Patents by Inventor Joseph F. Lachowski

Joseph F. Lachowski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of enhancing copper electroplating
    Patent number: 11686006
    Abstract: Crystal plane orientation enrichment compounds are applied to copper to modify copper grain orientation distribution to the favorable crystal plain orientation to enhance copper electroplating. Electroplating copper on the modified copper enables faster and selective electroplating.
    Type: Grant
    Filed: April 1, 2022
    Date of Patent: June 27, 2023
    Assignee: ROHM AND HAAS ELECTRONIC MATERIALS LLC
    Inventors: Alejo M. Lifschitz Arribio, Jonathan D. Prange, Michael K. Gallagher, Alexander Zielinski, Luis A. Gomez, Joseph F. Lachowski
  • Method of enhancing copper electroplating
    Patent number: 11512406
    Abstract: Crystal plane orientation enrichment compounds are applied to copper to modify copper grain orientation distribution to the favorable crystal plain orientation to enhance copper electroplating. Electroplating copper on the modified copper enables faster and selective electroplating.
    Type: Grant
    Filed: September 21, 2020
    Date of Patent: November 29, 2022
    Assignee: ROHM AND HAAS ELECTRONIC MATERIALS LLC
    Inventors: Alejo M. Lifschitz Arribio, Jonathan D. Prange, Michael K. Gallagher, Alexander Zielinski, Luis A. Gomez, Joseph F. Lachowski
  • METHOD OF ENHANCING COPPER ELECTROPLATING
    Publication number: 20220228282
    Abstract: Crystal plane orientation enrichment compounds are applied to copper to modify copper grain orientation distribution to the favorable crystal plain orientation to enhance copper electroplating. Electroplating copper on the modified copper enables faster and selective electroplating.
    Type: Application
    Filed: April 1, 2022
    Publication date: July 21, 2022
    Inventors: Alejo M. Lifschitz Arribio, Jonathan D. Prange, Michael K. Gallagher, Alexander Zielinski, Luis A. Gomez, Joseph F. Lachowski
  • PHOTORESIST RESOLUTION CAPABILITIES BY COPPER ELECTROPLATING ANISOTROPICALLY
    Publication number: 20220213610
    Abstract: Features of substrates are copper electroplated by a method which involves copper electroplating selectively deposited seed layers or seed layers of photoresist defined features with a copper electroplating composition containing select suppressor compounds and select leveler compounds which enable anisotropic plating. Optionally, the seed layers can be treated with an aqueous solution of sulfur containing accelerators prior to copper electroplating.
    Type: Application
    Filed: December 29, 2021
    Publication date: July 7, 2022
    Inventors: Alejo M. Lifschitz Arribio, Alexander Zielinski, Samer Hammoodi, Joseph F. Lachowski, Michael K. Gallagher, Curtis Williamson, Jonathan D. Prange
  • METHOD OF ENHANCING COPPER ELECTROPLATING
    Publication number: 20210115581
    Abstract: Crystal plane orientation enrichment compounds are applied to copper to modify copper grain orientation distribution to the favorable crystal plain orientation to enhance copper electroplating. Electroplating copper on the modified copper enables faster and selective electroplating.
    Type: Application
    Filed: September 21, 2020
    Publication date: April 22, 2021
    Inventors: Alejo M. Lifschitz Arribio, Jonathan D. Prange, Michael K. Gallagher, Alexander Zielinski, Luis A. Gomez, Joseph F. Lachowski
  • Photoresists comprising novolak resin blends
    Patent number: 10976659
    Abstract: Photoresist compositions are provided comprising a radiation sensitive component and at least two distinct novolak resins. In one aspect, photoresists of the invention exhibit notably high dissolution rates, such as in excess of 800 angstroms per second in aqueous developer solution. In another aspect, photoresists of the invention can exhibit good photospeeds, such as 100 mJ/cm2 or less.
