Patents by Inventor Joseph Cibere
Joseph Cibere has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9941144Abstract: Apparatus, systems, and processes for substrate breakage detection in a thermal processing system are provided. In one example implementation, a process can include: accessing data indicative of a plurality of temperature measurements for a substrate, the plurality of measurements obtained during a cool down period of a thermal process; estimating one or more metrics associated with a cooling model based at least in part on the data indicative of the plurality of temperature measurements; and determining a breakage detection signal based at least in part on the one or more metrics associated with the cooling model. The breakage detection signal is indicative of whether the substrate has broken during thermal processing.Type: GrantFiled: December 13, 2016Date of Patent: April 10, 2018Assignee: Mattson Technology, Inc.Inventor: Joseph Cibere
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Publication number: 20170194178Abstract: Systems and methods for substrate support in a millisecond anneal system are provided. In one example implementation, a millisecond anneal system includes a processing chamber having a wafer support plate. A plurality of support pins can extend from the wafer support plate. The support pins can be configured to support a substrate. At least one of the support pins can have a spherical surface profile to accommodate a varying angle of a substrate surface normal at the point of contact with the substrate. Other example aspects of the present disclosure are directed to methods for estimating, for instance, local contact stress at the point of contact with the support pin.Type: ApplicationFiled: December 14, 2016Publication date: July 6, 2017Inventor: Joseph Cibere
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Publication number: 20170196046Abstract: Systems and methods for reducing contamination of one or more arc lamps are provided. One example implementation is directed to a millisecond anneal system. The millisecond anneal system includes a processing chamber for thermally treating a substrate using a millisecond anneal process. The system further includes one or more arc lamps. Each of the one or more arc lamps is coupled to a water loop for circulating water through the arc lamp during operation of the arc lamp. The system includes a reagent injection source configured to introduce a reagent, such as nitrogen gas, into water circulating through the arc lamp during operation of the arc lamp.Type: ApplicationFiled: December 15, 2016Publication date: July 6, 2017Inventors: Rolf Bremensdorfer, Dave Camm, Pete Lembesis, Joseph Cibere
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Publication number: 20170194177Abstract: Apparatus, systems, and processes for substrate breakage detection in a thermal processing system are provided. In one example implementation, a process can include: accessing data indicative of a plurality of temperature measurements for a substrate, the plurality of measurements obtained during a cool down period of a thermal process; estimating one or more metrics associated with a cooling model based at least in part on the data indicative of the plurality of temperature measurements; and determining a breakage detection signal based at least in part on the one or more metrics associated with the cooling model. The breakage detection signal is indicative of whether the substrate has broken during thermal processing.Type: ApplicationFiled: December 13, 2016Publication date: July 6, 2017Inventor: Joseph Cibere
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Publication number: 20170191759Abstract: Systems and methods for gas flow in a thermal processing system are provided. In some example implementations a gas flow pattern inside the process chamber of a millisecond anneal system can be improved by implementing one or more of the following: (1) altering the direction, size, position, shape and arrangement of the gas injection inlet nozzles, or a combination hereof; (2) use of gas channels in a wafer plane plate connecting the upper chamber with the lower chamber of a millisecond anneal system; and/or (3) decreasing the effective volume of the processing chamber using a liner plate disposed above the semiconductor substrate.Type: ApplicationFiled: December 21, 2016Publication date: July 6, 2017Inventors: Christian Pfahler, Joseph Cibere
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Patent number: 9627244Abstract: Apparatuses and methods for supporting a workpiece such as a semiconductor wafer. A support system is configured to support the workpiece while allowing thermally-induced motion of the workpiece, which may include thermal bowing or thermal bending. The system may include a support member having a moveable engagement portion engageable with the workpiece, the engagement portion being moveable to allow the thermally-induced motion of the workpiece while supporting the workpiece. The moveable engagement portion may include a plurality of moveable engagement portions of a plurality of respective support members, which may be resiliently engageable with the workpiece. The support members may include flexible support members each having an unconstrained portion and a constrained portion, and the moveable engagement portions may include the unconstrained portions.Type: GrantFiled: December 19, 2003Date of Patent: April 18, 2017Assignee: Mattson Technology, Inc.Inventors: David Malcolm Camm, Guillaume Sempere, Ljubomir Kaludjercic, Gregory Stuart, Mladen Bumbulovic, Tim Tran, Sergiy Dets, Tony Komasa, Marc Rudolph, Joseph Cibere
