Abstract: A rigid flex circuit comprised of high thermal conductivity sections, said sections having components disposed so as to have their contacts substantially planar with the surface of the thermally conductive section and wherein the contacts are interconnected directly to the traces without the use of solder and further having the thermally conductive sections interconnected to one another by means of flexible circuit sections.

Abstract: A component support fixture having a plurality of oversized compartments of the same size mounted on a top surface of an anisotropic adhesive film such that each of a plurality of burned-in components of different heights and widths are accommodated within a compartment. Patterned traces are formed on the bottom surface of the anisotropic film. The leads of the burned-in components are in electrically communication with those traces through the anisotropic film.

Abstract: An Occam process (solderless manufacturing) that employs a component support fixture that provides permanent or temporary support for components during subsequent processing in a solderless process for electrically connecting the components to circuits. The component support fixture provides oversized compartments for housing the components which may have varying sizes. The compartments are provided with vent holes or apertures for venting air or excess glue as the component support is pressed against the components during manufacture.

Abstract: The current document is directed to gaming dice, including physical dice and virtual dice represented on an electronic display or viewing screen. Certain of the currently disclosed gaming dice have approximately ovoid, prolate spheroid, or ellipsoid shapes that are modified to include planar surfaces. Other of the disclosed gaming dice have angular shapes, including cubes, tetrahedrons, octahedrons, and other regular shapes that are modified to provide nonuniform probabilities of position landings.

Abstract: An Occam process (solderless manufacturing) that employs a component support fixture that provides permanent or temporary support for components during subsequent processing in a solderless process for electrically connecting the components to circuits. The component support fixture provides oversized compartments for housing the components which may have varying sizes. The compartments are provided with vent holes or apertures for venting air or excess glue as the component support is pressed against the components during manufacture.

Abstract: The present invention provides an electronic assembly 400 and a method for its manufacture 800, 900, 1000 1200, 1400, 1500, 1600, 1700. The assembly 400 uses no solder. Components 406, or component packages 402, 802, 804, 806 with I/O leads 412 are placed 800 onto a planar substrate 808. The assembly is encapsulated 900 with electrically insulating material 908 with vias 420, 1002 formed or drilled 1000 through the substrate 808 to the components' leads 412. Then the assembly is plated 1200 and the encapsulation and drilling process 1500 repeated to build up desired layers 422, 1502, 1702. Assemblies may be mated 1800. Within the mated assemblies, items may be inserted including pins 2202a, 2202b, and 2202c, mezzanine interconnection devices 2204, heat spreaders 2402, and combination heat spreaders and heat sinks 2602. Edge card connectors 2802 may be attached to the mated assemblies.

Abstract: A method (10) for manufacturing a monolithic molded electronic assembly (12). A mold (14) having first and second mold potions (14a-b) that mate to form an interior chamber (16) is provided. The mold has an injection port (22) and channel (24) connecting into the chamber. Electronic parts (30) having electronic contacts (32) are populated onto the second mold portion, to be substantially contained in the chamber. The mold potions are mated together and a liquid insulating molding material (36) is injected through the injection port channel to fill the chamber. The molding material is hardened to a solid, thereby embedding the electronic parts in the molding material as a monolithic sub-assembly (40). The monolithic sub-assembly is removed from the mold and one or more solderless conductive circuits (50) are applied to the electronic contacts of the electronic parts, thereby providing the electronic assembly.

Abstract: Disclosed are IC package structures having stair stepped layers and which have no plated vias. Such structures can be fabricated either as discrete packages or as strips such as might be beneficial in for use with memory devices wherein critical or high speed signals can be routed along the length of the multi-chip strip package without having to have the signals ascend and descend from the interconnection substrate on which the assembly is mounted to the IC package termination and back as the signal transmits between devices.

Abstract: Disclosed are IC package structures having stair stepped layers and which have no plated vias. Such structures can be fabricated either as discrete packages or as strips such as might be beneficial in for use with memory devices wherein critical or high speed signals can be routed along the length of the multi-chip strip package without having to have the signals ascend and descend from the interconnection substrate on which the assembly is mounted to the IC package termination and back as the signal transmits between devices.

Abstract: The dielectric constant and loss tangent of a transmission structure is lowered by sandwiching a conductor between two dielectric structures one or both of which have a series of openings. The conductor is formed so that the conductor is formed across each opening of each dielectric structure. The dielectric structures provide structural support while exposing a significant portion of the conductor to air, thereby forming a transmission structure with an largely air-dielectric.

Abstract: The dielectric constant and tangent of a transmission structure is lowered by sandwiching a conductor between two dielectric structures one or both of which have a series of openings. The conductor is formed so that the conductor is formed across each opening of each dielectric structure. The dielectric structures provide structural support while exposing a significant portion of the conductor to air, thereby forming a transmission structure with an largely air-dielectric.