Abstract: In accordance with this invention, integrated circuits are manufactured using parallel processing to manufacture separately selected parts of finished integrated circuits. Upon completion of the parts, the parts are joined together to form the completed integrated circuit. For example, a semiconductor wafer containing active and passive semiconductor regions is fabricated through the first layer of insulation and first conductive contacts. Separately, an interconnect structure is fabricated on a separate fabrication line to include all the layers of interconnects required to form a completed integrated circuit when joined to the wafer. The interconnect structure is joined to the wafer to form the complete integrated device. The interconnect structure can be fabricated to exclude from the integrated circuit those portions of the wafer which have been determined by test to be defective.