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Patent number: 9279727Abstract: A method and system for determining a shape of an irradiance pulse to which a semiconductor wafer is to be exposed during a thermal cycle are disclosed. The method includes receiving, with a processor circuit, thermal cycle parameters specifying requirements of the thermal cycle, and determining, with the processor circuit, a shape of a heating portion of the irradiance pulse. Determining includes optimizing at least one parameter of a flux profile model of the heating portion of the irradiance pulse to satisfy the requirements while minimizing frequency-domain energy spectral densities of the flux profile model at resonant frequencies of the wafer, to minimize vibration of the wafer at the resonant frequencies when the wafer is exposed to the irradiance pulse.Type: GrantFiled: October 14, 2011Date of Patent: March 8, 2016Assignee: Mattson Technology, Inc.Inventors: Joseph Cibere, David Malcolm Camm
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Patent number: 9070590Abstract: Methods and apparatus for heat-treating a workpiece are disclosed. An illustrative method includes measuring deformation of a workpiece during heat-treating thereof, and taking an action in relation to the heat-treating of the workpiece, in response to the measuring of the deformation of the workpiece. The workpiece may include a semiconductor wafer. Taking an action may include applying a deformation correction to a temperature or reflectivity measurement of the wafer during thermal processing, or may include modifying the heat-treating of the wafer, for example.Type: GrantFiled: May 15, 2009Date of Patent: June 30, 2015Assignee: Mattson Technology, Inc.Inventors: David Malcolm Camm, Joseph Cibere, Greg Stuart, Steve McCoy
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Publication number: 20130306871Abstract: A method and system for determining a shape of an irradiance pulse to which a semiconductor wafer is to be exposed during a thermal cycle are disclosed. The method includes receiving, with a processor circuit, thermal cycle parameters specifying requirements of the thermal cycle, and determining, with the processor circuit, a shape of a heating portion of the irradiance pulse. Determining includes optimizing at least one parameter of a flux profile model of the heating portion of the irradiance pulse to satisfy the requirements while minimizing frequency-domain energy spectral densities of the flux profile model at resonant frequencies of the wafer, to minimize vibration of the wafer at the resonant frequencies when the wafer is exposed to the irradiance pulse.Type: ApplicationFiled: October 14, 2011Publication date: November 21, 2013Applicant: Mattson Technology, Inc.Inventors: Joseph Cibere, David Malcolm Camm
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Patent number: 8454356Abstract: An apparatus for supporting a workpiece during heat-treating includes a support plate having a non-planar upper surface, and a support system. The support system is configured to support the workpiece above the support plate during heat-treating of the workpiece, such that a lower surface of an initial shape of the workpiece is supported at a non-uniform spacing above the non-planar upper surface of the support plate, said non-uniform spacing including an edge gap beneath an outer perimeter of the workpiece, and a central gap at a central axis of the workpiece.Type: GrantFiled: November 15, 2007Date of Patent: June 4, 2013Assignee: Mattson Technology, Inc.Inventors: David Malcolm Camm, Joseph Cibere, Mladen Bumbulovic
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Patent number: 8434341Abstract: An apparatus for supporting a semiconductor workpiece includes a heating system configured to cause thermally-induced motion of the semiconductor workpiece by heating a surface of the workpiece relative to a bulk of the workpiece. The thermally-induced motion includes vertical motion of an outer edge region of the workpiece and a center of the workpiece relative to each other. The apparatus further includes a support system configured to allow the thermally-induced motion including the vertical motion of the outer edge region of the workpiece and the center of the workpiece relative to each other while supporting the workpiece.Type: GrantFiled: January 27, 2012Date of Patent: May 7, 2013Assignee: Mattson Technology, Inc.Inventors: David Malcolm Camm, Guillaume Sempere, Ljubomir Kaludjercic, Gregory Stuart, Mladen Bumbulovic, Tim Tran, Sergiy Dets, Tony Komasa, Marc Rudolph, Joseph Cibere
