Patents by Inventor Joseph D. Cargioli

Joseph D. Cargioli has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of transfer lamination of copper thin sheets and films
    Patent number: 4455181
    Abstract: A copper-clad laminate having special utility in the production of high resolution printed circuit patterns by either subtractive or semi-additive processing is made by vapor depositing a film of zinc on a copper film on a silica-coated aluminum carrier sheet, vapor depositing a silica film on the resulting zinc-copper foil, bonding the resulting body to a substrate and then stripping the silica-coated aluminum carrier sheet from the copper-clad laminate.
    Type: Grant
    Filed: February 22, 1983
    Date of Patent: June 19, 1984
    Assignee: General Electric Company
    Inventors: Eric Lifshin, Joseph D. Cargioli, Stephen J. Schroder, Joe Wong
  • Transfer lamination of copper thin sheets and films, method and product
    Patent number: 4383003
    Abstract: A copper-clad laminate having special utility in the production of high resolution printed circuit patterns by either subtractive or semi-additive processing is made by vapor depositing a film of zinc on a copper film on a silica-coated aluminum carrier sheet, vapor depositing a silica film on the resulting zinc-copper foil, bonding the resulting body to a substrate and then stripping the silica-coated aluminum carrier sheet from the copper-clad laminate.
    Type: Grant
    Filed: September 22, 1980
    Date of Patent: May 10, 1983
    Assignee: General Electric Company
    Inventors: Eric Lifshin, Joseph D. Cargioli, Stephen J. Schroder, Joe Wong
  • Transfer lamination of vapor deposited foils, method and product
    Patent number: 4357395
    Abstract: A copper-clad laminate having special utility in printed circuit board production because of its extremely smooth and virtually pinhole-free surface is made by vapor depositing a copper film on a layer of silica on an aluminum carrier sheet, electrodepositing a layer of copper on the film to form a foil, bonding the foil to a substrate and finally stripping the foil and substrate laminate from the silica-coated carrier sheet.
    Type: Grant
    Filed: August 22, 1980
    Date of Patent: November 2, 1982
    Assignee: General Electric Company
    Inventors: Eric Lifshin, Joseph D. Cargioli, Stephen J. Schroder, Joe Wong