    Type: Grant
    Filed: January 28, 2008
    Date of Patent: April 13, 2021
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Jeffrey M. Calvert, Joseph F. Lachowski
  • Adhesion promoter
    Patent number: 9153357
    Abstract: Compositions useful for improving the adhesion of coating compositions, such as dielectric film-forming compositions, include a hydrolyzed amino-alkoxysilane having a protected amino moiety. These compositions are useful in methods of improving the adhesion of coating compositions to a substrate, such as an electronic device substrate.
    Type: Grant
    Filed: March 2, 2015
    Date of Patent: October 6, 2015
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Michael K. Gallagher, Joseph F. Lachowski, Gregory P. Prokopowicz, Zidong Wang
  • ADHESION PROMOTER
    Publication number: 20150279511
    Abstract: Compositions useful for improving the adhesion of coating compositions, such as dielectric film-forming compositions, include a hydrolyzed amino-alkoxysilane having a protected amino moiety. These compositions are useful in methods of improving the adhesion of coating compositions to a substrate, such as an electronic device substrate.
    Type: Application
    Filed: March 27, 2014
    Publication date: October 1, 2015
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Michael K. GALLAGHER, Joseph F. LACHOWSKI, Gregory P. PROKOPOWICZ, Zidong WANG
  • ADHESION PROMOTER
    Publication number: 20150279512
    Abstract: Compositions useful for improving the adhesion of coating compositions, such as dielectric film-forming compositions, include a hydrolyzed amino-alkoxysilane having a protected amino moiety. These compositions are useful in methods of improving the adhesion of coating compositions to a substrate, such as an electronic device substrate.
    Type: Application
    Filed: March 2, 2015
    Publication date: October 1, 2015
    Inventors: Michael K. GALLAGHER, Joseph F. LACHOWSKI, Gregory P. PROKOPOWICZ, Zidong WANG
  • Adhesion promoter
    Patent number: 9136037
    Abstract: Compositions useful for improving the adhesion of coating compositions, such as dielectric film-forming compositions, include a hydrolyzed amino-alkoxysilane having a protected amino moiety. These compositions are useful in methods of improving the adhesion of coating compositions to a substrate, such as an electronic device substrate.
    Type: Grant
    Filed: March 27, 2014
    Date of Patent: September 15, 2015
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Michael K. Gallagher, Joseph F. Lachowski, Gregory P. Prokopowicz, Zidong Wang
  • Stripper for electronics
    Patent number: 7723280
    Abstract: Compositions and methods useful for the removal of polymeric material from substrates, such as electronic devices are provided. These compositions and methods are particularly suitable for removing polymer residues from electronic devices following plasma etch processes.
    Type: Grant
    Filed: July 28, 2006
    Date of Patent: May 25, 2010
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Robert L. Brainard, Robert L. Auger, Joseph F. Lachowski
  • Photoresists comprising novolak resin blends
    Publication number: 20080182204
    Abstract: Photoresist compositions are provided comprising a radiation sensitive component and at least two distinct novolak resins. In one aspect, photoresists of the invention exhibit notably high dissolution rates, such as in excess of 800 angstroms per second in aqueous developer solution. In another aspect, photoresists of the invention can exhibit good photospeeds, such as 100 mJ/cm2 or less.
    Type: Application
    Filed: January 28, 2008
    Publication date: July 31, 2008
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Jeffrey M. Calvert, Joseph F. Lachowski
  • Method of reducing defects
    Patent number: 6670107
    Abstract: Disclosed are methods for the reduction of defects during the manufacture of electronic devices. Also disclosed are electronic devices having reduced numbers of defects.
    Type: Grant
    Filed: February 26, 2001
    Date of Patent: December 30, 2003
    Assignee: Shipley Company, L.L.C.
    Inventor: Joseph F. Lachowski
  • Method of reducing defects
    Publication number: 20020001780
    Abstract: Disclosed are methods for the reduction of defects during the manufacture of electronic devices. Also disclosed are electronic devices having reduced numbers of defects.
    Type: Application
    Filed: February 26, 2001
    Publication date: January 3, 2002
    Applicant: Shipley Company, L.L.C.
    Inventor: Joseph F. Lachowski