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Publication number: 20120118867Abstract: An apparatus for supporting a semiconductor workpiece includes a heating system configured to cause thermally-induced motion of the semiconductor workpiece by heating a surface of the workpiece relative to a bulk of the workpiece. The thermally-induced motion includes vertical motion of an outer edge region of the workpiece and a center of the workpiece relative to each other. The apparatus further includes a support system configured to allow the thermally-induced motion including the vertical motion of the outer edge region of the workpiece and the center of the workpiece relative to each other while supporting the workpiece.Type: ApplicationFiled: January 27, 2012Publication date: May 17, 2012Applicant: Mattson Technology Canada, Inc.Inventors: David Malcolm Camm, Guillaume Sempere, Ljubomir Kaludjercic, Gregory Stuart, Mladen Bumbulovic, Tim Tran, Sergiy Dets, Tony Komasa, Marc Rudolph, Joseph Cibere
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Publication number: 20110177624Abstract: Methods and apparatus for heat-treating a workpiece are disclosed. An illustrative method includes measuring deformation of a workpiece during heat-treating thereof, and taking an action in relation to the heat-treating of the workpiece, in response to the measuring of the deformation of the workpiece. The workpiece may include a semiconductor wafer. Taking an action may include applying a deformation correction to a temperature or reflectivity measurement of the wafer during thermal processing, or may include modifying the heat-treating of the wafer, for example.Type: ApplicationFiled: May 15, 2009Publication date: July 21, 2011Inventors: David Malcolm Camm, Joseph Cibere, Greg Stuart, Steve McCoy
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Patent number: 7501607Abstract: Apparatuses and methods for suppressing thermally induced motion of a workpiece. An apparatus includes a workpiece heating system configured to thermally induce motion of a workpiece, and further includes a damping member spaced apart from the workpiece and configured to apply a damping force to dampen the motion of the workpiece. The damping member may be spaced apart from a rest position of the workpiece by a distance sufficiently small that gas pressure between the damping member and the workpiece opposes the motion of the workpiece. The distance is preferably adjustable.Type: GrantFiled: December 20, 2004Date of Patent: March 10, 2009Assignee: Mattson Technology Canada, Inc.Inventors: David Malcolm Camm, Mladen Bumbulovic, Joseph Cibere, J. Kiefer Elliott, Steve McCoy, Greg Stuart
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Publication number: 20080157452Abstract: An apparatus for supporting a workpiece during heat-treating includes a support plate having a non-planar upper surface, and a support system. The support system is configured to support the workpiece above the support plate during heat-treating of the workpiece, such that a lower surface of an initial shape of the workpiece is supported at a non-uniform spacing above the non-planar upper surface of the support plate, said non-uniform spacing including an edge gap beneath an outer perimeter of the workpiece, and a central gap at a central axis of the workpiece.Type: ApplicationFiled: November 15, 2007Publication date: July 3, 2008Applicant: Mattson Technology Canada, Inc.Inventors: David Malcolm Camm, Joseph Cibere, Mladen Bumbulovic
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Publication number: 20050133167Abstract: Apparatuses and methods for suppressing thermally induced motion of a workpiece. An apparatus includes a workpiece heating system configured to thermally induce motion of a workpiece, and further includes a damping member spaced apart from the workpiece and configured to apply a damping force to dampen the motion of the workpiece. The damping member may be spaced apart from a rest position of the workpiece by a distance sufficiently small that gas pressure between the damping member and the workpiece opposes the motion of the workpiece. The distance is preferably adjustable.Type: ApplicationFiled: December 20, 2004Publication date: June 23, 2005Inventors: David Camm, Mladen Bumbulovic, Joseph Cibere, J. Elliott, Steve McCoy, Greg Stuart
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Publication number: 20040178553Abstract: Apparatuses and methods for supporting a workpiece such as a semiconductor wafer. A support system is configured to support the workpiece while allowing thermally-induced motion of the workpiece, which may include thermal bowing or thermal bending. The system may include a support member having a moveable engagement portion engageable with the workpiece, the engagement portion being moveable to allow the thermally-induced motion of the workpiece while supporting the workpiece. The moveable engagement portion may include a plurality of moveable engagement portions of a plurality of respective support members, which may be resiliently engageable with the workpiece. The support members may include flexible support members each having an unconstrained portion and a constrained portion, and the moveable engagement portions may include the unconstrained portions.Type: ApplicationFiled: December 19, 2003Publication date: September 16, 2004Inventors: David Malcolm Camm, Guillaume Sempere, Ljubomir Kaludjercic, Gregory Stuart, Mladen Bumbulovic, Tim Tran, Sergiy Dets, Tony Komasa, Marc Rudolph, Joseph Cibere