted into the connector to provide the wiping contact.

Abstract: An electrical connector. An electrical connector a pair of cylindrical housings, one having a plurality of torsion bar conductors and a second having a plurality of ramps. Rotating the pair of housings relative to one another causes an angled tip on the torsion bar to rotate as it moves up the ramp. A land is provided to discontinue further rotation of the torsion bar tip as the housings continue to rotate.

Abstract: An ESD device with a protection structure utilizing radiated heat dissipation to prevent or reduce thermal failures. The device includes a voltage switchable polymer 10 between electrodes 11 and 12, which is configured to provide a heat radiating surface 40 for radiating heat when an ESD condition occurs. A radiation transmission material 19 is disposed between the heat radiating surface and the environment for radiating heat 20 when an ESD event occurs. One embodiment adds a spacer 50 for accurately spacing electrodes. A method for fabricating the device is further illustrated.

Abstract: The present invention provides an electronic assembly 400 and a method for its manufacture 800, 900, 1000 1200, 1400, 1500, and 1700. The assembly 400 uses no solder. Components 406 or component packages 402, 802, 804, 806 with I/O leads 412 are placed 800 onto a planar substrate 808. The assembly is encapsulated 900 with electrically insulating material 908 with vias 420, 1002 formed or drilled 1000 through the substrate 808 to the components' leads 412. Then the assembly is plated 1200 and the encapsulation and drilling process 1500 repeated to build up desired layers 422, 1502, 1702. The planar substrate 808 may be a flexible substrate 2016 allowing bending of an assembly 2000 to fit into various enclosures.